| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/09/2008 | CN101215386A Preparation method for nylon fibre enhanced epoxy resin composite resin |
| 07/09/2008 | CN101215369A Optical cured resin, photosensitive resin composition and preparation method thereof |
| 07/09/2008 | CN101215358A Prepolymer and thermosetting resin composition prepared by the same |
| 07/09/2008 | CN100401189C Photo-curable and thermosetting resin composition |
| 07/09/2008 | CN100400592C Fire tetardant no-halogen epoxy resin glue and its prepn process and use |
| 07/08/2008 | US7398049 Wireless local loop antenna |
| 07/08/2008 | US7396902 Epoxy resin curing agent of aliphatic diamine/styrene addition product |
| 07/08/2008 | US7396885 A blends comprising an adduct of epoxidized phenolic resins with (meth)acrylic acid, a (meth)acrylates, a liquid epoxy resins and curing agents; noncracking, solder-resistance, corrosion resistance, durability |
| 07/08/2008 | US7396588 Halogen-free flame retarders; mixture with polymer, curing agents and solvent; laminate of dielectric overcoating substrate; for use in the production of insulation films, flame retardancy, having excellent electrical insulation |
| 07/03/2008 | WO2008080067A2 Curative systems useful in structural foams |
| 07/03/2008 | WO2008079440A2 Super elastic epoxy hydrogel |
| 07/03/2008 | WO2008078967A1 Epoxy resin, epoxy resin composition having the same, paint composition and method of forming a coating layer using the same |
| 07/03/2008 | WO2008055768A3 Compositions containing phosphonate-functional particles |
| 07/03/2008 | US20080161504 Adhesives; sealants |
| 07/03/2008 | US20080161449 Biodegradable Polyester Mixture |
| 07/03/2008 | US20080160860 Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Fiber-Reinforced Composite Material |
| 07/03/2008 | CA2657435A1 Super elastic epoxy hydrogel |
| 07/02/2008 | EP1937786A1 Coating compositions and methods |
| 07/02/2008 | CN101210169A Liquid crystal sealing agent composition and preparing method thereof |
| 07/02/2008 | CN101210168A Packaging material composition |
| 07/02/2008 | CN101210111A Organic/inorganic composite material and fire-proof plate containing the same |
| 07/02/2008 | CN101210099A Luminous graving and preparing process thereof |
| 07/02/2008 | CN101210095A Half-thermosetting anisotropic conductive film composition |
| 07/02/2008 | CN101210077A Halogen-free refractory composition |
| 07/02/2008 | CN100398592C Flame-proof agent and flame-proof resin composition comprising same, and its uses |
| 07/01/2008 | US7393904 (Meth)acrylate-terminated polyphenylene ether |
| 07/01/2008 | US7393895 curable compositions that allow the poly(arylene ether) to remain in a workable state in the thermosetting resin at a temperature suitable for addition of a low-temperature cure agent; amine curing agent |
| 06/26/2008 | WO2008077140A2 Hydrolytically resistant thermoset monomers |
| 06/26/2008 | WO2008076211A1 Low odor, fast cure, toughened epoxy adhesive |
| 06/26/2008 | WO2008075510A1 Stabilizer for chlorinated polymer and chlorinated-polymer composition |
| 06/26/2008 | US20080153973 Spin-Printing of Electronic and Display Components |
| 06/25/2008 | EP1935944A2 Flame-retardant resin composition |
| 06/25/2008 | EP1934407A2 Epoxy sealer/healer for sealing strengthening cracked concrete |
| 06/25/2008 | EP1165712B1 Polyester powder coating compositions |
| 06/25/2008 | CN101208636A Toner and toner production process |
| 06/25/2008 | CN101208386A Epoxy resin composition for sealing semiconductor device and semiconductor device using the same |
| 06/25/2008 | CN101208385A Composition, treated backing, and abrasive articles containing the same |
| 06/25/2008 | CN101205686A Method for improving interfacial properties of aramid fiber/epoxy resin composite material |
| 06/25/2008 | CN101205355A Flame-retardant reinforced Poly(trimethylene terephthalate) composite material and preparation technique thereof |
| 06/25/2008 | CN101205349A High-conductivity epoxy moulding material having heat conducting path and manufacturing method thereof |
| 06/25/2008 | CN101205313A Method for preparing epoxy toughening deflocculating agent |
| 06/25/2008 | CN100397100C Fine particle dispersion composition, optical component, optical film laminate, polarization splitting element |
| 06/25/2008 | CN100396747C Acrylic adhesive sheet |
| 06/25/2008 | CN100396730C Conductive composition, conductive film, and process for the formation of the film |
| 06/24/2008 | US7390859 curable polythioethers and fatty acid modified epoxy resin which has hydrophobicity of the backbone, increased hydrophobicity can reduce the permeation of gases and/or moisture; adhesion upon exposure to fuel where low temperature flexibility; sealant use in aviation, aerospace, fuel tank linings |
| 06/24/2008 | US7390858 Coating compositions and methods |
| 06/24/2008 | US7390765 Catalyst of reaction product of polyisocyanate and tertiary amino group-containing amine, alcohol or polyol |
| 06/24/2008 | US7390571 mixing epoxy resins, dicyandiamide, a curing agents having imidazole rings and fillers, then heating the mixture in solvents to enhance compatibility and form a uniform dispersion; electrical insulation and fireproofing |
| 06/24/2008 | US7390570 a mixture of bismaleimide terminated acrylonitrile-butadiene rubbers, epoxy resins and curing agents, used to form prepregs exhibiting excellent toughness and long term stability, by impregnating with reinforcement fibers; |
| 06/19/2008 | WO2008073682A1 Light reflecting resin composition, light emitting apparatus and optical display apparatus |
| 06/19/2008 | WO2008072769A1 Epoxy resin composition for fiber reinforced composite material |
| 06/19/2008 | WO2008072651A1 Photobase generator and photocurable resin composition |
| 06/19/2008 | WO2008072630A1 Polyamide resin, epoxy resin composition using the same, and use of the composition |
| 06/19/2008 | WO2008071363A2 Hybrid cationic curable coatings |
| 06/19/2008 | WO2008051373A3 Curable epoxy resin composition having improved adhesion to metal substrates and process for making coated and fiber-reinforced composite article |
| 06/19/2008 | US20080142158 Hydrolytically resistant thermoset monomers |
| 06/19/2008 | DE10297224B4 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zum Verbinden von Substraten und Verwendung eines derartigen Klebstoffs zur Verknüpfung und Verbindung von Substraten einer Halbleitervorrichtung Die attach adhesives for semiconductor applications, and methods of bonding substrates using such an adhesive for bonding substrates and linking of a semiconductor device |
| 06/19/2008 | DE102007059331A1 Kautschukzusammensetzung, umfassend Oxiranharz sowie ein solch eine Zusammensetzung enthaltender Reifen A rubber composition comprising a Oxiranharz and such a composition containing tire |
| 06/19/2008 | DE102006059720A1 Salze von unsymetrisch substituierten Bis-(1-Hydroxymethyl)-Phosphinsäuren Salts of unsymmetrically substituted bis (1-hydroxymethyl) phosphinic acids |
| 06/18/2008 | EP1704185B1 Reactive thermosetting system with long storage life |
| 06/18/2008 | EP1275695B1 Curable composition and multilayered circuit substrate |
| 06/18/2008 | CN101202039A Method for preparing glue powder sound absorption complex material |
| 06/18/2008 | CN101200573A Halon-free intumescent fire-retardant epoxy resin compound |
| 06/18/2008 | CN101200537A Thermoplastic composite material and preparation method thereof |
| 06/17/2008 | US7388044 Blend of addition polymer and epoxy resin |
| 06/17/2008 | US7387812 Heat-curable resin composition |
| 06/17/2008 | US7387718 reduces environmental pollution problems and does not have any defect of appearance caused by hydrogen gas; polyisocyanate curing agent including partially blocked isocyanate functional groups is prepared |
| 06/12/2008 | WO2008070825A1 Vibration damping polymer composites |
| 06/12/2008 | WO2008069343A1 Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition |
| 06/12/2008 | WO2008069239A1 Resin molded product with high level of surface design and article having the resin molded product on its surface |
| 06/12/2008 | WO2008069179A1 Sealing material and mounting method using the sealing material |
| 06/12/2008 | WO2008069178A1 Sealing material and mounting method using the sealing material |
| 06/12/2008 | US20080139758 Polymerizable Composition |
| 06/12/2008 | US20080139728 Composition Containing a Hydrogenated Bisglycidyl Ether and a Cross-Linking Agent |
| 06/12/2008 | US20080139442 Highly Concentrated, Aqueous Oligoester And Polyester Formulations |
| 06/11/2008 | EP1624038B1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 06/11/2008 | CN101195701A Epoxy resin shape memory polymer material and method for producing the same |
| 06/11/2008 | CN101195700A Light emitting diode frame body component and manufacturing method thereof |
| 06/11/2008 | CN101195487A Amorphous fine silicon dioxide particles, producing method and uses thereof |
| 06/11/2008 | CN100393802C Resin composition, and use and method for preparing the same |
| 06/11/2008 | CN100393708C Fluoro epoxide and its preparation method and use |
| 06/10/2008 | US7384682 Reacted with a polyarylene ether flexibilizer; thermoplastic poly(2,3-epoxy-2-methyl ether) thermoplastic; spheriodal particle filler; higher fracture toughness, lower viscosity or increased thermal shock resistance at below -40 degrees C.; encapsulated semiconductor chips |
| 06/10/2008 | CA2359035C Resin composition, molded products formed therefrom and use thereof |
| 06/10/2008 | CA2349891C Sound deadening and structural reinforcement compositions and methods of using the same |
| 06/05/2008 | WO2008064959A2 Metal compounds for use as initiators |
| 06/05/2008 | US20080132629 Synthesis of new dihydrobenzoxazine |
| 06/05/2008 | US20080131639 Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same |
| 06/05/2008 | US20080128928 Methods of Making Light Diffusing Films and Articles Using the Same |
| 06/05/2008 | US20080128922 Epoxy resin composition for encapsulating semiconductor and semiconductor device |
| 06/05/2008 | DE102006057142A1 Metallverbindungen als Initiatoren Metal compounds as initiators |
| 06/05/2008 | DE102006056311A1 Use of guanidine derivatives as accelerators for hardening epoxy resin systems |
| 06/05/2008 | CA2671073A1 Metal compounds for use as initiators |
| 06/04/2008 | EP1848754B1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 06/04/2008 | EP1837383B1 Die-attach composition for high power semiconductors |
| 06/04/2008 | CN101193975A Hardenable resin composition |
| 06/04/2008 | CN101193961A Flame retardant composition exhibiting superior thermal stability and flame retarding properties and use thereof |
| 06/04/2008 | CN101191007A Method for preparing resin-base composite material containing metal particle |
| 06/04/2008 | CN101191006A Controllable solidifying type technologic clay sculpture material |
| 06/04/2008 | CN100392386C Method for packaging electrochemical working electrode by nano material toughened epoxy resin |
| 06/04/2008 | CN100392015C Composite fiber plate and preparing method |