| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/11/2009 | CN100461328C Inorganic particle containing composition for plasma display panel, transfer film and process for producing plasma display panel |
| 02/11/2009 | CN100460469C Thermosetting epoxy asphalt material, preparation method and dedicated compatibilizer thereof |
| 02/11/2009 | CN100460464C Epoxy resin molding material for sealing and electronic component |
| 02/10/2009 | US7488785 A curable liquid blends comprising amines, latent curing agent which does not react until temperatures above 70 degrees C., a photopolymerizable compound and a photoinitiator; use as impregnating resins, forming fibre-reinforced composite materials |
| 02/10/2009 | US7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 02/10/2009 | CA2182633C Ultra-low viscosity epoxy sealer/healer |
| 02/05/2009 | WO2009018264A2 Water-based dispersions of highly-branched polymers |
| 02/05/2009 | WO2009018193A1 Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
| 02/05/2009 | WO2009017690A2 Curable epoxy resin-based adhesive compositions |
| 02/05/2009 | WO2009017252A1 Liquid crystal aligning agent, liquid crystal alignment film, method for producing the same, and liquid crystal display device |
| 02/05/2009 | WO2009017170A1 Alumina powder, process for producing the same, and composition containing the same |
| 02/05/2009 | WO2008153668A3 Dry-to-the-touch anaerobically curable compositions and products made therefrom |
| 02/05/2009 | US20090036614 Method of manufacturing thermoplastic resin, crosslinked resin, and crosslinked resin composite material |
| 02/05/2009 | US20090036582 Curable composition |
| 02/05/2009 | US20090036570 Water-based dispersions of highly-branched polymers |
| 02/05/2009 | US20090035688 Toner, and toner production process |
| 02/05/2009 | US20090035580 Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive |
| 02/05/2009 | DE102007035956A1 Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren Surface-modified fumed silicas |
| 02/05/2009 | DE102007035955A1 Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren Surface-modified fumed silicas |
| 02/05/2009 | DE102007035951A1 Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren Surface-modified fumed silicas |
| 02/05/2009 | CA2694758A1 Water-based dispersions of highly-branched polymers |
| 02/04/2009 | EP1603962B1 Improvements in or relating to thermosetting resin compositions |
| 02/04/2009 | CN101360788A Curable compositions |
| 02/04/2009 | CN101358020A Nonporous moisture permeable and water-repellent modified polyether ester functional film material and preparation method thereof |
| 02/04/2009 | CN101358019A Anti-ultraviolet multiple nano particle epoxy resin composite material and preparation method thereof |
| 02/04/2009 | CN101358018A Epoxy resin anti-ultraviolet composite material and preparation method thereof |
| 02/04/2009 | CN101358014A Preparation containing organosilicium compound and its use |
| 02/04/2009 | CN101357999A Nonflammable resin and combination thereof |
| 02/04/2009 | CN101357996A Multi-microporous epoxy thermosetting resin, preparation method and application thereof |
| 02/04/2009 | CN101357995A Light transparent and flame retardant changeable fiber reinforced plastics |
| 02/04/2009 | CN100457825C Process of modifying epoxy resin with schiff base type liquid crystal epoxy resin |
| 02/04/2009 | CN100457824C Green high-strength epoxy grouting material and its preparation |
| 02/04/2009 | CN100457823C Epoxy resin composition, condensate thereof |
| 02/04/2009 | CN100457809C Thermo setting resin composition and its setting coating film |
| 02/04/2009 | CN100457672C Insulation product, such as a thermal insulation product, and production method thereof |
| 02/03/2009 | US7485362 Nanoporous laminates |
| 02/03/2009 | US7485242 Reactive fine particles |
| 02/03/2009 | CA2344718C High strength epoxy adhesive and uses thereof |
| 01/29/2009 | WO2009014842A1 Modified epoxy resins comprising the reaction product of a biomass derived compound and an epoxy resin, and aqueous dispersions and coatings comprising such resins |
| 01/29/2009 | WO2009014760A1 Two-part epoxy composition |
| 01/29/2009 | WO2009014112A1 Volume phase hologram recording material and optical information recording medium using the same |
| 01/29/2009 | US20090030163 Process for producing glycidyl 2-hydroxyisobutyrate and composition containing the product |
| 01/29/2009 | US20090030159 Alkylated Aminopropylated Ethylenediamines And Uses Thereof |
| 01/29/2009 | US20090030125 Benzylated Aminopropylated Ethylenediamines And Uses Thereof |
| 01/29/2009 | US20090029059 Two-part epoxy composition |
| 01/29/2009 | US20090026425 Composition comprising polyester amide acid and the like and ink-jet ink composition using the same |
| 01/28/2009 | EP1735379B1 Amphiphilic block copolymer-toughened thermoset resins |
| 01/28/2009 | CN101356643A 半导体器件 Semiconductor devices |
| 01/28/2009 | CN101356219A Flame retardant compositions with a phosphorated compound |
| 01/28/2009 | CN101353471A Encapsulating epoxy resin molding material and semiconductor device |
| 01/28/2009 | CN101353442A Waste printed circuit board composite non-metal powder modifying agent and preparation thereof |
| 01/28/2009 | CN101353441A Method and apparatus for modifying waste printed circuit board composite non-metal powder |
| 01/28/2009 | CN100455513C Magnesium hydrate particles and its manufacturing method and resin composite including same |
| 01/27/2009 | US7482421 silane film that can be used in a wide range of environments, on metals of engineering interest; comprises: at least one bis-silane; a water soluble or dispersible polymer; nanoparticles; and a water soluble solvent; substantially chromate-free and comprising little to no VOCs |
| 01/22/2009 | WO2009011335A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 01/22/2009 | US20090023868 Copolymers comprising polyamide blocks and polyether blocks and having improved mechanical properties |
| 01/22/2009 | US20090023855 Novel curable resin, production method thereof, epoxy resin composition, and electronic device |
| 01/22/2009 | US20090023840 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 01/21/2009 | EP2017305A1 Polyamide resin composition |
| 01/21/2009 | EP1546227A4 Polyether polyamine agents and mixtures therefor |
| 01/21/2009 | CN101351501A Epoxy resin composition |
| 01/21/2009 | CN101349675A Apparatus and method for monitoring epoxy resin base gel preparation course by ultrasonic wave |
| 01/21/2009 | CN101348600A Self-lubricating type epoxide resin material and preparation thereof |
| 01/21/2009 | CN101348599A Flame-retardant epoxide resin material |
| 01/21/2009 | CN101348585A Oil-water two-phase flow drag reducer |
| 01/21/2009 | CN101348584A Method for preparing damping material from waste polystyrene plastic foam and waste rubber powder |
| 01/21/2009 | CN101348582A Rubber composition for manufacturing transmission belt |
| 01/21/2009 | CN101348576A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same |
| 01/21/2009 | CN101348575A Prepreg and metal foil-clad laminate and printed circuit board obtained by using the same |
| 01/21/2009 | CN101348563A Tough mannich base curing agent and preparation thereof |
| 01/21/2009 | CN101348562A Preparation of aliphatic alcohol polyether type aqueous amine epoxy hardener |
| 01/21/2009 | CN101348561A Preparation of amine terminated polyether aqueous epoxy hardener |
| 01/21/2009 | CN100454142C Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with same |
| 01/21/2009 | CN100453593C Difficult combustible epoxy resin composition not containing halogen |
| 01/21/2009 | CN100453592C Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jetting recorder |
| 01/20/2009 | US7479527 Low temperature, high speed curability; storage stability, heat resistance; adhesives, coatings |
| 01/20/2009 | CA2431016C Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same |
| 01/15/2009 | WO2009008509A1 Epoxy resin-forming liquid preparation containing inorganic particle |
| 01/15/2009 | WO2009008471A1 Copper foil with dielectric layer |
| 01/15/2009 | WO2009008283A1 Optical semiconductor-sealing composition |
| 01/15/2009 | WO2006080786A9 Thermally curable resin composition with extended storage stability and good adhesive property |
| 01/15/2009 | US20090017221 Photosensitive dispersion with adjustable viscosity for the deposition of metal on an insulating substrate and use thereof |
| 01/15/2009 | US20090014691 Dispersions, films, coatings and compositions |
| 01/14/2009 | EP2014721A1 Epoxy resin composition for fiber-reinforced composite material |
| 01/14/2009 | EP2014720A1 Polymer compound |
| 01/14/2009 | EP1260551B1 Flame-retardant epoxy resin composition and laminate made with the same |
| 01/14/2009 | CN101346428A Polyester resin composition and molded body |
| 01/14/2009 | CN101343425A Functionalized carbon nano-tube used as solidifying agent of epoxy resin and preparation method |
| 01/14/2009 | CN101343412A Prepreg and laminate |
| 01/14/2009 | CN101343403A Halogen-free flame retardant epoxy resin composition and preparation thereof |
| 01/14/2009 | CN101343402A Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance |
| 01/14/2009 | CN101343401A Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof |
| 01/14/2009 | CN101343400A MG filled polyurethane modified epoxy resin embedding material and preparation thereof |
| 01/14/2009 | CN101343399A Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| 01/14/2009 | CN101343398A Halogen-free flame-proof glass fiber reinforcement epoxy molding compound |
| 01/14/2009 | CN101343383A Cellulose based degradable liquid mulch film |
| 01/14/2009 | CN100452248C Non-mold release agent composite insulator core rod |
| 01/14/2009 | CN100451068C Epoxy/layersilicate hano composite material, and its preparing method |
| 01/13/2009 | US7476444 Layer of reaction product of epoxy and phosphorus materials and curing agent on substrate |
| 01/08/2009 | US20090012233 Epoxy Resin Molding Material for Sealing and Electronic Component Device |