| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 08/19/2008 | US7414097 Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator |
| 08/19/2008 | CA2264893C Synthetic resin composition having heat deterioration resistance and molded article thereof |
| 08/14/2008 | WO2008097010A1 Composition and method for manufacturing high molecular composite reinforced fiber strength member of overhead electric cable |
| 08/14/2008 | US20080194726 polyethers having silicon-containing end groups, used in radiation curable coatings, inks or films |
| 08/13/2008 | EP1956648A1 Semiconductor device |
| 08/13/2008 | EP1956074A1 n-PROPYL BROMIDE COMPOSITION |
| 08/13/2008 | EP1954759A1 Curable compositions |
| 08/13/2008 | EP1871835B1 Composition comprising benzoxazine and epoxy resin |
| 08/13/2008 | EP1612597B1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 08/13/2008 | CN101243117A Thermosetting composition for sealing organic el element |
| 08/13/2008 | CN101240113A Wax for airplane flight recorder and preparation method |
| 08/13/2008 | CN101240111A Prepreg and laminate |
| 08/13/2008 | CN101240109A Resin composition and semi-solidifying sheet for printed board prepared from the same |
| 08/13/2008 | CN101240104A Alkylated polyalkyleneamines and uses thereof |
| 08/13/2008 | CN101240074A Degradable granule and its related method |
| 08/13/2008 | CN100411138C Dicing/die boding sheet |
| 08/13/2008 | CN100410325C Resin composition and its use in bonding sheet and copper clad plate |
| 08/13/2008 | CN100410320C UV and high-temperature aging resistant organosilicon epoxy resin composition |
| 08/13/2008 | CN100410319C Resin composition for forming a thermistor body, and thermistor |
| 08/13/2008 | CN100410291C Water-based epoxy grout |
| 08/13/2008 | CN100410058C Resin base composite material parts quick forming method |
| 08/12/2008 | US7411019 Polymer composites containing nanotubes |
| 08/12/2008 | US7410673 Smooth board and process for preparing a smooth board |
| 08/08/2008 | CA2635857A1 Film-forming material containing phosphorous and methods of producing coating compositions containing phosphorous |
| 08/07/2008 | US20080188609 Epoxy compositions having improved impact resistance |
| 08/07/2008 | US20080188591 Curing agents; polyepoxyides |
| 08/07/2008 | US20080185753 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 08/06/2008 | EP1951814A1 Poly(arylene ether) composition, method, and article |
| 08/06/2008 | EP1590403B1 Thermosetting, themoexpansible composition with a high degree of expansion |
| 08/06/2008 | EP1474479B1 Powder coating compositions having improved mar and acid resistance |
| 08/06/2008 | CN101238191A Electropeeling composition, adhesive using the same, and electropeeling multilayer adhesive |
| 08/06/2008 | CN101235186A Solvent-free epoxy-organic silicon composition capable of self-layering and curing |
| 08/06/2008 | CN101235176A Polyisobutenyl containing dispersions and uses thereof |
| 08/06/2008 | CN101235152A Basalt continuous fibre enhancement resin composite material and manufacturing method thereof |
| 08/06/2008 | CN100408647C Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 08/06/2008 | CN100408568C Epoxy-capped polythioethers |
| 08/05/2008 | CA2342231C Polymer compound with improved gloss properties |
| 07/31/2008 | WO2008090950A1 Film for sealing and semiconductor device using the same |
| 07/31/2008 | WO2008089572A1 Solid stick compositions comprising vinyl ester |
| 07/31/2008 | WO2007024571A3 Uv curable electrically conductive film containing a polysilane |
| 07/31/2008 | CA2675786A1 Solid stick compositions comprising vinyl ester |
| 07/30/2008 | EP1948735A1 Flame retardant prepregs and laminates for printed circuit boards |
| 07/30/2008 | EP1486533B1 Use of a polyester resin composition for profile extrusion molding |
| 07/30/2008 | CN101233190A Insulating material, wiring board and semiconductor device |
| 07/30/2008 | CN101233167A Solid thermally expansible material |
| 07/30/2008 | CN101232991A Three-dimensional shaped item with smoothed molding end face |
| 07/30/2008 | CN101230256A Method for preparing polyethylene glycol and epoxy resin formed composite phase-change materials |
| 07/30/2008 | CN101230188A Polycarbonate/acrylonitrile-butadiene-phenylethene copolymer alloy |
| 07/30/2008 | CN101230157A Rubber composition for tire tread and pneumatic tire using the same |
| 07/30/2008 | CN100407340C 导电浆料 Conductive paste |
| 07/30/2008 | CN100406515C Flip-chip system and method of making same |
| 07/29/2008 | US7405247 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 07/29/2008 | CA2511571C Manufacture of void-free laminates and use thereof |
| 07/29/2008 | CA2205811C Multifunctional cyanate ester and epoxy blends |
| 07/24/2008 | WO2008087812A1 Phosphorus-containing flame retardant and curable flame -retarded resin compositions containing the same |
| 07/24/2008 | WO2008087784A1 Stabilizing agent for chlorine-containing polymer, and chlorine-containing polymer composition |
| 07/24/2008 | US20080177023 Curable compositions having a reduced enthalpy output |
| 07/24/2008 | DE112006002475T5 Harzzusammensetzung, blattförmig ausgebildeter Körper, Prepreg, gehärteter Körper, Laminat und Mehrschichtlaminat Resin composition, leaf-shaped design body, prepreg, hardened body, laminate and multi-layer laminate |
| 07/23/2008 | EP1947157A1 Sealing material for flat panel display |
| 07/23/2008 | EP1947130A1 Resin composition for radiation curing and prepreg |
| 07/23/2008 | CN101228621A Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device |
| 07/23/2008 | CN101226785A Polymer thick film resistor composition and manufacturing method thereof |
| 07/23/2008 | CN101225230A Wet-heat highly-resistant bismaleimide/microcapsule composite material and preparation method thereof |
| 07/23/2008 | CN101225229A Wet-heat cyanate ester/ composite material and preparation method thereof |
| 07/23/2008 | CN100404633C Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 07/23/2008 | CN100404616C Composite solid polymer electrolyte for secondary lithium cell and preparing method thereof |
| 07/23/2008 | CN100404563C Processes for preparing tougheners for thermoset compositions |
| 07/17/2008 | WO2008085144A1 Low shrinkage polyester thermosetting resins |
| 07/17/2008 | US20080171207 High toughness vinylester and/or epoxy resin-based material, its process of manufacture, composite material comprising it and uses thereof |
| 07/17/2008 | DE102007001862A1 Flammwidrige Harzformulierung und ihre Verwendung The flame-retardant resin formulation and their use |
| 07/16/2008 | EP1944335A2 Flame retardant resin compositions and use thereof |
| 07/16/2008 | EP1943311A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 07/16/2008 | EP1848754B8 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 07/16/2008 | EP1701793A4 A catalyst system for ethylene (co)-polymerization |
| 07/16/2008 | EP1592746B1 Halogen free ignition resistant thermoplastic resin compositions |
| 07/16/2008 | CN101223235A Epoxy resin composition for encapsulation and electronic part device |
| 07/16/2008 | CN101223214A Use of a particular composition for producing parts by filament winding |
| 07/16/2008 | CN101221754A Production method for aluminum fabric acoustic absorption composite material |
| 07/16/2008 | CN101220253A Single-component stable luminescent device embedding composition at room temperature |
| 07/16/2008 | CN101220200A Transparent organic polymer material and method for producing the same |
| 07/16/2008 | CN101220197A Use of a polyamine stream as curing agent in epoxy adhesive and flooring applications |
| 07/16/2008 | CN101220185A Expansion type flame-proof ethylene propylene terpolymer for fire resistant flame |
| 07/16/2008 | CN101220160A Prepreg applied for multi-layer board of printed electronic circuit |
| 07/16/2008 | CN101220106A Silicon containing macromolecule photo-initiation agent, synthesis and uses thereof |
| 07/16/2008 | CN100402606C PET/clay nano composite materials and method for preparing same |
| 07/16/2008 | CN100402605C Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 07/16/2008 | CN100402575C Epoxy resin composition and semiconductor device |
| 07/15/2008 | US7399502 Discharge orifice is coated with a cured film having epoxy, perfluroralkyl, and alkylsiloxane groups; cationic polymerization catalyst; water repellent agent; film having excellent water-repellency on a substrate surface |
| 07/10/2008 | WO2008082176A1 A cathodic electrodeposition coating compositions having improved appearance, anti-corrosion resistance and flexibility |
| 07/10/2008 | WO2008081639A1 Accelerator for stereocomplex formation of polylactic acid |
| 07/10/2008 | US20080166511 Epoxy Resin Composition for Carbon-Fiber-Reinforced Composite Material, Prepreg, Integrated Molding, Fiber-Reinforced Composite Sheet, and Casing for Electrical/Electronic Equipment |
| 07/09/2008 | EP1942148A1 Resin composition, resin film, cover lay film, interlayer adhesive, metal clad laminate and multilayer printed circuit board |
| 07/09/2008 | EP1942096A2 Modified chain aliphatic polyamine |
| 07/09/2008 | EP1699885B1 A marine anti-bio-fouling coating and a method of applying the coating |
| 07/09/2008 | EP1341039B1 Photocurable and thermosetting resin composition |
| 07/09/2008 | CN101218286A Prepreg |
| 07/09/2008 | CN101215408A High temperature self-restoring epoxy resin material and preparation method thereof |
| 07/09/2008 | CN101215407A High temperature self-restoring fibre enhancement epoxy composite material and preparation method thereof |
| 07/09/2008 | CN101215406A Preparation method of resin-base nano composite material |
| 07/09/2008 | CN101215405A Thermosetting resin composition |