| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/31/2009 | US20090324958 Heat Setting Compounds Suitable for Sticking Together Coated Substrates |
| 12/31/2009 | DE10297225B4 Plättchenbefestigungsklebstoffe insbesondere für Halbleiteranwendungen Die attach adhesives, especially for semiconductor applications |
| 12/31/2009 | DE102008030904A1 Verbundmaterial mit Nano-Pulver und Verwendung des Verbundmaterials Composite with nano-powder and using the composite material |
| 12/30/2009 | WO2009157295A1 Epoxy resin composition and prepreg using same |
| 12/30/2009 | WO2009157147A1 One-liquid type cyanate epoxy composite resin composition |
| 12/30/2009 | EP2138525A1 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof |
| 12/30/2009 | EP2138522A1 Resin composition, and prepreg |
| 12/30/2009 | EP2137740A1 An impregnation medium |
| 12/30/2009 | EP2137226A1 Epoxy group-terminated polymers, their compositions and their utilisation as impact resistance modifiers |
| 12/30/2009 | EP2084200B1 Derivatized solid epoxy resin and uses thereof |
| 12/30/2009 | EP1814948B1 Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
| 12/30/2009 | EP1814947B1 Amphiphilic block copolymer-toughened epoxy resins |
| 12/30/2009 | CN101613518A Amphiphilic block copolymer-toughened thermoset resins |
| 12/30/2009 | CN101613517A Resin prepreg constitutive rubber solution and heat dissipation rubber piece and manufacturing method thereof |
| 12/30/2009 | CN100575440C Adhesive epoxy composition and process for applying it |
| 12/30/2009 | CN100575421C Wet-heat highly-resistant bismaleimide/microcapsule composite material and preparation method thereof |
| 12/30/2009 | CN100575413C Modified epoxy resin composition |
| 12/30/2009 | CN100575383C Epoxy resin composition and semiconductor device |
| 12/29/2009 | CA2540523C Low-cure powder coatings and methods for using the same |
| 12/24/2009 | US20090318636 Epoxy resins adducted with reactive liquid rubber having improved low temperature performance properties |
| 12/24/2009 | US20090318588 Thermoplastic Resin Composition with Good Heat Stability, Light Stability, and Impact Strength |
| 12/24/2009 | US20090317442 Super Elastic Epoxy Hydrogel |
| 12/23/2009 | WO2009154284A1 Multifunctional vinyl ether and resin composition containing same |
| 12/23/2009 | WO2009154186A1 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material |
| 12/23/2009 | WO2009154058A1 Epoxy resin molding material for semiconductor sealing purposes, epoxy resin sheet for semiconductor sealing purposes, and method for the production thereof |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | EP2135885A1 Resin composition for forming insulating layer of printed wiring board |
| 12/23/2009 | EP1546227B1 Polyether polyamine agents and mixtures therefor |
| 12/23/2009 | CN101609863A Fluorescent film |
| 12/23/2009 | CN101608053A Thermosetting resin composition |
| 12/23/2009 | CN101608052A Conductive die-bonding agent for led (light emitting diode) |
| 12/23/2009 | CN101608051A Insulating resin and preparation method thereof as well as insulating resin copper coated plate containing insulating resin |
| 12/23/2009 | CN101608050A Epoxy resin modified material with three-layer structure and preparation method thereof |
| 12/23/2009 | CN100572473C Radiation curable low gloss powder coating compositions |
| 12/23/2009 | CN100572446C Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| 12/23/2009 | CN100572416C Thermosetting resin composition and use thereof |
| 12/22/2009 | CA2477296C Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 12/22/2009 | CA2312508C Ultraviolet curable resin compositions having enhanced shadow cure properties |
| 12/17/2009 | WO2009150690A1 Polymer and carbon nanotubes composite materials as low-cost temperature sensors |
| 12/17/2009 | WO2009150059A1 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 12/17/2009 | US20090311651 Polyether-based preparations and use thereof |
| 12/17/2009 | US20090311535 Composite materials with improved performance |
| 12/17/2009 | US20090308642 Thermosetting resin composition |
| 12/17/2009 | US20090308534 Next generation, highly toughened two part structural epoxy adhesive compositions |
| 12/16/2009 | EP2133398A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 12/16/2009 | EP1745083B1 Highly-charged stable dental composition which may be cross-linked/polymerised by cationic reaction |
| 12/16/2009 | CN101604727A 电致伸缩复合材料及其制备方法 Electrostrictive composite material and its preparation method |
| 12/16/2009 | CN101602881A Thermosetting resin composition and application |
| 12/16/2009 | CN101602824A Photocuring composition and cured product thereof |
| 12/16/2009 | CN100570952C Extensible solid surface antenna reflective face of shape memory material |
| 12/16/2009 | CN100569851C Preparation method of carbon nano-tube/epoxy resin composite material |
| 12/16/2009 | CN100569850C Epoxy resin molding material for encapsulation and electronic device |
| 12/16/2009 | CN100569826C Self-emulsifying type aqueous latex of epoxy hardener, and preparation method |
| 12/15/2009 | US7632912 Carboxylic acid-modified bisphenol epoxy di(meth)acrylate |
| 12/15/2009 | US7632895 Curable resin composition |
| 12/15/2009 | US7632570 Aqueous resinous binders |
| 12/15/2009 | US7632559 Sound deadening and structural reinforcement compositions and methods of using the same |
| 12/15/2009 | US7632545 Radiation shielding composition and a preparation method thereof |
| 12/15/2009 | US7632423 Cost effective, functional compounds on the outer surface or inner portion of (sub-)micron inert particles; latent curing agent for thermoset resins; curing; use in microelectronic devices manufacturing, adhesives, protective coatings, encapsulants, or ink jet inks |
| 12/10/2009 | WO2009149143A1 Adhesion of polyamides to epoxy resins |
| 12/10/2009 | US20090306277 Resin systems including reactive surface-modified nanoparticles |
| 12/10/2009 | US20090301762 Oligomeric halogenated chain extenders for preparing epoxy resins |
| 12/10/2009 | DE102006044486B4 Verfahren zur Herstellung einer Randabdichtung einer Sandwichplatte mit einer Füllmasse mit einem thermisch aushärtbaren duroplastischen Kunststoffmaterial A method for producing a sealing edge of a sandwich panel with a filling material with a thermally curable thermosetting plastics material |
| 12/09/2009 | EP2129521A1 Improved surface finish for composite materials |
| 12/09/2009 | CN101597436A Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof |
| 12/09/2009 | CN101597422A Heat resistant glass resin flake material |
| 12/09/2009 | CN101597421A Non-halogen and non-phosphorus flame-retardant epoxy resin component and preparation method thereof |
| 12/09/2009 | CN101597420A Highly heat-conductive epoxy resin composition |
| 12/09/2009 | CN101597419A Preparation method for spatial structure ordered inflaming retarding heat-conducting type resin-matrix composite material |
| 12/09/2009 | CN101597418A Electric insulation heat-conducting resin composite material and preparation method thereof |
| 12/09/2009 | CN101597417A High-temperature resistant and high-toughness epoxy matrix resin as well as preparation method and application thereof |
| 12/09/2009 | CN101597416A Circuit carrier plate constituent and manufacture method thereof |
| 12/09/2009 | CN101597396A Polymer-based positive temperature coefficient thermistor material |
| 12/09/2009 | CN101597385A Preparation method of modified ultra-thin fire-resistant coating polymer matrix based on silsesquioxane |
| 12/09/2009 | CN101597377A Methyl end-blocked polysiloxane compound co-modified with alkyl, polyether, epoxy and phenyl and preparation method and application thereof |
| 12/09/2009 | CN101597308A Preparation method of hexaaniline cyclotriphosphazene and non-halogen flame retardant epoxy resin composition |
| 12/09/2009 | CN100567436C Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 12/09/2009 | CN100567393C Preparation method of epoxy resin composite material with surface modified spherical SiO2 particles |
| 12/09/2009 | CN100567353C Coloring resin composition, color filter, and liquid-crystal display |
| 12/08/2009 | US7629398 for encapsulating semiconductors; acrylonitrile-butadiene copolymers; polysiloxanes |
| 12/08/2009 | CA2380403C Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| 12/03/2009 | WO2009145224A1 Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 12/03/2009 | WO2009145179A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 12/03/2009 | WO2009144955A1 Cured epoxy resin material and epoxy resin adhesive |
| 12/03/2009 | WO2009108001A3 Resin composition for manufacturing marble chips, method for manufacturing marble chips using the same, and artificial marble made from marble chips |
| 12/03/2009 | US20090298960 Ductile structural foams |
| 12/03/2009 | US20090297856 Adhesion promoter composition comprising epoxy resin |
| 12/03/2009 | US20090295003 Resin composition for optical components, optical component using the same and production method of optical lens |
| 12/03/2009 | DE102008026266A1 Molded body from granules of olive stones and crosslinked adhesive comprising reactive adhesive made of two-component epoxy adhesive, two- or one-component-polyurethane-adhesive, useful as floor covering and soundproofing molded body |
| 12/03/2009 | DE102008025484A1 Wärmeleitfähiger Verbundwerkstoff mit Aluminium-Pulver, Verfahren zum Herstellen des Verbundwerkstoffs und Verwendung des Verbundwerkstoffs Thermally conductive composite material with aluminum powder, method of manufacturing the composite and use of the composite material |
| 12/02/2009 | EP2128919A1 Polyelectrolyte composition, polyelectrolyte membrane, membrane electrode assembly, and solid polymer electrolyte fuel cell |
| 12/02/2009 | EP2128210A1 Adhesive compound containing epoxy resin |
| 12/02/2009 | EP2128183A1 Resin composition for optical components, optical component using the same and production method of optical lens |
| 12/02/2009 | EP2128182A1 Heat hardened epoxy resin compound containing a catalyst with heteroatoms |
| 12/02/2009 | EP2125969A1 Block functionalization methods |
| 12/02/2009 | EP2125901A1 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 12/02/2009 | EP1904578B1 Toughened compositon |
| 12/02/2009 | CN101595180A A cathodic electrodeposition coating compositions having improved appearance, anti-corrosion resistance and flexibility |
| 12/02/2009 | CN101591471A Resin composition for processing halogen-free copper foil base plate materials |
| 12/02/2009 | CN101591466A Adhesive compound containing epoxy resin |