Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
12/2008
12/10/2008CN100441608C Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
12/04/2008WO2008147079A1 Epoxy resin mortar composition and coating method on the surface of the concrete
12/04/2008WO2008146908A1 Insulating resin composition
12/04/2008US20080300361 Method for Chemical Anchoring
12/04/2008US20080300344 Adjuvant for Hydraulic Compositions
12/04/2008US20080299323 Powder clear coating composition
12/04/2008DE102007025870A1 Hitzehärtbarer, thermisch expandierbarer Formkörper mit Langfasern oder Fasergebilden Thermosetting, thermally-expandable molded body with long fibers or fiber structures
12/03/2008EP1997843A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
12/03/2008EP1997835A1 Polymer and epoxy resin compositions
12/03/2008EP1493780B1 Conductive composition, conductive film, and process for the formation of the film
12/03/2008CN101314664A Preparation method for rare earth modified carbon nano-tube/epoxy resin composite material
12/03/2008CN100439446C Surface improver for reinforced composite compositions
12/03/2008CN100439428C Polymer composite formed article, printed wiring board using the formed article and method for producing them
12/02/2008US7459504 Reaction product of polyamine and acyclic carbonate
12/02/2008CA2230604C Compositions containing 1,3,5-triazine carbamates and epoxy compounds
11/2008
11/27/2008WO2008144252A1 Flame retardant composition
11/27/2008WO2008143128A1 Resin composition, and film-forming material comprising the same
11/27/2008WO2008143085A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained by using the same
11/27/2008WO2008143044A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material
11/27/2008WO2008143016A1 Epoxy resin composition for sealing, and electronic component device using the same
11/27/2008WO2008142998A1 Cross-linked silicone particles and method of manufacturing thereof
11/27/2008WO2008142997A1 Curable epoxy resin composition and cured body thereof
11/27/2008US20080293870 Curing Agents for Epoxy Resins
11/26/2008EP1995271A1 Epoxy resin curable composition for prepreg
11/26/2008EP1995266A1 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those
11/26/2008EP1995264A1 Curable composition for optical material and optical waveguide
11/26/2008EP1993966A2 Sizing for high performance glass fibers and composite materials incorporating same
11/26/2008EP1836260B1 Bonded composite of silicone resin and epoxy resin and a method for manufacturing thereof
11/26/2008CN101313029A Sealing epoxy resin forming material and electronic component device
11/26/2008CN101313007A Cured composition
11/26/2008CN101313006A Liquid resin composition for electronic parts and electronic parts device
11/26/2008CN101311217A Process for synthesizing high molecular nanometer composite material with pressure-sensitive performance and use
11/26/2008CN100436533C Liquid hydrocarbon evaporation inhibitor
11/26/2008CN100436400C Method of producing glycidyl 2-hydroxyisobutyrate
11/25/2008US7456235 Flame-retardant composition for coating powders
11/25/2008US7456230 Cationically photocurable epoxy resin compositions
11/25/2008US7455674 Tensile strength; sutures; tensioning fiber under tension, drawing
11/25/2008CA2631972A1 Fuel cell separator resin composition and fuel cell separator
11/20/2008WO2008139736A1 Liquid crystal panel mounting substrate, and method for producing the same
11/20/2008US20080287612 Cationic Electrodeposition paint compositions
11/20/2008US20080287595 Amphiphilic Block Copolymer-Toughened Thermoset Resins
11/20/2008US20080285247 Low Exothermic Thermosetting Resin Compositions Useful As Underfill Sealants and Having Reworkability
11/20/2008DE102007023228A1 Plastic material, comprises matrix material and embedded fibers, where fibers are partially conducting
11/20/2008CA2686839A1 One-part non-toxic spray foam
11/19/2008EP1992653A1 Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material
11/19/2008EP1991608A1 Highly filled composite materials
11/19/2008EP1432770B1 Coating compositions having epoxy functional stabilizer
11/19/2008EP1153941B1 Polymer and epoxy resin compositions
11/19/2008CN101309944A Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product
11/19/2008CN101307220A Organosilicon modified polyester electronic packaging material
11/19/2008CN101307183A Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
11/19/2008CN101307172A Method for preparing epoxy resin composition
11/19/2008CN101307171A Phosphorus-containing polyester fire retardant epoxy resin composition
11/19/2008CN101307170A Fire retardant phosphorus-containing epoxy powder composition
11/19/2008CN101307155A Fire retardant crosslinking agent and halogen free, non-phosphate and fire retardant epoxy resin composition
11/19/2008CN100434482C Transparent glass fishing rod and its production process
11/19/2008CN100434474C Reinforced rubber sheet basal body composite resin for car
11/19/2008CN100434473C Nano vacuum restoration agent and its preparation and application
11/19/2008CN100434472C Resin composition for color filter protective film and color filter
11/13/2008WO2008136096A1 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate
11/13/2008WO2008135523A1 Method and device for cleaning an absorptive polyester
11/13/2008WO2007100816A3 Sizing for high performance glass fibers and composite materials incorporating same
11/13/2008US20080280127 Comprising a heat-curable epoxy-containing material, a thermoplastic component and a curing agent for the epoxy-containing material; ethylene-glycidyl (meth)acrylate copolymer; less likely to prematurely cure inside the pellet; enhanced storage stability; easily and uniformly mixed; kneading
11/13/2008US20080279809 Coating material for metal surfaces having antiadhesive properties
11/13/2008CA2686045A1 Process and apparatus for the purification of a resorbable polyester
11/12/2008CN101305049A Flame retardant prepregs and laminates for printed circuit boards
11/12/2008CN101304637A Wiring forming method of printed circuit board
11/12/2008CN101302327A Halogen-free fire-resistant epoxy resin composition, film and copper clad laminate
11/12/2008CN101302326A Flame retardant resin composition
11/12/2008CN101302304A Preparation of epoxide resin based foam material
11/12/2008CN101302302A Semi-prepreg for wind power generator vane and production process thereof
11/12/2008CN100432613C Corrosion-resistant agent and heat exchanger with it
11/12/2008CN100432150C Moldable poly(arylene ether) thermosetting compositions, methods, and articles
11/12/2008CN100432144C Resin composition and its uses in adhesive sheet and copper-cladded plate
11/12/2008CN100432143C Thermoset resin compsns. and its mfg. method
11/12/2008CN100432130C Epoxy resin compositions containing phosphorus and its uses
11/12/2008CN100432081C Novel hydroxyaryl phosphine oxides,diglycidyl ethers and epoxy compositions, composites and laminates derived therefrom
11/12/2008CN100432063C Epoxy compound, preparation method thereof, and use thereof
11/11/2008US7449526 Thermoset resin composition of a hydroxy-terminated oligomeric phosphonate of diphenyl methyl-phosphonate and resorcinol and another flame retardant; circuit boards
11/06/2008WO2008133246A1 Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board
11/06/2008WO2008133108A1 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof
11/06/2008WO2008133054A1 Resin composition, and prepreg
11/06/2008CA2683073A1 Resin composition, and prepreg
11/05/2008CN101298509A Nanometer grade paligorskite-flame retardant epoxide resin composite material
11/05/2008CN100430451C Sprayable adhesive material for laser marking semiconductor wafers, dies and devices
11/05/2008CN100430436C Reinforced sheet composition for vehicle metal plate
11/05/2008CN100430427C Electronic material composition, electronic product and method of using electronic material composition
11/04/2008US7446137 Thermosetting resin and thiocyanato-containing organohydrocarbonoxysilane
11/04/2008CA2464241C Self-priming coil coating compositions and method
10/2008
10/30/2008WO2008131451A2 Pva-paa hydrogels
10/30/2008WO2008131222A1 Climbing devices based on thermo-reversible dry adhesives
10/30/2008WO2008131204A1 Method for robotic handling using thermo-reversible dry adhesives
10/30/2008WO2008130484A1 Composite material with blend of thermoplastic particles
10/30/2008WO2008129986A1 Colored resin composition, color filter, liquid crystal display device, and organic el display
10/30/2008WO2008129032A1 An impregnation medium
10/30/2008US20080269430 Low temperature curing coating powder
10/30/2008US20080269428 Epoxy resin curing agents: imidazole ring-containing product of reacting a polyalkylenepolyamine and a fatty monocarboxylic acid additionally reacted with a monofunctional, aromatic epoxide; mouldings and sheetlike structures; adhesives and sealants;
10/30/2008US20080269427 Polyphenylene ether oligomer compound, derivatives thereof and use thereof
10/30/2008US20080268379 a polyester copolymer of fumaric acid and a diglycidyl ether with backbone of groups selected from substituted or unsubstituted alkylene, phenylene, napthylene, anthrylene, phthalic acid, triazinetrione etc. 1,3,4,6-tetrakis(methtoxymethyl)glycoluril crosslinker, a sulfonium or iodonium acid generator
10/30/2008US20080268239 Reinforced polymeric materials, methods of manufacture thereof and articles comprising the same