| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 08/12/2009 | EP2087036A2 Compositions containing phosphonate-functional particles |
| 08/12/2009 | EP1650248B1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 08/12/2009 | EP1470192B1 High strength bioresorbables containing poly-glycolic acid |
| 08/12/2009 | CN101506302A Resin compositions for coatings and coating compositions wherein these are used |
| 08/12/2009 | CN101506301A Casting resin composition, insulating material using the same, and insulating structure |
| 08/12/2009 | CN101506270A Polysiloxane/polyimide copolymers and blends thereof |
| 08/12/2009 | CN101503622A White-light diode, synergistic light conversion powder, fluorescent powder and preparation of fluorescent powder |
| 08/12/2009 | CN101503615A Method for preparing single-component high temperature curing sealing material for ironmaking tuyere of blast furnace |
| 08/12/2009 | CN101503562A Shock-absorbing elastic material and preparation thereof |
| 08/12/2009 | CN101503561A Flame-retardant epoxy resin material |
| 08/12/2009 | CN100526340C Silicon containing macromolecule photo-initiation agent, synthesis and uses thereof |
| 08/11/2009 | US7572506 Aqueous primer surfacer compositions |
| 08/11/2009 | US7572503 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 08/06/2009 | WO2009096507A1 Resin composition and multilayer resin film employing the same |
| 08/06/2009 | WO2009096374A1 Alicyclic epoxy resin composition, cured product thereof, production method thereof, and rubbery polymer-containing resin composition |
| 08/06/2009 | WO2009096343A1 Siliceous powder, process for production of the same, and use thereof |
| 08/06/2009 | WO2009095484A1 Wash-out resistant heat-curing epoxy resin adhesives |
| 08/06/2009 | WO2008023224A8 Resin compositions for coatings and coating compositions wherein these are used |
| 08/06/2009 | US20090198035 Polyether polyamine agents and mixtures thereof |
| 08/06/2009 | US20090198013 Adhesive film for semiconductor |
| 08/05/2009 | EP2085426A1 Wash-resistant thermo hardening epoxy resin adhesives |
| 08/05/2009 | EP2085415A1 Composite system, method for its manufacture and multi-layered non-woven fabric |
| 08/05/2009 | EP2084241A2 Toughened binder compositions for use in advance processes |
| 08/05/2009 | EP2084215A1 Ductile structural foams |
| 08/05/2009 | EP2084206A2 Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| 08/05/2009 | EP2084205A1 Composite materials with improved performance |
| 08/05/2009 | EP2084200A1 Derivatized solid epoxy resin and uses thereof |
| 08/05/2009 | EP1809701B1 Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins |
| 08/05/2009 | CN101501132A Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 08/05/2009 | CN101497931A Method for preparing single-component low temperature curing sealing material for ironmaking tuyere of blast furnace |
| 08/05/2009 | CN101497737A Preparation of aqueous epoxy resin |
| 08/05/2009 | CN101497244A Method for producing assorted fiber composite mast |
| 08/05/2009 | CN101497243A Method for producing carbon fiber composite mast |
| 08/05/2009 | CN100523081C Phosphorous epoxy resin composition |
| 08/05/2009 | CN100523046C Encapsulation epoxy resin material and electronic component |
| 08/05/2009 | CN100523030C Curable compositions and rapid prototyping process using the same |
| 08/04/2009 | US7569654 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/04/2009 | US7569640 Adhesive sheet comprising blend of two nitrile rubbers, differing in composition, and reactive resin for bonding metal parts adhesively to plastics in portable consumer electronics articles which subsequent to bonding have high bond strength and shock resistance even at temperatures below -15 degrees C. |
| 08/04/2009 | US7569260 Photosensitive composition and cured products thereof |
| 08/04/2009 | US7569166 modified and saponified ( 88 mol % ) polyvinyl acetal resin conaining a vinyl ester, vinyl alcohol, olefin containing 1-8 carbon atoms and a 1,3-dioxane ring containing vinyl ether as binder, a glass powder, an organic solvent such as toluene, ethanol; capable of exerting extremely excellent printing |
| 07/30/2009 | WO2004087826A9 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 07/30/2009 | US20090192265 Curable composition |
| 07/30/2009 | US20090192258 Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device |
| 07/29/2009 | EP1920005A4 Epoxy compositions having improved impact resistance |
| 07/29/2009 | EP1639038B1 Heat curable compositions comprising a benzoxazine component and an acrylonitrile-butadiene copolymer having secondary amine terminal groups as a toughener |
| 07/29/2009 | CN101492565A Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device |
| 07/29/2009 | CN101492564A Novel carbon fiber composite material and method of producing the same |
| 07/29/2009 | CN100519652C Joint prepreg for fuel cell |
| 07/29/2009 | CN100519651C Epoxy resin composition and semiconductor device |
| 07/29/2009 | CN100519650C Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/29/2009 | CN100519619C 环氧树脂组合物及半导体装置 Epoxy resin composition and semiconductor device |
| 07/28/2009 | US7566758 Epoxy resin composition |
| 07/28/2009 | US7566757 Flame retarding epoxy resin composition containing no halogen |
| 07/28/2009 | US7566752 Such as high viscosity epoxy resin modifiers; crosslinking agents; antioxidants; produced from 4-hydroxyphenylmethylcarbinol starting material; avoids use of 4-hydroxystyrene |
| 07/28/2009 | US7566501 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 07/28/2009 | US7566381 Low odor binders curable at room temperature |
| 07/28/2009 | US7566377 a solid epoxy resin having a ring and ball method softening temperature of 40 C. or above; an acrylate monomer or an oligomer thereof; a thermoplastic acrylate copolymer; light-activated radical polymerization initiator; a latent epoxy curing agent; one drop fill; stable cell gap; bonding |
| 07/28/2009 | CA2413062C Low moisture absorption epoxy resin systems |
| 07/23/2009 | US20090186962 Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good |
| 07/23/2009 | US20090186955 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 07/23/2009 | US20090184431 Liquid epoxy resin composition and flip chip semiconductor device |
| 07/23/2009 | DE102008005155A1 Härtbares Reaktionsharzsystem Curable reactive resin system |
| 07/22/2009 | EP2080773A1 Paste composition for light guide and light guide utilizing the same |
| 07/22/2009 | EP1841803B1 Thermally curable resin composition with extended storage stability and good adhesive property |
| 07/22/2009 | CN101486826A Epoxy solvent-free impregnating resin and preparation thereof |
| 07/16/2009 | WO2009088059A1 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 07/16/2009 | WO2009087934A1 Vibration-damping reinforcing composition, vibration-damping reinforcing member, and vibration-damping reinforcing method for thin plate |
| 07/16/2009 | WO2009045993A3 Compositions comprising cationic fluorinated ether, silanes, and related methods |
| 07/16/2009 | DE102008004112A1 Textiles Halbzeug mit wenigstens einer mit einem Kleber versehenen Oberfläche Semi-finished textile with at least one provided with an adhesive surface |
| 07/15/2009 | EP2078734A1 Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 07/15/2009 | EP1448663B1 Process for the alkoxylation of organic compounds |
| 07/15/2009 | CN101484524A Method of preparing resin composition for artificial marble chip having high specific gravity and high index of refraction |
| 07/15/2009 | CN101481492A UV curing photosensitive resin for rapid moulding injection mold |
| 07/15/2009 | CN101481491A Epoxy resin water dispersion and process for preparing the same |
| 07/15/2009 | CN101481490A Thermosetting resin composition and use |
| 07/15/2009 | CN100514613C Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 07/15/2009 | CN100513481C Halogen-free phosphide-free flame resisting thermosetting macromolecule material composition |
| 07/14/2009 | US7560519 Dual-stage wafer applied underfills |
| 07/14/2009 | US7560518 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
| 07/14/2009 | US7560501 comprising epoxy and cyanate ester resins, flexibilizers comprises bis(2,3-epoxy-2-methylpropyl)ether, a polyphenylene ether and silicon carbide fillers, having a higher fracture toughness, low viscosity and freeze resistance, used in electronic packages |
| 07/14/2009 | US7560162 polyepoxide or epoxy resin reacted with an amine or phenol, a blocked polyisocyanate, rust inhibitor; automobiles, electric appliances and building materials |
| 07/14/2009 | US7560157 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 07/14/2009 | US7560143 paints; radiation curable binders; low temperature; adducts of polyethylene glycol-modified epoxy resins and epoxy resins with olefinically unsaturated acid |
| 07/14/2009 | US7560057 Mixing translucent liquid epoxy resin, curing agent and phosphor powder; gelation; kneading, quenching, forming stabilized molding compound resin body; grinding into powder and pressing; high speed curing, transfer molding |
| 07/14/2009 | CA2217834C Curable resin compositions |
| 07/09/2009 | WO2009085191A2 Syntactic foam compositions, pipelines insulated with same, and method |
| 07/09/2009 | WO2009084831A2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| 07/09/2009 | WO2009084656A1 Flame-resistant polyurethane imide resin, resin composition thereof and cured film |
| 07/09/2009 | WO2009084640A1 Reinforced resin composition for plating base, molded article, and electroplated component |
| 07/09/2009 | WO2009084638A1 Reinforced thermoplastic resin composition and molded article |
| 07/09/2009 | WO2009084014A2 An epoxy resin composition |
| 07/09/2009 | WO2009083564A1 Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour |
| 07/09/2009 | US20090176932 Halogen containing epoxy compositions and their preparation |
| 07/09/2009 | US20090176931 Water based curing agent formed by combining an active amine-hydrogen containing amine-functional dispersion with an active amine-hydrogen containing amine-functional curing agent in solution or emulsion form; primer, sealer, paint, filler, coating, covering, trowelling or self leveling composition |
| 07/09/2009 | US20090176903 Foamable compositions based on epoxy resins and polyesters |
| 07/09/2009 | US20090176104 Resin composition and application thereof |
| 07/08/2009 | EP2076563A1 Thermally stable cationic photocurable compositions |
| 07/08/2009 | CN101475731A Epoxy resin composite material added with modified polysiloxane and preparation thereof |
| 07/08/2009 | CN100511490C Conductive materials with electrical stability for use in electronics devices |
| 07/08/2009 | CN100509987C Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |