Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
03/2014
03/27/2014WO2014044851A1 Prepolymer impact resistor for crack-resistant adhesives for windmills
03/27/2014US20140088289 Bisphenol a (bpa) free epoxy resins
03/27/2014DE102012018630A1 Hitzeaktivierbares strukturelles Haftklebeband Heat-activated structural adhesive tape
03/26/2014EP2710049A1 Novel structural adhesive and use thereof
03/26/2014CN103687883A Curing agent for moisture-curing compositions
03/26/2014CN103680681A Electric connector
03/26/2014CN103666364A Organic insulating binder for metal soft-magnetic composite material and method for preparing metal soft-magnetic composite material
03/26/2014CN103666363A Conductive adhesive containing conductive macromolecules and preparation method thereof
03/26/2014CN103666359A Adhesive material and fabricating method of substrate structure having heat-shielding ability
03/26/2014CN103666357A Normal-temperature solidifiable single-component liquid sealing material
03/26/2014CN103666356A Thermosetting conductive silver adhesive
03/26/2014CN103666355A Conductive silver adhesive
03/26/2014CN103666354A Epoxy resin adhesive and preparation method thereof
03/26/2014CN103666353A Epoxy resin adhesive
03/26/2014CN103666352A Special-purpose adhesive for beer and beverage bottle cap gasket and preparation method thereof
03/26/2014CN103666330A Liquid rubber synthesizing method and preparation method for adhesive by using liquid rubber
03/26/2014CN103666329A Modified nitrile rubber adhesive
03/26/2014CN103666319A Marine climate resistant epoxy conductive adhesive composition
03/26/2014CN103666318A Self-repair conductive adhesive and preparation method thereof
03/26/2014CN103666317A Double-microcapsule-component conductive adhesive
03/26/2014CN103666316A High-temperature-repairable conductive adhesive and preparation method thereof
03/26/2014CN103666297A Anisotropic conductive film and semiconductor device employing same
03/26/2014CN103665774A High-strength adhesive as well as preparation method and application thereof
03/26/2014CN103665327A Prepolymer containing m-xylene diamine and preparation method of prepolymer
03/26/2014CN103663407A Carbon paper laminated composite thermal insulating lining
03/26/2014CN103660437A Nanometer impermeable boiling bag, and nano-binder and making method thereof
03/26/2014CN103013410B Binding agent with high fire resistance
03/26/2014CN102977830B Epoxy resin adhesive and preparation method and applications thereof
03/26/2014CN102876274B Glue for cutting process of solar cell silicon wafers
03/26/2014CN102633988B Modified lauryl amine hardener, manufacturing method and application of modified lauryl amine hardener
03/26/2014CN102516500B Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
03/26/2014CN102167963B Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device
03/26/2014CN101845286B Photocurable adhesive composition, polarizing plate and a process for producing the same, optical member and liquid crystal display device
03/26/2014CN101717609B Anticorrosion glue tape for pipeline and preparation process
03/20/2014WO2014042385A1 Photocurable adhesive composition
03/19/2014CN103650156A Solar cell backside protective sheet and solar cell
03/19/2014CN103650114A Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component
03/19/2014CN103649212A Pressure-sensitive adhesives with onium-epoxy resin crosslinking system
03/19/2014CN103642448A Color-changing indicating error-proofing UV electronic adhesive and preparation method thereof
03/19/2014CN103642446A Lead-free high heat-resisting copper-clad board and preparation method thereof
03/19/2014CN103642445A Curable liquid adhesive composition and use thereof
03/19/2014CN103642444A Resin adhesive
03/19/2014CN103642443A Adhesive for sealing thick film circuit
03/19/2014CN103642442A High-heat-conduction insulating glue for aluminum substrate and preparation method thereof
03/19/2014CN103642441A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
03/19/2014CN103642440A Composite resin adhesive
03/19/2014CN103642423A Conductive adhesive with high repair rate and preparation method thereof
03/19/2014CN103642422A Reparative conductive adhesive and preparation method thereof
03/19/2014CN103642421A Low-modulus epoxy resin conductive adhesive used for semiconductor chip packaging
03/19/2014CN103642420A Fast curing thermosetting conductive silver adhesive
03/19/2014CN103642415A Heat-conducting double-sided tape
03/19/2014CN103642413A High-temperature-resistant insulating paper adhesive tape
03/19/2014CN103642408A Heat conduction double-sided adhesive tape taking BN (boron nitride) as heat conduction agent and preparation process thereof
03/19/2014CN103642175A Normal-temperature fast curing epoxy resin crack pouring agent for roads and bridges
03/19/2014CN103642174A High-temperature resistant and high-performance attenuating epoxy matrix and application thereof, and preparation method of composite material of matrix
03/19/2014CN103642001A Inclusion complex
03/19/2014CN103642000A Curing agent, preparation method of curing agent and epoxy resin adhesive
03/19/2014CN103045142B Epoxy wear-resisting ceramic wafer bonding glue and preparation method thereof
03/19/2014CN102482547B Hydrocarbon adhesive composition and method for treating substrate surface using same
03/19/2014CN102153980B Daub used for making glass steel pipeline threads and preparation method thereof
03/19/2014CN102020959B High heat conductivity and low dissipation factor increased layer bonding varnish
03/18/2014US8673108 Curable epoxy resin-based adhesive compositions
03/13/2014WO2014039063A1 Toughening masterblends
03/13/2014WO2014039062A1 Toughened epoxy resin formulations
03/13/2014US20140072771 Shape memory polymer which functions as a dry adhesive clamp and methods of making and using the same
03/13/2014US20140072731 Adhesive for polarizing plate and polarizing plate including the same
03/13/2014US20140069583 Epoxy Resins With High Thermal Stability and Toughness
03/13/2014US20140069578 Shape memory polymer which functions as a reversible dry adhesive and methods of making and using the same
03/12/2014EP2705090A1 Trimethyl borate in epoxy resins
03/12/2014CN103635504A Novel (meth) acrylic resin and resin composition utilizing same
03/12/2014CN103627368A Binding material for bituminous concrete base-surfaces and preparation method thereof
03/12/2014CN103627360A Latent epoxy resin composite suitable for insulative impregnation of conformal felt and binding rope of motor and preparation method of composite
03/12/2014CN103627359A Preparation method for novel strong adhesive
03/12/2014CN103627358A Epoxy resin sealing adhesive
03/12/2014CN103627357A Large-power conductive chip adhesive
03/12/2014CN103627350A Dual-curing pressure sensitive adhesive
03/12/2014CN103045145B Epoxy adhesive used for carbon fiber reinforcement and preparation method thereof
03/12/2014CN102942889B Low-halogen epoxy potting adhesive, and preparation method and application thereof
03/12/2014CN102911632B Epoxy anchoring adhesive for high speed railway embedded steel bar and preparation method thereof
03/12/2014CN102676106B High-temperature-resistant adhesive foil composite adhesive for precision metal foil resistance chip and preparation method thereof
03/12/2014CN102676102B Silver nanowire doped conductive silver colloid and preparation method thereof
03/12/2014CN102482548B Curable and cured adhesive compositions
03/12/2014CN102336635B Epoxy resin and preparation method and application thereof
03/12/2014CN102264855B Resin composition for adhesive, adhesive comprising same, adhesive sheet, and printed wiring board including same as adhesive layer
03/12/2014CN102171263B Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board
03/12/2014CN101923243B Polymeric dispersed liquid crystal light shutter device
03/12/2014CN101755025B Adhesive and bonded body
03/11/2014US8668986 Aromatic aldimines and polyurethane compositions which contain aldimine
03/06/2014WO2014035655A2 Accelerated and toughened two part epoxy adhesives
03/06/2014WO2014032378A1 Methods for preparing functionalized graphene and the composite electroconductive glue thereof
03/05/2014CN103620742A Adhesive film, and dicing/die bonding film and method for processing semiconductor using said dicing/die bonding film
03/05/2014CN103614107A Epoxy potting adhesive
03/05/2014CN103614106A High-strength strong-acid/alkali-resistant epoxy resin sealant
03/05/2014CN103614105A Epoxy resin sealing adhesive
03/05/2014CN103614104A Low-temperature epoxy adhesive for embedded steel bars and preparation method of adhesive
03/05/2014CN103614098A Functional graphene-doped epoxy resin conductive adhesive and preparation method thereof
03/05/2014CN103612464A Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces
03/05/2014CN102936478B Elastic bicomponent normal-temperature cured epoxy resin adhesive and preparation method thereof
03/05/2014CN102827566B Single-component high/low-temperature-resistant epoxy resin composition
03/05/2014CN102816289B Preparation method for epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength
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