| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/30/2008 | US20080265438 Liquid epoxy resin composition and semiconductor device |
| 10/30/2008 | CA2682549A1 Composite material with blend of thermoplastic particles |
| 10/29/2008 | EP1840166B1 Curable composition |
| 10/29/2008 | CN101296998A Resin composition, resin film, cover lay film, interlayer adhesive, metal clad laminate and multilayer printed circuit board |
| 10/29/2008 | CN101295739A Conductive slurry for solar battery front side electrode and production method thereof |
| 10/29/2008 | CN101293970A Preliminary dip material for wind-driven generator impeller vane |
| 10/29/2008 | CN101293960A Polyamine composition |
| 10/29/2008 | CN100429768C Vice mounting board and semiconductor apparatus using device mounting board |
| 10/28/2008 | US7442729 Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt |
| 10/28/2008 | US7442434 Epoxy resin composition |
| 10/23/2008 | WO2008127556A1 Pre-impregnated composite materials with improved performance |
| 10/23/2008 | WO2008126825A1 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
| 10/23/2008 | US20080262153 Thermosetting Powder Paint Composition and Polyester Resin Which Can be Used for Its Manufacture |
| 10/23/2008 | US20080262135 Reaction product of phosphine and protonated haloaryl compound and use as epoxy curing accelerator |
| 10/23/2008 | US20080262128 Polymer Brushes |
| 10/23/2008 | US20080261511 Wireless local loop antenna |
| 10/23/2008 | CA2682943A1 Pre-impregnated composite materials with improved performance |
| 10/22/2008 | EP1709119B1 Gelator-stabilized crystalline resins |
| 10/22/2008 | CN101292004A Coating compositions and methods |
| 10/22/2008 | CN101291990A Thermosetting resin composition and use thereof |
| 10/22/2008 | CN101289570A Epoxy soybean oil resin based rigid cellular plastic and method for preparing same |
| 10/22/2008 | CN101289569A Method for preparing multi-wall carbon nano-tube/epoxide resin wave- absorbing and camouflage composite material |
| 10/22/2008 | CN101289568A Method for preparing cobalt-plating carbon nano-tube/epoxide resin wave- absorbing and camouflage composite material |
| 10/22/2008 | CN100427534C Polymer type phosphatic fire retardant, preparation method and usage |
| 10/21/2008 | US7439310 Polyphenylene ether modified by reaction with cresol novolac epoxy resin |
| 10/21/2008 | US7439304 dynamically-cured ethylene-ethylidenenorbornene-propylene rubber with phenolic resin, a polypropylene thermoplastic resin, stannous chloride, zinc oxide heat stability agent; tensile strength retention |
| 10/21/2008 | US7439285 to enable printing of high performance thermosetting compound by ink-jet onto printed circuit boards, without scarifying the requirements from the cured layer; comprises solid latent curing agent characterized by a maximal particle size of less than 2 microns and an epoxy-based resin |
| 10/21/2008 | US7438958 Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same |
| 10/21/2008 | US7438782 Extruding epoxy/elastomer adduct, core/shell polymer impact modifier, blowing agent, thermoplastic polyethers, curing agent; and filler; activating to bond to the first and second surfaces; sealing, baffling, adhering or reinforcing automotive vehicle. |
| 10/21/2008 | CA2335050C Polycationic polymers, their production and use |
| 10/16/2008 | WO2008123326A1 Thermosetting resin composite composition, resin molded body, and method for producing the composition |
| 10/16/2008 | WO2008123110A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 10/16/2008 | WO2008123087A1 Anisotropic conductive paste |
| 10/16/2008 | WO2008064959A3 Metal compounds for use as initiators |
| 10/16/2008 | WO2007142731A3 High elastic modulus polymer electrolytes |
| 10/16/2008 | US20080255321 Bonded Composite of Silicone Resin and Epoxy Resin and a Method For Manufacturing Thereof |
| 10/16/2008 | US20080255306 Laminates; printed circuits; epoxy resin containing both bisphenol a and tetrabromobisphenol a |
| 10/16/2008 | US20080251935 Low shrinkage polyester thermosetting resins |
| 10/16/2008 | US20080251757 Latent Hardener For Epoxy Resin and Epoxy Resin Composition |
| 10/16/2008 | US20080251202 Heat-resistant structural epoxy resins |
| 10/16/2008 | DE10242897B4 Kationische Harzmasse und Verwendung derselben zur kationischen Elektroabscheidung und zur Beschichtung eines Gegenstands sowie Vernetzungsmittel Cationic resin composition and use thereof for cationic electrodeposition coating and an object as well as cross-linking agent |
| 10/16/2008 | DE102005051611B4 Wärmehärtende Harzzusammensetzung, und Verfahren zur Herstellung eines Prepreg,einer metallbeschichteten, laminierten Platte und einer Platine mit gedruckter Schaltung unter Verwendung derselben A thermosetting resin composition, and process for producing a prepreg, a metal-coated laminated plate and a printed circuit board using the same |
| 10/15/2008 | EP1979392A1 Non-aqueous, liquid coating compositions |
| 10/15/2008 | EP1532219B1 Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 10/15/2008 | CN101287794A Epoxy compositions having improved impact resistance |
| 10/15/2008 | CN101284942A Resin composition for crazy horse leather resin composition |
| 10/15/2008 | CN100425651C Structure-type wave-absorption composite material containing magnetic glass fiber and preparation method thereof |
| 10/15/2008 | CN100425650C Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 10/14/2008 | US7435767 Manufacturing sides of amine curing agent and rubber toughener, and epoxy resin and epoxide-containing toughener |
| 10/14/2008 | US7435451 Applying a topcoat onto the primer coating, prepared from an amine curing agent, toughening agents, fire retardant, a glass fiber thixotrope, a pigment, and an abrasive aggregate; non-skid surface for boat decks etc. |
| 10/14/2008 | US7435449 Cures under normal conditions and adheres to surfaces including masonry, concrete and metal; anti-corrosion protection, quicker application at a reduced cost; stored and transported as a two-component emulsion, where each part is a pourable liquid |
| 10/14/2008 | CA2322517C Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition |
| 10/09/2008 | WO2008075279A3 Biodegradable polymeric derivatives |
| 10/09/2008 | US20080249227 Blend of biodegradable polyester and a polyolefin |
| 10/09/2008 | US20080246185 Composition of led frame body and manufacturing method thereof |
| 10/08/2008 | EP1978058A1 Low odor binders curable at room temperature |
| 10/08/2008 | EP1976928A1 Molding compositions containing modified polybutylene terephthalate (pbt) random copolymers derived from polyetheylene terephthalate (pet) |
| 10/08/2008 | EP1874870B1 Curable silicone composition and electronic components |
| 10/08/2008 | CN101283048A Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 10/08/2008 | CN101283047A Poly(arylene ether) composition, method, and article |
| 10/08/2008 | CN101280093A Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate |
| 10/08/2008 | CN101280056A Method for preparing C21dicarboxylic acid polyamide epoxy hardener from methyl eleostearate |
| 10/08/2008 | CN100424571C Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/08/2008 | CN100424132C Polyester block copolymer composition |
| 10/08/2008 | CN100424131C Polyester block copolymers and process for the preparation thereof |
| 10/07/2008 | US7432603 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 10/07/2008 | US7432335 Reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the reaction product with a compound exhibiting good affinity for both; storage stability, additive for sealing resins, paints |
| 10/07/2008 | US7432334 Silicone-modified single-component casting compound |
| 10/07/2008 | US7432333 Powder coating of amino-urea or urethane catalyst and epoxy/hydroxy and/or siloxane resin |
| 10/07/2008 | US7431990 Epoxyphenylphenolic resin, phenolic resin, inorganic filler, curing accelerator, silane coupling agent, and compound containing naphthalene ring in which at least two adjacent carbon atoms are coupled to hydroxyl groups; flowability, moldability, crack resistance during soldering, flame retardance |
| 10/07/2008 | CA2514428C Preformed compositions in shaped form |
| 10/02/2008 | US20080242768 Heat and chemical resistance, dimensional stability; controlled surface resistivity of encapsulated molded product, electrical insulating property; epoxy resin, curing agent, resistive carbon precursor and conductive filler |
| 10/02/2008 | US20080241533 Sizing compositions and glass fiber reinforced thermoplastic composites |
| 10/02/2008 | US20080237617 Adhesive Sheet for Light-Emitting Diode Device and Light-Emitting Diode Device |
| 10/01/2008 | CN101275030A Modified asphalt |
| 10/01/2008 | CN101275024A Modified asphalt |
| 10/01/2008 | CN101275020A Asphalt |
| 10/01/2008 | CN101275017A Asphalt |
| 10/01/2008 | CN101275007A Novel flame-retardant epoxy resins |
| 10/01/2008 | CN101275006A Preparation of special flame-proof heat-resistant material for ABS |
| 10/01/2008 | CN101274998A Heat-resistant flame-proof phosphorus- and silicon-containing hybrid curing agent for epoxy type electronic polymer material and preparation thereof |
| 10/01/2008 | CN100422261C Cyanate resin/ carbon fiber composite material and its preparing process |
| 10/01/2008 | CN100422244C Resin composition, prepreg, laminate, and semiconductor package |
| 10/01/2008 | CN100422235C Electric insulated resin pulp used for chip carrying and packaging |
| 10/01/2008 | CN100422234C Autodepositing anionic epoxy resin water dispersion |
| 09/30/2008 | US7429800 Molding composition and method, and molded article |
| 09/30/2008 | US7429419 Heat activatable adhesive tape for bonding electronic components and conductor tracks |
| 09/30/2008 | CA2380387C Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 09/25/2008 | WO2008114846A1 Liquid crystal aligning agent and liquid crystal display |
| 09/25/2008 | WO2008113845A1 Epoxy group-terminated polymers, the compositions thereof and the use thereof as impact resistance modifiers |
| 09/25/2008 | US20080234409 Sealant Epoxy-Resin Molding Material, and Electronic Component Device |
| 09/25/2008 | US20080230749 Low molecular weight unsaturated polyester; thermosetting agent for bonding |
| 09/25/2008 | US20080230261 flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene |
| 09/24/2008 | EP1972660A1 Conductive composition, conductive paint, and method of forming conductive paint |
| 09/24/2008 | EP1972646A1 Time-phased epoxy group polymers, their compositions and their utilisation as impact resistance modifiers |
| 09/24/2008 | EP1702938B1 Curable silicone composition and its use as adhesive |
| 09/24/2008 | EP1478695B1 Silicone resin composition, curable resin composition, and cured resin |
| 09/24/2008 | CN101273089A Resin composition for sealing optical semiconductor element and optical semiconductor device obtained by using the same |
| 09/24/2008 | CN101270278A Netted sand prevention material |
| 09/24/2008 | CN101270222A Thermosetting powders comprising curing agent adducts of polyesters and strong, flexible powder coatings made therefrom |