| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 03/25/2009 | CN100471888C Phenol-blocked polyurethane prepolymers. |
| 03/24/2009 | US7507778 Epoxy composition containing two curing agents having different reactivities; exhibits high storage stability and is useful as protective coating or adhesive. |
| 03/19/2009 | WO2009034966A1 Liquid resin composition and cured product using the liquid resin composition |
| 03/19/2009 | WO2009034023A2 Flame retardant combinations of hydroxyalkyl phosphine oxides with 1,3,5-triazines and epoxides |
| 03/19/2009 | WO2008157571A3 Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| 03/19/2009 | US20090076202 Substituted Alkoxylated Phenols and Branched Sulfates for Use in Emulsion Polymer Latexes |
| 03/19/2009 | US20090076180 Epoxy resin composition using latent curing agent and curable by photo and heat in combination |
| 03/19/2009 | US20090073636 Polymer-ceramic composites with excellent tcc |
| 03/19/2009 | US20090071602 Light-curing thermoplastic epoxy resin adhesive |
| 03/19/2009 | CA2696950A1 Flame retardant combinations of hydroxyalkyl phosphine oxides with 1,3,5-triazines and epoxides |
| 03/18/2009 | EP2036950A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 03/18/2009 | EP2036860A1 Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith |
| 03/18/2009 | CN101389712A Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 03/18/2009 | CN101388209A Composition for acoustic damping |
| 03/18/2009 | CN101386700A Curing composition containing fumed silica |
| 03/18/2009 | CN100470685C Quasi-solid nano-composite gel electrolyte, its production and use |
| 03/17/2009 | US7504471 Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive |
| 03/17/2009 | US7504460 and a cross-linking agent comprising at least one of 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, or 1,4-bis(4-aminophenoxy)benzene; upon curing produce a three dimensional cross-linked matrix having a low coefficient of thermal expansion |
| 03/17/2009 | US7504438 Demulsifiers, their preparation and use in oil bearing formations |
| 03/12/2009 | WO2009031146A1 High refractive index, low viscosity room temperature two-part epoxy resins |
| 03/12/2009 | US20090069513 Epoxy resin, method for producing same and use thereof |
| 03/12/2009 | US20090069490 semiconductor encapsulation materials; fireproofing; dielectrics |
| 03/12/2009 | US20090065143 Two-component epoxy adhesive composition |
| 03/12/2009 | DE102007041988A1 Flammhemmende Additive A flame-retardant additives |
| 03/11/2009 | EP1566395B1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 03/11/2009 | EP1553138B1 Flame-retardant polybutylene terephthalate resin composition and moldings |
| 03/11/2009 | CN101381513A Nylon nano compound material for sugar machine, preparation method and application thereof |
| 03/11/2009 | CN101381506A Halogen and phosphor-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby |
| 03/11/2009 | CN101381456A Method for preparing high toughness black MC nylon |
| 03/10/2009 | US7501461 Composition of epoxy resin, aliphatic amine curing agent and halogenated amine |
| 03/10/2009 | US7501087 Injection molding thermosetting resin composition into reinforcing fiber substrate |
| 03/05/2009 | WO2009028493A1 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device |
| 03/05/2009 | WO2009028477A1 Saturated polyester resin composition and hot melt adhesive composition |
| 03/05/2009 | WO2009028432A1 Curable epoxy resin composition and cured product thereof |
| 03/05/2009 | WO2009028224A1 Microencapsulated latent hardener |
| 03/05/2009 | WO2009027385A1 Composite material, use of a composite material and method for producing a composite material |
| 03/05/2009 | US20090062481 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 03/05/2009 | US20090062460 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device |
| 03/05/2009 | US20090062442 Composition and associated method |
| 03/05/2009 | US20090062441 Composition and associated method |
| 03/05/2009 | US20090062421 Phenoxy Resin for Optical Material, Resin Composition for Optical Material, Resin Film For Optical Material and Optical Waveguide Using Those |
| 03/05/2009 | US20090061713 Article and associated method |
| 03/05/2009 | US20090061167 Inkjet ink composition for color filter, production method for color filter, and color filter |
| 03/05/2009 | US20090061095 Amine functional adducts and curable compositions comprising same |
| 03/05/2009 | DE10392286B4 Beschichtungszusammensetzung und deren Verwendung Coating composition and the use thereof |
| 03/04/2009 | EP2031023A1 Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 03/04/2009 | EP2031021A1 Actinic radiation curable coating compositions |
| 03/04/2009 | EP2029658A1 Polysiloxane/polyimide copolymers and blends thereof |
| 03/04/2009 | EP2029654A2 Oligomeric halogenated chain extenders for preparing epoxy resins |
| 03/04/2009 | EP1756241B1 Method for forming structures using an encapsulated adhesive material |
| 03/04/2009 | CN101379118A Epoxy resin curable composition for prepreg |
| 03/04/2009 | CN101376736A Carbon fibre bar containing super fine and preparation thereof |
| 03/04/2009 | CN101376735A Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby |
| 03/04/2009 | CN101376734A Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof |
| 03/04/2009 | CN101376665A Phosphaphenanthrene flame-retardant compound containing s-triazine structure, and preparation and use thereof |
| 03/04/2009 | CN100465194C Polyacrylic hydrazide and a crosslinking or curing agent for resin |
| 03/03/2009 | US7498389 Curable; for fixing fibres, scrims, fabrics or composites, for reinforcing buildings, for example walls or ceilings or floors; or for fixing building components, such as panels or blocks made of stone, glass or plastics; after curing, large tolerance range for temperatures; high bond stress value |
| 03/03/2009 | US7498384 Multi-component epoxy-amine primer systems comprising a polythioether |
| 03/03/2009 | US7498085 Encapsulating light emitting semiconductor |
| 02/26/2009 | WO2009026085A1 Hot melt adhesives containing styrene butadiene block copolymer |
| 02/26/2009 | WO2009025991A1 Two part crash durable epoxy adhesives |
| 02/26/2009 | WO2009025319A1 Polyimide composition, flexible wiring board, and process for producing flexible wiring board |
| 02/26/2009 | US20090054585 Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin |
| 02/26/2009 | US20090054577 Resin composition |
| 02/26/2009 | US20090053965 Method for manufacturing display device and composition of sealant therefor |
| 02/26/2009 | US20090053421 Non-Aqueous, Liquid Coating Compositions |
| 02/26/2009 | US20090051053 Epoxy resin composition and semiconductor apparatus |
| 02/25/2009 | EP2028207A1 Resin composition for composite material parts |
| 02/25/2009 | EP2028202A1 Radical polymerizable resin composition |
| 02/25/2009 | EP2027176A1 Resin dispersion |
| 02/25/2009 | EP1123944B1 Partial condensate of glycidyl ether group-containing alkoxysilane, silane-modified resin, compositions thereof, and preparation methods thereof |
| 02/25/2009 | CN101372547A Shark intimating covering having self-lubricating groove and composite anti-drag function and manufacturing method thereof |
| 02/24/2009 | US7495060 Improved subliming and decomposing properties; thermal stability; prolonged pot-life; polymerization catalysts |
| 02/24/2009 | US7494716 Epoxy resin modified with phosphate, phosphonate compound |
| 02/24/2009 | US7494715 Steel plate reinforcing sheet |
| 02/24/2009 | US7494611 cellulose ester film comprising a polymer prepared by polymerizing at least one ethylenically unsaturated monomer selected from vinyl esters, vinyl esters having a functional group, acrylic esters, and acrylic esters having a functional group, wherein the polymer has a weight average molecular weight |
| 02/24/2009 | CA2313326C Curable resin compositions |
| 02/19/2009 | WO2009022516A1 Method for production of adhesive resin composition, resin film, and laminate |
| 02/19/2009 | WO2009022076A2 Thermoplastic material post-crosslinkable after transformation and moulded articles stable at a very high temperature and obtained after transformation |
| 02/19/2009 | DE102007038438A1 Glasfaserverstärkte Polycarbonat-Formmassen Glass-reinforced polycarbonate molding compositions |
| 02/18/2009 | EP2025696A1 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 02/18/2009 | EP2024195A2 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/18/2009 | CN101370870A Epoxy resin molding material for sealing and electronic component device |
| 02/18/2009 | CN101369098A Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 02/18/2009 | CN101367997A Process for producing epoxy resin//MC nylon composite material |
| 02/18/2009 | CN101367982A Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 02/18/2009 | CN100463115C Adhesive bonding sheet, semiconductor device using same, and method for manufacturing the semiconductor device |
| 02/18/2009 | CN100462402C Epoxy resin composition for semiconductor encapsulation, semiconductor device, and process for producing semiconductor device |
| 02/18/2009 | CN100462401C Epoxy resin molding material for sealing and semiconductor device |
| 02/18/2009 | CN100462397C Method of treating aluminum hydroxide combustion inhibitor in epoxide resin encapsulation material |
| 02/17/2009 | US7491789 Molding materials, adhesives, adhesive films or anisotropic conductive films; high adhesion in liquid crystal displays, in semiconductor mounting materials, and to gold surfaces; improved crack and peel resistances; bis-(substituted-hydroxyphenylalkylthioalkyl)disulfides |
| 02/17/2009 | US7491774 reacting a phenol compound and epihalohydrin, then purifying and pulverizing to obtain particles exhibiting excellent fluidity during molding because of its low melt viscosity and allows easy handling because it hardly causes blocking during storage and transportation and also relates to a package |
| 02/17/2009 | US7491426 Strong, easy to use, trowelable, flexible, passes negative hydrostatic test; epoxy component also preferably includes an epoxy flexibilizer and a reactive diluent for epoxy chain termination, glycidyl ether |
| 02/17/2009 | US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin |
| 02/17/2009 | CA2638701A1 Composition for acoustic damping |
| 02/12/2009 | WO2009020116A1 Resin material for optical purposes, and optical element utilizing the same |
| 02/12/2009 | WO2009019906A1 Latent hardener |
| 02/12/2009 | US20090042013 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 02/11/2009 | CN101362848A Filler resin composition for adjusting high backing plate by filling and preparation method |
| 02/11/2009 | CN101362819A Triazines cross-linking compounds, preparation method and application thereof |