| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 01/08/2009 | US20090012232 Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition |
| 01/08/2009 | US20090012203 Epoxy Resin and Epoxy Resin Composition |
| 01/08/2009 | US20090011244 Anti-fogging article and anti-fogging agent composition |
| 01/08/2009 | US20090011166 Adhesive tape composition for electronic components |
| 01/08/2009 | US20090008834 Curable resin composition, molded product, and process for producing the same |
| 01/08/2009 | US20090008826 Method For Production Of Objects From Thermosetting Resins |
| 01/08/2009 | US20090008127 Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board |
| 01/08/2009 | DE102007029531A1 Harzdispersion Resin dispersion |
| 01/07/2009 | EP2011827A1 Polyester resin composition and molded body |
| 01/07/2009 | EP2011826A1 Epoxy resin composition for fiber-reinforced composite material |
| 01/07/2009 | EP2011825A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 01/07/2009 | CN101341213A Damage-resistant epoxy compound |
| 01/07/2009 | CN101341212A Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 01/07/2009 | CN101341181A A curable epoxy resin composition and laminates made therefrom |
| 01/07/2009 | CN101338187A Photoluminescent transparent epoxy nanometer composite material, preparation method and application thereof |
| 01/07/2009 | CN101338066A Transparent epoxy nanometer composite material, preparation method and application thereof |
| 01/07/2009 | CN101338065A Prepreg with flame resistance |
| 01/07/2009 | CN101338064A Liquid epoxy resins emulsion and water-soluble epoxy terrace coating prepared thereby |
| 01/07/2009 | CN100448930C Process of preparing engineering plastics with recovered polyethylene terephthalate |
| 01/07/2009 | CN100448909C Light sensitive element packaging material combination and using method thereof |
| 01/06/2009 | US7474009 Optoelectronic molding compound that transmits visible light and blocks infrared light |
| 01/06/2009 | US7473717 Suitable for the production of thermosetting laminated bodies with a tacky surface; laminated bodies can be produced and handled in a simple manner and are suitable for stiffening and reinforcing flat structural components, in particular vehicle body structural components, such as vehicle body frames |
| 01/02/2009 | DE10239091B4 Harzformulierung und ihre Verwendung Resin formulation and their use |
| 01/01/2009 | US20090005519 Supramolecular Polymers |
| 01/01/2009 | US20090005508 PVC and for example, Epoxidized Propylene Glycol Monoester of Soybean Oil Fatty Acids; latex coatings, renewable plasticizers for PVC |
| 01/01/2009 | US20090005503 Process for preparing water-soluble polyhydroxyaminoether |
| 12/31/2008 | WO2009001658A1 One-pack type cyanate/epoxy composite resin composition |
| 12/31/2008 | WO2009001448A1 Thermosetting resin composition and process for producing the same |
| 12/31/2008 | CN101334121A Automobile fuel oil conduit and method for making same |
| 12/31/2008 | CN101333327A Composite modified polyphenylene oxide/epoxy material for printing circuit coller clad plate and method for preparing same |
| 12/31/2008 | CN101332647A Shape memory polymer and preparation method and use of compound material intelligent die thereof |
| 12/31/2008 | CN100447196C Process for producing modified epoxy resin |
| 12/31/2008 | CN100447176C Epoxy resin curing agent of containing phosphor, prepartion method and applicaiton |
| 12/30/2008 | US7470755 Polythioethers; polysulfides; primer systems; corrosion resistance |
| 12/30/2008 | US7470754 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight |
| 12/30/2008 | US7470752 improved stability, performance |
| 12/30/2008 | US7470564 Flip-chip system and method of making same |
| 12/30/2008 | US7470471 Resin composition, prepreg and laminate using the composition |
| 12/25/2008 | US20080319105 Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| 12/25/2008 | US20080318005 Crosslinkable Graft Polymer Non-Preferentially Wetted by Polystyrene and Polyethylene Oxide |
| 12/25/2008 | US20080317942 Sealant for ink jet head, ink jet head, and ink jet recording apparatus |
| 12/24/2008 | WO2008157571A2 Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| 12/24/2008 | EP1885800B1 Polymeric composite material for cold moulding and a process for obtaining it |
| 12/24/2008 | EP1765946B1 Radiation curable low gloss powder coating compositions |
| 12/24/2008 | CN101328305A Halogen-free flame-retardant PBT/PC alloy composition and method of preparing the same |
| 12/24/2008 | CN101328302A Epoxide resin based piezoelectric damping composite material and method for preparing the same |
| 12/24/2008 | CN101328301A Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| 12/24/2008 | CN101328276A Preparation of single wall carbon nanotube-polymer conductive composite film |
| 12/24/2008 | CN100445321C Binder resin for toner, method for producing same, and toner for electrophotography using such resin |
| 12/24/2008 | CN100444961C Catalyst system for ethylene (co)-polymerization |
| 12/18/2008 | WO2008154122A1 Insulation coating composition for electrical steel |
| 12/18/2008 | WO2008153668A2 Dry-to-the-touch anaerobically curable compositions and products made therefrom |
| 12/18/2008 | WO2008153208A1 Resin composition for interlayer insulation of multilayer printed wiring board |
| 12/18/2008 | WO2008153082A1 Resin composition, embedding material, insulating layer, and semiconductor device |
| 12/18/2008 | WO2008153076A1 Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding |
| 12/18/2008 | WO2008152916A1 Composite material |
| 12/18/2008 | WO2008152843A1 Epoxy resin composition |
| 12/18/2008 | WO2008152834A1 Curable composition and optical device made with the same |
| 12/18/2008 | WO2008152833A1 Curable composition and optical device |
| 12/18/2008 | WO2008152011A1 Catalyst for curing epoxides |
| 12/18/2008 | WO2008152003A1 Catalyst for curing epoxides |
| 12/18/2008 | WO2008151946A1 Adhesive compositions |
| 12/18/2008 | WO2008118567A3 Polythioether amine resins and compositions comprising same |
| 12/18/2008 | US20080312383 Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same |
| 12/18/2008 | US20080311404 Coatings for Optical Elements |
| 12/18/2008 | US20080308225 Adhesive composition suitable to be applied by screen printing |
| 12/18/2008 | DE102007027755A1 Fiber reinforced plastic component production involves rearranging thermoplastic hollow core with coating, made of reinforcing fibers, and plastic material is subsequently hardened |
| 12/18/2008 | CA2690295A1 Catalyst for curing epoxides |
| 12/17/2008 | EP2003161A2 Multifunctional oxetanyl group-containing ultraviolet-curable resin composition |
| 12/17/2008 | EP2003158A2 Dendritic polyester, method for producing the same, and thermoplastic resin composition |
| 12/17/2008 | EP0787161B2 Low voc laminating formulations |
| 12/17/2008 | CN101325108A Agglutinate neodymium-iron-boron magnet and preparation method thereof |
| 12/17/2008 | CN101323769A Resin paste for die bonding |
| 12/17/2008 | CN101323703A Poly(amino bimaleimide) resin composition, preparation and use thereof in copper clad laminate |
| 12/17/2008 | CN101323698A Flame retardant composition copper clad laminate and preparation thereof |
| 12/17/2008 | CN101323697A Epoxide resin based piezoelectric composite damping material and method for preparing the same |
| 12/17/2008 | CN101323673A Chemical resistance table slab rubber, preparation and use thereof |
| 12/17/2008 | CN100443540C Halogenless fire retarded epoxy resin composition |
| 12/17/2008 | CN100443524C Liquid-crystal polyester resin |
| 12/16/2008 | US7465503 Molding material for fuel cell separator and method for preparing the same |
| 12/16/2008 | US7465477 Coating with amine curing agent, epoxide-containing toughener, expoxy resin and rubber toughener |
| 12/11/2008 | WO2008148548A1 Polymer composition |
| 12/11/2008 | WO2008064959B1 Metal compounds for use as initiators |
| 12/11/2008 | WO2008038257A3 Novel adducts and curable compositions using same |
| 12/11/2008 | US20080306223 Curing Agent for Epoxy Resins and Epoxy Resin Compositions |
| 12/11/2008 | US20080306220 Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board |
| 12/11/2008 | US20080302558 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board |
| 12/11/2008 | US20080302478 Adhesive agent and inkjet head and manufacturing method thereof |
| 12/11/2008 | DE102008024246A1 Blatt- bzw. folienartiges SMC-Gebilde und Verfahren zur Herstellung desselben Sheet-like SMC-structure and methods for manufacturing the same |
| 12/10/2008 | EP0954553B2 Latent catalysts for epoxy curing systems |
| 12/10/2008 | CN201161136Y Filter outer shell |
| 12/10/2008 | CN101321799A Liquid resin composition for electronic element and electronic element device |
| 12/10/2008 | CN101319087A F-level heat-proof solvent-impregnated resin suitable for subatmospheric pressure and normal temperature |
| 12/10/2008 | CN101319086A F level heating solvent-free solvent-impregnated resin suitable for subatmospheric pressure |
| 12/10/2008 | CN101319085A Light-high-strength epoxy foam material and preparation method thereof |
| 12/10/2008 | CN101319084A Preparation method for poly-p-phenylene-benzo-dioxazole fibre/epoxy resin composite material |
| 12/10/2008 | CN101319083A Polyester imine aluminium wire wire coating enamel modifier |
| 12/10/2008 | CN101319041A Polyalkyleneamine adducts as curing agents for thick layer water-based epoxy systems |
| 12/10/2008 | CN100441633C Epoxy resin composition for sealing and packing optical semiconductor element and optical semiconductor element using the said composition |
| 12/10/2008 | CN100441619C Resin composition for sealing and semiconductor device sealed with resin |