Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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09/23/2009 | CN101537331A Preparation method of ammonium polyphosphate flame retardant microcapsule coated with epoxy resin |
09/23/2009 | CN100543099C Resin composition for encapsulating semiconductor |
09/23/2009 | CN100543082C Resin compositions and methods of use thereof |
09/22/2009 | US7592067 Epoxy resin compositions, processes utilizing same and articles made therefrom |
09/22/2009 | US7591973 preparing a prepreg contining carbon fibers and an epoxy resin containing bisphenols having thio group such as bishphenol S, a urea compound ( phenyldimethylurea) an amine compound(4,4'-diaminodiphenylsulfide) and a dicyandiamide as curing agent; heating, compression molding the prepreg; high strength |
09/17/2009 | WO2009113027A1 Epoxy resin based composition and method for the curing thereof |
09/17/2009 | WO2009084831A3 Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
09/17/2009 | US20090234080 Process for producing latent catalyst and epoxy resin composition |
09/17/2009 | US20090234078 Organotrisiloxane, Preparation And Use In Curable Resin Composition |
09/17/2009 | US20090230360 Latent Curing Agent |
09/17/2009 | US20090229720 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
09/17/2009 | DE102008014526A1 Zweikomponentiges Reaktionsharz-System Two-component reaction resin system |
09/17/2009 | DE102008014117A1 Preparation of 6-amino-(6H)-dibenz(c,e)(1,2)-oxaphosphorin-6-sulfide compounds, useful as flame retardants for e.g. epoxy resins, comprises reaction of 6-amino-(6H)-dibenz(c,e)(1,2)-oxaphosphorine compounds with elemental sulfur |
09/17/2009 | DE102008014115A1 Preparation of substituted 6-amino-(6H)-dibenz(c,e)(1,2)-oxazaphosph orine compound, useful as flame retardant e.g. in epoxide resin, comprises transamination of (6H)-dibenz(c,e)(1,2)-oxazaphosphorine compound using amine compound |
09/17/2009 | DE102007059331B4 Kautschukzusammensetzung, umfassend Oxiranharz sowie ein solch eine Zusammensetzung enthaltender Reifen A rubber composition comprising a Oxiranharz and such a composition containing tire |
09/16/2009 | EP2100917A1 Additive mixture for epoxy resin |
09/16/2009 | EP1435376B1 Toughened thermosetting resins and preparation of the same |
09/16/2009 | CN101531821A Glass fiber reinforced polyester mineral composite material and preparation method thereof |
09/16/2009 | CN101531815A Water-blocking fiber reinforced plastic composite material for LNG ship |
09/16/2009 | CN101531805A Resin composition and semiconductor device empolying the same |
09/16/2009 | CN101531804A Electromagnetic shielding compound material made from three-dimensional braided nickel-plated carbon fiber and epoxy resin and method for preparing same |
09/16/2009 | CN101531803A Carbon fiber reinforced polyester mineral composite material and preparation method thereof |
09/16/2009 | CN101531799A PMMA/wood plastic composite rostone material and the preparing method thereof |
09/16/2009 | CN100540605C Polyelectrolyte composition |
09/16/2009 | CN100540603C Modifier for polyester resin and process for producing molded article with the same |
09/15/2009 | US7589133 Stabilizers for polymerizable biocompatible materials |
09/15/2009 | CA2515989C Curable resin composition |
09/11/2009 | WO2009110434A1 Curable composition and color filter |
09/11/2009 | WO2009110345A1 One-pack type epoxy resin composition and use thereof |
09/11/2009 | WO2009110230A1 Flame-retardant resin composition and coated electrical wire |
09/10/2009 | US20090227718 Aqueous dispersion, composition and coating agent for paper |
09/10/2009 | US20090227706 Aqueous binder for mineral fibers |
09/10/2009 | US20090226729 High-solid anticorrosive coating composition, high-solid rapidly-curable anticorrosive coating composition, method of coating ship or the like, high-solid anticorrosive film and rapidly cured high- anticorrosive film obtained, and coated ship and underwater structure coated with these coating films |
09/10/2009 | DE102008013231A1 Härtbares Reaktionsharzsystem Curable reactive resin system |
09/10/2009 | DE102008000499A1 Kieselsäure sowie Epoxidharze Silica and epoxy resins |
09/09/2009 | EP2097481A1 Epoxy resin composition for fiber reinforced composite material |
09/09/2009 | CN101528848A Poly(arylene ether) composition, method, and article |
09/09/2009 | CN101528604A Alumina powder, process for producing the same, and use thereof |
09/09/2009 | CN101525469A Force sensing epoxy resin-based composite material |
09/09/2009 | CN101525468A Low-resistance conductive plastic and preparation method thereof |
09/09/2009 | CN101525467A Epoxy/organosilicon hybrid material, and preparation method and application thereof |
09/09/2009 | CN101525466A Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof |
09/08/2009 | US7585904 Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition |
09/08/2009 | US7585436 Polymer films comprising stabilized infrared absorbing agents |
09/03/2009 | WO2009108001A2 Resin composition for manufacturing marble chips, method for manufacturing marble chips using the same, and artificial marble made from marble chips |
09/03/2009 | WO2009107699A1 Curable epoxy composition, anisotropic conductive material and connection structure |
09/03/2009 | WO2009053959A3 Pvc sheets or articles with high heat distortion temperature |
09/02/2009 | CN101522794A Polymeric composite material for cold moulding and a process for obtaining it |
09/02/2009 | CN101522793A Epoxy resin composition for encapsulating semiconductor element and semiconductor device |
09/02/2009 | CN101522792A Epoxy resin molding material for sealing and electronic component device |
09/02/2009 | CN101519508A Diffusion scattering transmission safe glass and preparation method thereof |
09/02/2009 | CN101519507A Light-storing-self-illuminating transparent glass and preparation method thereof |
09/02/2009 | CN101519505A Method for decomposing thermosetting epoxy resin or composite material thereof by high-temperature water phase |
08/27/2009 | WO2009104312A1 Microencapsulated silane coupling agent |
08/27/2009 | WO2009104292A1 Process for producing resin composition with partial-discharge resistance, resin composition with partial-discharge resistance, and insulating material with partial-discharge resistance |
08/27/2009 | WO2009084014A3 An epoxy resin composition |
08/27/2009 | WO2009075971A3 Nozzle sealing composition and method |
08/27/2009 | US20090215969 Epoxy resin composition |
08/27/2009 | US20090215943 Epoxy resin composition and semiconductor device |
08/27/2009 | US20090215929 Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin |
08/27/2009 | US20090212252 Vibration dampening compositions |
08/27/2009 | DE102008009298A1 Polyester-Flammschutzmittel Polyester flame retardant |
08/26/2009 | EP2092018A1 Low odor, fast cure, toughened epoxy adhesive |
08/26/2009 | EP2091998A2 Biodegradable polymeric derivatives |
08/26/2009 | EP2091954A2 Metal compounds for use as initiators |
08/26/2009 | CN101516993A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
08/26/2009 | CN101516992A Comb-like polyether alkanolamine in ink and paint |
08/26/2009 | CN101516941A Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
08/26/2009 | CN101514537A FRP structural layer integrating adhesion, waterproof and stress buffer layers as a whole used for steel bridge deck paving layer |
08/26/2009 | CN101513932A Deformable aerofoil cover with changeable rigidity |
08/26/2009 | CN100532490C Encapsulating material and method for making same |
08/26/2009 | CN100532450C Thermoset shape memory resin and second-stage solidification method |
08/26/2009 | CN100532449C Flexible printed circuit coating film and its preparing method |
08/25/2009 | US7579574 Molding compounds for use in induction heating applications and heating elements molded from these compounds |
08/25/2009 | US7579405 Primer composition and uses thereof |
08/25/2009 | US7579392 Low-viscosity epoxy resin; a phenolic chain extender; catalyst that promotes self-curing reactions between epoxy groups; an inhibitor that inhibits the activity of the the activity of the catalyst under "B-staging" conditions |
08/25/2009 | US7578891 Optics; radiation transparent |
08/20/2009 | WO2009101961A1 Curable resin composition and cured resin |
08/20/2009 | WO2009075743A3 Curable compositions containing isocyanate-based tougheners |
08/20/2009 | WO2009074303A8 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
08/20/2009 | US20090205856 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
08/20/2009 | CA2715384A1 Curable resin composition and cured resin |
08/19/2009 | EP2090618A2 Hardenable epoxy resin formulation with polyester flame retardant |
08/19/2009 | CN101511934A Resin composition, prepreg and laminate |
08/19/2009 | CN101508844A Resin composition, prepreg and their uses |
08/19/2009 | CN101508825A Epoxy resin embedding glue and method for producing the same |
08/19/2009 | CN101508824A Oxatyl-containing lateral group polyarylether cured modified epoxy resin composition and method for producing the same |
08/19/2009 | CN101508823A Quick self-repair type polymer composite material at room temperature |
08/19/2009 | CN100528962C High flexible flame retardant PC(polycarbonate)/ABS alloy |
08/19/2009 | CN100528961C High flexible flame retardant PC(polycarbonate)/ABS alloy |
08/19/2009 | CN100528960C Epoxy resin composition |
08/19/2009 | CN100528959C Production of micron-solid epoxy-resin microsphere containing surface active group |
08/19/2009 | CN100528949C Low heat release and low smoke reinforcing fiber/epoxy composites |
08/19/2009 | CN100528927C Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
08/19/2009 | CN100528926C Enzymatic hydrolysis lignin epoxy resin material formula and its preparation method |
08/13/2009 | US20090203822 Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same |
08/13/2009 | US20090203813 Epoxy Resin, Epoxy Resin Composition Having the Same, Paint Composition and Method of Forming a Coating Layer Using the Same |
08/13/2009 | US20090203279 Resin composition, prepreg and their uses |
08/13/2009 | US20090202809 Fibre reinforced assembly |
08/12/2009 | EP2087041A2 Hybrid cationic curable coatings |