| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 04/28/2009 | CA2309699C Water compatible curing agents for epoxy resins |
| 04/23/2009 | WO2009051699A1 Amine terminated tougheners for epoxy resin based adhesives and materials |
| 04/23/2009 | WO2009051186A1 Polyester composition for production of thermally cured film |
| 04/23/2009 | WO2006083656A3 Integral resin-silane coating system |
| 04/23/2009 | US20090105385 Elastomer gum polymer systems |
| 04/23/2009 | US20090104429 Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| 04/23/2009 | DE102007050769A1 Polymeres Material und Verfahren zu dessen Herstellung Polymeric material and process for its preparation |
| 04/22/2009 | EP2050756A1 Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate |
| 04/22/2009 | EP2049594A1 Method of preparing resin composition for artificial marble chip having high specific gravity and high index of refraction |
| 04/22/2009 | CN101412840A Epoxy resin glue for manufacturing copper clad laminate |
| 04/22/2009 | CN101412839A Method for preparing microwave-absorbing composite material from polyacrylonitrile (PAN)-based nano carbon fibre |
| 04/22/2009 | CN101412838A Epoxy resin molding material for sealing and electronic part apparatus |
| 04/22/2009 | CN100480352C Epoxy resin composition, solid device packed by the same and method |
| 04/22/2009 | CN100480297C Solidifying agent for aqueous epoxy resin, and preparation method thereof |
| 04/21/2009 | US7521511 Containing at least one polyimide resin, a phenolic resin component containing at least one phenolic resin, and an epoxy resin component containing at least one epoxy resin; phosphazene and cyanate ester; excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability |
| 04/21/2009 | US7521494 Epoxy resin, SMA copolymer and bis-maleimidetriazine resin |
| 04/21/2009 | US7521120 Epoxy of bisphenol A, epichlorohydrin, tetraphenyl ethane groups, phosphorus containing heterocyclic groups, having disilane crosslinking; higher heat resistance and copper peel strength |
| 04/21/2009 | US7521100 Sealant of an epoxy resin from a bisphenol S-type polyvalent aromatic group with a glycidyl group, a thermo-curing agent, and a filler; excellent coatability, bondability to a substrate, long service life, pot life, high adhesive strength |
| 04/21/2009 | CA2369814C Wood replacement system and method |
| 04/16/2009 | WO2009048117A1 Epoxy compound composition |
| 04/16/2009 | WO2009047085A1 Reaction resin and two-component system for producing the same |
| 04/16/2009 | WO2009046754A1 Polymer concrete electrical insulation system |
| 04/16/2009 | WO2009017690A3 Curable epoxy resin-based adhesive compositions |
| 04/16/2009 | US20090099303 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material |
| 04/16/2009 | US20090098447 Resin composition for fuel cell separator, and fuel cell separator |
| 04/16/2009 | US20090098335 Epoxy resin composition for fiber-reinforced composite material |
| 04/16/2009 | US20090096114 Epoxy Resin Composition and Semiconductor Device |
| 04/16/2009 | DE112004002063B4 Polytrimethylenterephthalat-verstärkte Harzzusammensetzung sowie deren Verwendung Polytrimethylene-reinforced resin composition and the use thereof |
| 04/16/2009 | CA2701333A1 Polymer concrete electrical insulation system |
| 04/15/2009 | EP2048147A1 Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate |
| 04/15/2009 | EP2046890A2 Foamable compositions based on epoxy resins and polyesters |
| 04/15/2009 | EP1819792B1 Polymeric compositions with modified siloxane networks, corresponding production and uses thereof |
| 04/15/2009 | CN101410455A Molding compositions containing modified polybutylene terephthalate (PBT) random copolymers derived from polyetheylene terephthalate (PET) |
| 04/15/2009 | CN101410454A Polyester resin composition and molded body |
| 04/15/2009 | CN101407620A High performance epoxy resins composite material and preparation thereof |
| 04/15/2009 | CN101407597A Halogen-free flame-retardant photo-curing epoxy resin composition |
| 04/15/2009 | CN101407596A Method for recycling epoxy resins and glass fibre from non-metal powder of waste printed circuit board |
| 04/15/2009 | CN100478398C Method for preparing polymer/carbon nano composite material |
| 04/15/2009 | CN100478396C Method for improving heat property and crystallization behavior of polylactic acid and its multiple blocked copolymer |
| 04/15/2009 | CN100478394C Nano attapulgite clay composition for modified engineered plastic |
| 04/15/2009 | CN100478393C Organosilicon modified carbonyl epoxy composite material |
| 04/15/2009 | CN100478378C Hardenable cyanate compositions |
| 04/14/2009 | US7517724 Dicing/die bonding sheet |
| 04/09/2009 | WO2009045993A2 Compositions comprising cationic fluorinated ether, silanes, and related methods |
| 04/09/2009 | WO2009045926A1 Aromatic polyester polyols and aromatic polyester polyol blends containing biorenewable components and methods of making |
| 04/09/2009 | WO2009045466A1 Sulfonate esters as latent acid catalysts |
| 04/09/2009 | WO2009043376A1 Electrical insulation system with improved electrical breakdown strength |
| 04/09/2009 | US20090093599 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| 04/09/2009 | US20090093595 Thermosetting resin composition containing low chlorine polyfuntional aliphatic glycidyl ether compound, cured products of the composition and use thereof |
| 04/09/2009 | US20090093570 Encapsulant composition for a light-emitting diode |
| 04/09/2009 | US20090093562 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 04/09/2009 | US20090092831 Carbon Fiber |
| 04/09/2009 | US20090090629 Cathodic electrodeposition coating compositions |
| 04/08/2009 | CN101405342A Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 04/08/2009 | CN101402775A Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same |
| 04/08/2009 | CN101402739A Production process for water-soluble epoxy resin emulsions |
| 04/08/2009 | CN101402270A Antistatic nano-composite board and manufacturing method |
| 04/08/2009 | CN100476030C Surface-coating electromagnetic steel sheet for bonding |
| 04/08/2009 | CN100475926C Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 04/08/2009 | CN100475909C Method of de-watering a slurry mixture from a jet-grouting operation and aqueous suspension for use therein |
| 04/07/2009 | US7514507 Comb-shaped epoxy resin and method for preparing comb-shaped epoxy resin |
| 04/02/2009 | WO2009041472A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
| 04/02/2009 | WO2009041333A1 Curable liquid epoxy resin composition and cured product thereof |
| 04/02/2009 | WO2009041137A1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board |
| 04/02/2009 | WO2009040921A1 Epoxy resin composition and, produced therewith, prepreg and metal clad laminate |
| 04/02/2009 | WO2006078425A3 Polyvinylidene fluoride coating for metal substrates |
| 04/02/2009 | WO2005055119A3 Composite piezoelectric apparatus and method |
| 04/02/2009 | US20090088527 Attach paste composition for semiconductor package |
| 04/02/2009 | US20090088497 Paving material and method for construction of paved body using the same |
| 04/02/2009 | US20090088492 Ink composition |
| 04/02/2009 | US20090087571 Low shrinkage epoxy-cationic curable composition |
| 04/02/2009 | DE102007047013A1 Reaktionsharz und Zweikomponentensystem zur Herstellung desselben The same reaction resin and two-component system for manufacturing |
| 04/01/2009 | EP2043168A2 Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| 04/01/2009 | EP2041214A2 Super elastic epoxy hydrogel |
| 04/01/2009 | EP1324135B1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 04/01/2009 | CN101400719A Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those |
| 04/01/2009 | CN101400716A Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film |
| 04/01/2009 | CN101397495A UV curing luminous plate and its preparing process |
| 04/01/2009 | CN101397406A Absorption of room temperature vulcanized sealant by electromagnetic waves and preparation method thereof |
| 04/01/2009 | CN101397402A Thermosetting resin composite and cured resin |
| 04/01/2009 | CN101397400A Nano modified urethane elastomer tyre material for tracked vehicle road wheel and moulding technique thereof |
| 04/01/2009 | CN101397393A Toughening and reinforcing epoxy resins composite material and preparation method thereof |
| 04/01/2009 | CN101397392A Method for manufacturing shock resistant floor |
| 04/01/2009 | CN100474004C A process for the fabrication of optical microstructures |
| 04/01/2009 | CN100473690C Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 03/31/2009 | US7511383 An inorganic porous fine particle supporting a preferably triphosphazene-modified, phenol end-capped polyether, and an encapsulating epoxy or bismaleimide resin; bromine and antimony-free; nontoxic; improved hydrolysis resistance in high humidity |
| 03/31/2009 | US7511097 bisphenol a or bisphenol f type epoxy resins, an acrylonitrile-butadiene copolymer modified epoxy resins (bisphenol a, diglycidyl ether); 4,7,10-trioxatridecan-1,13-diamine, diethylenetriamine, triethylenetetramine etc. as amine compound; wash-off resistance upon heat curing in a crash-stable adhesive |
| 03/26/2009 | WO2009038960A2 Flexible epoxy-based compositions |
| 03/26/2009 | WO2009038166A1 Epoxy resin composition |
| 03/26/2009 | WO2009037834A1 Primer resin for semiconductor device, and semiconductor device |
| 03/26/2009 | WO2009037820A1 Curable resin composition and cured product |
| 03/26/2009 | US20090082528 Thermally curable mixture of a polyol, particularly Boltorn; a cycloaliphatic epoxide such as 3,4-epoxycyclohexyl methyl-3,4-epoxy-cyclohexanecarboxylate; and S-butylthiophene hexafluoroantimonate and ammonium hexafluoroantimonate as initiators; cured product is heat resistant and is transparent |
| 03/26/2009 | US20090081466 Polyamide resin, epoxy resin compositions, and cured articles thereof |
| 03/26/2009 | US20090078164 Use of epoxy derivatives as additives for cementitious building materials |
| 03/26/2009 | DE102007043559A1 Lichthärtender thermoplastischer Epoxidharzklebstoff Light-curing epoxy adhesive thermoplastic |
| 03/25/2009 | CN101393411A Electroconductive endless belt |
| 03/25/2009 | CN101392090A Piezoelectric conductive epoxy resin composite damping material and preparation method thereof |
| 03/25/2009 | CN101392089A Surface improver for reinforced composite compositions |
| 03/25/2009 | CN101392042A Emulsion polymer comprising activators, process for preparation thereof and use thereof in two-component or multicomponent systems |
| 03/25/2009 | CN101391328A Lateral wall insulation method of electrode for minuteness electrochemical processing |