| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/08/2009 | CN100509952C Transparent epoxy nano composite material and preparation method and use thereof |
| 07/08/2009 | CN100509951C Thermoset resin composition and multi-layer printed circuit board using the resin composition |
| 07/08/2009 | CN100509950C Environment-friendly type charcoal composite material |
| 07/07/2009 | US7557169 Capping isocyanate prepolymer or polyisocyanate/polyether polyol or polyamine mixture |
| 07/07/2009 | US7557168 toughening agent for epoxy resin adhesives; impact strength; low viscosity; can be applied fast and in high volume for automobile parts; capping agents are phenolic, benzyl alcohol, aminophenyl, benzylamino groups |
| 07/07/2009 | US7556853 High toughness vinylester and/or epoxy resin-based material, its process of manufacture, composite material comprising it and uses thereof |
| 07/02/2009 | WO2009081874A1 Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device |
| 07/02/2009 | WO2009081610A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 07/02/2009 | WO2009081601A1 Thermosetting resin composition and prepreg and laminate both made with the same |
| 07/02/2009 | WO2007033213A3 Epoxy sealer/healer for sealing strengthening cracked concrete |
| 07/02/2009 | US20090171021 Thermosetting resin composition, sealant for optical device, and cured product |
| 07/02/2009 | US20090170735 Chemical-Resistant and Impact-Resistant Thermoplastic Resin Composition with Excellent Hydrolysis Resistance |
| 07/02/2009 | US20090166897 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same |
| 07/01/2009 | CN100506909C Preparation method of piezoelectric ceramic/epoxy resin composite |
| 07/01/2009 | CN100506908C Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| 07/01/2009 | CN100506810C Epoxy compound and epoxy resin cured product obtained by curing the epoxy compound |
| 07/01/2009 | CN100506570C Method of making models |
| 06/30/2009 | US7553890 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 06/25/2009 | WO2009079428A1 Vibration dampening compositions |
| 06/25/2009 | WO2009079387A2 Organic solvent free pigment dispersant for waterborne electrocoating |
| 06/25/2009 | WO2009079122A1 Method of coating fine wires and curable composition therefor |
| 06/25/2009 | WO2009078301A1 Photosemiconductor package sealing resin material |
| 06/25/2009 | WO2009077212A1 Thermoplast-containing epoxy resins and the processing thereof by extrusion or injection molding |
| 06/25/2009 | US20090163652 Thermosetting resin composition and use thereof |
| 06/25/2009 | US20090159313 Curable epoxy resin composition and laminates made therefrom |
| 06/25/2009 | DE102007062035A1 Reactive resin system useful for encapsulating electronic or electrical components comprises an epoxy resin based on a monomer with three epoxy groups and an epoxy resin based on a monomer with at least four epoxy groups |
| 06/25/2009 | DE102007061860A1 Thermoplast-haltige Epoxidharze und deren Verarbeitung durch Extrusion oder Spritzguss Thermoplastic-containing epoxy resins and their processing by extrusion or injection |
| 06/25/2009 | CA2709168A1 Vibration dampening compositions |
| 06/25/2009 | CA2707632A1 Organic solvent free pigment dispersant for waterborne electrocoating |
| 06/24/2009 | CN101466786A Epoxy resin, epoxy resin composition having the same, paint composition and method of forming a coating layer using the same |
| 06/24/2009 | CN101463182A Microfine piezoelectric ceramics array structure composite material and preparation thereof |
| 06/24/2009 | CN101463181A Self-lubricating composite material and manufacturing method of self-lubricating composite material mould |
| 06/24/2009 | CN101463180A Aqueous single-component external emulsion epoxy resin emulsion and preparation thereof |
| 06/24/2009 | CN101463179A Aqueous self-emulsifying epoxy resin emulsion and preparation thereof |
| 06/24/2009 | CN100503723C Anticorrosive electrode material, LCD and their preparing process |
| 06/24/2009 | CN100503681C Curing silicone composition and cured product thereof |
| 06/23/2009 | US7550550 aminated polyols from alkylene glycol adducts; increased working time; curing agents for epoxy resins; preparing polyureas from the diamines and diisocyanates; composite blades for wind-driven turbines |
| 06/23/2009 | US7550522 Composition of liquid thermoset resin and gelator |
| 06/23/2009 | US7550521 curing a mixture of a liquid base epoxy resin, curing agent and expandable hollow microspheres (polymer shell and gas) wherein a matrix forms around the spheres which essentially do not expand; heating then cooling such that compressive residual stress is created around the spheres |
| 06/23/2009 | US7550096 Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same |
| 06/23/2009 | CA2321335C Cationically electrodepositable coating composition |
| 06/18/2009 | WO2009075971A2 Nozzle sealing composition and method |
| 06/18/2009 | WO2009075743A2 Curable compositions containing isocyanate-based tougheners |
| 06/18/2009 | WO2009074532A1 Elastomeric flexibilizer for thermosets |
| 06/18/2009 | WO2009074303A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 06/18/2009 | WO2009074293A1 Epoxy-phenolic resins co-dispersions |
| 06/18/2009 | US20090155473 Superprimer |
| 06/18/2009 | DE102007059969A1 Stabile wässrige Epoxid-Harz Dispersion enthaltend Phenolharze zur autophoretischen Beschichtung von Metallen A stable aqueous epoxy resin dispersion containing phenolic resins for autodepositing coating of metals |
| 06/18/2009 | CA2708427A1 Epoxy-phenolic resins co-dispersions |
| 06/18/2009 | CA2708261A1 Curable compositions containing isocyanate-based tougheners |
| 06/17/2009 | EP2070984A1 Epoxy-phenolic resins co-dispersions |
| 06/17/2009 | EP2070962A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 06/17/2009 | EP2069434A1 Comb-like polyetheralkanolamines in inks and coatings |
| 06/17/2009 | EP1979392B1 Non-aqueous, liquid coating compositions |
| 06/17/2009 | EP1119588B1 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
| 06/17/2009 | CN101457013A Light scattering type epoxy resin composition and preparation method thereof |
| 06/17/2009 | CN101457012A Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
| 06/17/2009 | CN101457011A Preparation of composite nano particle modified epoxy resin |
| 06/17/2009 | CN100500761C Composition of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composition and copper foil clad laminated board |
| 06/17/2009 | CN100500745C Epoxy-polysiloxane polymer composition |
| 06/16/2009 | US7547745 Epoxy resin hardener of anhydride copolymer and anhydride-elastomer copolymer |
| 06/16/2009 | US7547373 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 06/16/2009 | CA2326955C Adhesive composition |
| 06/11/2009 | WO2009071670A1 Peroxide composition |
| 06/11/2009 | US20090148653 Fluoropolymer emulsions |
| 06/10/2009 | EP2067824A1 Curable resin composition, optical material, and method of regulating optical material |
| 06/10/2009 | EP2066713A2 Novel adducts and curable compositions using same |
| 06/10/2009 | DE102004039693B4 Vergussmasse, Chipmodul und Verfahren zur Herstellung eines Chipmoduls Potting compound chip module and method of producing a chip module |
| 06/10/2009 | CN101451054A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN101451053A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 06/10/2009 | CN100497476C Organic fluorescent resin for white light LED |
| 06/10/2009 | CN100497475C Halogen-free resin composition and its uses in adhesive sheet and copper-cladded plate |
| 06/10/2009 | CN100497474C Preparation method of epoxy resin base micron to nano grade pore gelatin |
| 06/10/2009 | CN100497473C Molding compositions containing quaternary organophosphonium salts |
| 06/10/2009 | CN100497472C Epoxy resin/nano rubber micropowder hybrid composites and use thereof |
| 06/09/2009 | US7544727 Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate |
| 06/09/2009 | CA2245548C Compositions which undergo light-induced cationic curing and their use |
| 06/04/2009 | WO2009069725A1 Polyamide resin composition and molded article |
| 06/04/2009 | WO2009069429A1 Silica-containing epoxy curing agent and epoxy resin cured body |
| 06/04/2009 | WO2008141187A3 One-part non-toxic spray foam |
| 06/04/2009 | US20090143544 Having an unsaturated fatty acid or fatty ester; metathesis of the feedstock with a lower olefin; the resulting vinyl ester monomer may be epoxidized, hydroformylated or reductively aminated before oligomerization or polymerization to produce omega-epoxy, hydroxy, or amino vinyl esters |
| 06/04/2009 | US20090143526 Coating composition and coated article |
| 06/04/2009 | US20090139873 Leveler compounds |
| 06/03/2009 | CN101445649A Ground carbon fiber enhanced resin/graphite conducting composite material and preparation method thereof |
| 06/03/2009 | CN101445648A Flame retardant epoxy resin material |
| 06/03/2009 | CN101445647A Flame retardant epoxy resin material |
| 06/03/2009 | CN101445646A Preparation method of polymeric based carbon nano tube composite material in the technical field of nano-materials |
| 06/03/2009 | CN101445645A White heat-hardening resin composition |
| 06/03/2009 | CN101445644A White hardening resin composition |
| 06/03/2009 | CN101445643A Epoxy resin composite |
| 06/03/2009 | CN101445642A Reinforcing and toughening auxiliary agent composite for flexible freight bag and preparation method thereof |
| 06/03/2009 | CN100495671C Resin paste for wafer bonding |
| 06/02/2009 | US7541093 High molecular weight epoxy resin and low viscosity fatty amine oligomer curing agent; reduced drying time and solvent requirement; adhesion; concrete and metal protection; corrosion and impact resistance; flexibility, durability |
| 06/02/2009 | US7541075 Improved durability in high temperature and high humidity environments |
| 05/28/2009 | US20090137777 Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product |
| 05/28/2009 | US20090137702 Coating system |
| 05/28/2009 | US20090134358 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 05/28/2009 | US20090133912 Resin composition and hybrid integrated circuit board making use of the same |
| 05/28/2009 | US20090133833 Epoxy Resin Composition and Die Bonding Material Comprising the Composition |
| 05/27/2009 | EP2061836A1 Poly(arylene ether) composition, method, and article |