| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 01/21/2010 | WO2009002385A3 Acid copper electroplating bath composition |
| 01/20/2010 | CN101630633A Substrate proximity processing structures and methods for using and making the same |
| 01/20/2010 | CN100582318C Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations |
| 01/19/2010 | CA2451600C Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 01/14/2010 | US20100006445 Electroplating method and apparatus |
| 01/13/2010 | CN201381376Y Complete plant used for recovering metal ion in electroplating cleaning liquid |
| 01/13/2010 | CN201381375Y Material falling prevention alarm system for plating lines or cleaning lines |
| 01/13/2010 | CN201381373Y Conductive roller wringing roller synchronous device of Chrome-plated wire |
| 01/13/2010 | CN100580142C Method for electrically plating Ti-Cu-Zn ternary alloy meeting three-prevention demand |
| 01/12/2010 | US7645364 Apparatus and method for plating semiconductor wafers |
| 01/07/2010 | WO2009055116A3 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating |
| 01/07/2010 | US20100000872 Electroplating method |
| 01/06/2010 | EP2141125A1 Chromium hydroxide, method for producing the same, trivalent chromium-containing solution using the same, and chromium plating method |
| 01/05/2010 | US7641776 System and method for increasing yield from semiconductor wafer electroplating |
| 12/31/2009 | US20090321265 Methods and apparatus for controlling catalytic processes, including the deposition of carbon based particles |
| 12/31/2009 | US20090321250 Apparatus for Plating Semiconductor Wafers |
| 12/31/2009 | DE102004021260B4 Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren Methods for increased bath life in a Einzelbadplattierungsverfahren |
| 12/31/2009 | DE10057707B4 Verfahren zum Verhindern von Streuströmen in peripheren Anlagenteilen in einer Elektrolyse A method for preventing stray currents in peripheral parts of the plant in an electrolysis |
| 12/30/2009 | CN101613876A Electroplating parameter error detecting system of circuit board and method |
| 12/30/2009 | CN101613875A Electroplating correction system of circuit board and method |
| 12/23/2009 | WO2009152915A2 Copper electroplating method and device for carrying out a method of this type |
| 12/23/2009 | CN101608336A Method for realizing resource recovery of electroplating sludge |
| 12/23/2009 | CN100572613C Feedback controlling system for producing nanometer gap electrode |
| 12/17/2009 | WO2009016291A3 Unit and method for the electrolytic tinning of steel bands |
| 12/17/2009 | US20090308754 Fabrication of freestanding micro hollow tubes by template-free localized electrochemical deposition |
| 12/17/2009 | US20090308753 Methods for controlling silica deposition onto carbon nanotube surfaces |
| 12/17/2009 | US20090308144 Method and device for pretreating a fuel rod cladding tube for material tests, test body and method for testing corrosion characteristics |
| 12/16/2009 | EP2133448A1 Production method and device of surface roughened copper plate, and surface roughened copper plate |
| 12/16/2009 | CN201362751Y Automatic control complement device |
| 12/16/2009 | CN201362750Y Electroplate liquid filter |
| 12/10/2009 | WO2009146773A1 Apparatus and method for providing electrical contact for planar material in straight-through installations |
| 12/10/2009 | US20090301888 Method of determining operating condition for rotary surface treating apparatus |
| 12/09/2009 | EP2130952A1 Metal part and method of manufacturing metal part |
| 12/09/2009 | CN101597785A Device for observing nano material grown by electrochemistry method and control method thereof |
| 12/09/2009 | CN100567588C Device for automatical separation treatment of heavy metal in electroplating discharging liquid |
| 12/09/2009 | CN100567587C Zn-Ni-Al2O3 nano composite deposit and its preparation process |
| 12/08/2009 | US7628898 Method and system for idle state operation |
| 12/03/2009 | DE102009023124A1 Verfahren zur galvanischen Kupferbeschichtung und Vorrichtung zur Durchführung eines solchen Verfahrens Process for the galvanic copper plating and apparatus for performing such a method |
| 12/02/2009 | CN100564612C Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 12/02/2009 | CN100564610C Process for electrodeposition preparation of orientated short fiber reinforced metal -base composite materials |
| 11/26/2009 | US20090291573 Probe card assembly and kit, and methods of making same |
| 11/26/2009 | DE10143076B4 Verfahren zur Herstellung eines Kupfergalvanisierungsmaterials und nach dem Verfahren erhältliches Kupfergalvanisierungsmaterial A method for producing a Kupfergalvanisierungsmaterials and obtainable by the method Kupfergalvanisierungsmaterial |
| 11/25/2009 | EP2123799A2 Method of replenishing indium ions in indium electroplating compositions |
| 11/19/2009 | DE19743933B4 Verfahren zur Oberflächenbehandlung fester Körper, insbesondere Kraftfahrzeug-Karosserien A process for the surface treatment of solid bodies, in particular motor vehicle bodies |
| 11/18/2009 | CN201347467Y Device for recovering valuable metal in electroplating wastewater and regenerating ion exchange resin |
| 11/18/2009 | CN201347466Y Electroplating exhaust purification processing device |
| 11/18/2009 | CN101580957A Method and device for purifying and recycling chromium electroplating solution and waste solution thereof |
| 11/18/2009 | CN101580956A Method and device for gold finger galvanizing cylinder to automatically input current |
| 11/17/2009 | US7618525 Method for electrochemical fabrication |
| 11/11/2009 | CN201343580Y Automatic nickel ion equilibrator |
| 11/11/2009 | CN101575722A Apparatus for electrodepositing metallic film on band plate |
| 11/10/2009 | US7616016 Probe card assembly and kit |
| 11/05/2009 | US20090272651 Method for producing high-purity nickel |
| 11/05/2009 | US20090272466 Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper |
| 10/29/2009 | DE19956666B4 Verfahren zur kontinuierlichen Abscheidung blendfreier Metallüberzüge auf einer metallischen Oberfläche Process for the continuous deposition glare metal coatings on a metallic surface |
| 10/28/2009 | EP1323186B1 Plating system with remote secondary anode for semiconductor manufacturing |
| 10/28/2009 | CN101565849A Method for adding chromic anhydride automatically in chrome plating process and equipment thereof |
| 10/15/2009 | WO2009124410A1 Electroplating method |
| 10/15/2009 | WO2009040250A3 Power control device of a power network of an electrochemical coating facility |
| 10/15/2009 | US20090255819 Electroplating apparatus |
| 10/14/2009 | CN101555618A Method and device for plating bath pollution-free recovery for nickel screen electroforming |
| 10/14/2009 | CN100550309C Method of fabricating semiconductor device, and plating apparatus |
| 10/08/2009 | WO2001004928A3 Improved apparatus and method for plating wafers, substrates and other articles |
| 10/08/2009 | US20090250350 Detection device and method of anodic oxide film |
| 10/08/2009 | DE112007002936T5 Plattierelement und Verfahren zum Herstellen desselben Of the same plating element and method for producing |
| 10/07/2009 | CN201321502Y Decoppering resin filter pocket |
| 10/07/2009 | CN101553603A Galvanic method with analysis of the electrolyte bath by solid phase extraction |
| 10/07/2009 | CN101550583A Anti-stock falling alarming method of plating line or cleaning line |
| 10/01/2009 | US20090244552 Method for Forming and Measuring the Thickness of a Coating |
| 10/01/2009 | US20090242413 Electroplating Head and Method for Operating the Same |
| 10/01/2009 | US20090242409 Plating method, semiconductor device manufacturing method and plate processing system |
| 09/30/2009 | EP2105521A1 Flexible cache for galvanic support, implementation support and method |
| 09/30/2009 | CN101545131A Method and device for realizing on-line recycle of electroplating rinse water |
| 09/30/2009 | CN100545323C Method for recovering copper ion from copper-plating cleaning liquor |
| 09/24/2009 | US20090236228 Anodizing method and apparatus |
| 09/23/2009 | EP2102389A1 Method fr the galvanic coating of workpieces in an electrolyte bath containing zinc |
| 09/23/2009 | CN101537521A Brazing method of aluminum electromagnetic wire and brass |
| 09/17/2009 | US20090229986 Continuous copper electroplating method |
| 09/17/2009 | US20090229985 Semiconductor device production method and semiconductor production apparatus |
| 09/16/2009 | CN201309978Y Liquid treatment device |
| 09/16/2009 | CN101532160A Continuous copper electroplating method |
| 09/15/2009 | US7588674 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 09/11/2009 | WO2009075885A3 Method and apparatus for plating solution analysis and control |
| 09/11/2009 | WO2009016292A3 Unit and method for the electrolytic tinning of steel bands, using a soluble anode |
| 09/11/2009 | WO2005118918A3 Efficient analysis of organic additives in an acid copper plating bath |
| 09/10/2009 | US20090223827 Pulse Reverse Electrolysis of Acidic Copper Electroplating Solutions |
| 09/09/2009 | CN101525763A Environment friendly plating automatic bottom processing equipment |
| 09/09/2009 | CN100539034C Substrate proximity processing structures and methods for using and making the same |
| 09/03/2009 | WO2009106269A1 Coating method for a work piece |
| 09/03/2009 | US20090218231 Plating apparatus |
| 09/03/2009 | US20090218229 Coating process and apparatus with improved resistance to bacteria |
| 09/02/2009 | CN201301356Y Plating tank circulation device in electroplating production equipment |
| 09/02/2009 | CN101522958A Plating member and process for producing the plating member |
| 09/01/2009 | US7582199 Plating method |
| 08/27/2009 | DE112007002468T5 Platierungsvorrichtung Platierungsvorrichtung |
| 08/26/2009 | CN201296800Y Electroplating system and inflation device |
| 08/26/2009 | CN101517132A Plating apparatus |
| 08/26/2009 | CN100532656C Method for recovering copper and nickel nitrate by electrolysis of electroplating waste water |
| 08/25/2009 | US7579275 Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device |
| 08/25/2009 | US7579269 Microelectronic spring contact elements |