| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 03/24/2010 | EP2166029A1 Optical semiconductor-sealing composition |
| 03/24/2010 | EP2166013A1 Oligomeric, hydroxy-terminated phosphonates |
| 03/24/2010 | EP2084215B1 Ductile structural foams |
| 03/24/2010 | EP1532188B1 Low-cure powder coatings and methods for using the same |
| 03/24/2010 | CN101682999A Insulating resin composition |
| 03/24/2010 | CN101681067A Liquid crystal panel mounting substrate, and method for producing the same |
| 03/24/2010 | CN101679751A Curable epoxy resin composition and cured body thereof |
| 03/24/2010 | CN101679723A Solid stick compositions comprising vinyl ester |
| 03/24/2010 | CN101679721A Resin composition, embedding material, insulating layer, and semiconductor device |
| 03/24/2010 | CN101679638A Cross-linked silicone particles and method of manufacturing thereof |
| 03/24/2010 | CN101679612A Resin composition for interlayer insulation of multilayer printed wiring board |
| 03/24/2010 | CN101679609A Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 03/24/2010 | CN101679608A One-pack type cyanate/epoxy composite resin composition |
| 03/24/2010 | CN101679606A Composite material with blend of thermoplastic particles |
| 03/24/2010 | CN101679605A Pre-impregnated composite materials with improved performance |
| 03/24/2010 | CN101679599A catalyst for curing epoxides |
| 03/24/2010 | CN101679579A Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| 03/24/2010 | CN101677033A Polymer-matrix composite dielectric material and plate capacitor |
| 03/23/2010 | US7683154 Epoxy/novolak curing agent comprising an adduct obtainable by reaction of an ethylene diamine and a phenyl monoglycidyl ether mixed with an amine havingan active hydrogen; lower viscosity; rheology; coatings; adhesives; moldingmaterials; castings; industrial scale |
| 03/23/2010 | US7683153 Epoxy resin with dibasic acid (methyl ester)/ethyleneurea modifier |
| 03/23/2010 | US7683152 Reducing the modulus of elasticity is by incorporating siloxane linkages into the polyimide resin structure to absorb stressendured by semiconductor packaging; high-temperature heat resistance; moisture-proofing; adhesion protective film; polysiloxanes having aminoalkylsilanol end groups |
| 03/23/2010 | US7683138 Molding compositions |
| 03/23/2010 | US7682699 reacting the epoxy material and the acrylic resin in a blend that also includes a reactive dileunt to form an epoxy acrylate resin; dispersing the reactive diluent and the epoxy acrylate resin into water; and polymerizing the reactive diluent; formaldehyde-free beverage can coatings |
| 03/23/2010 | CA2324391C Additive mixture for improving the mechanical properties of polymers |
| 03/18/2010 | WO2010029096A1 Epoxy-based composition containing copolymer |
| 03/18/2010 | WO2008152011A9 Catalyst for curing epoxides |
| 03/18/2010 | US20100068522 Surface Functionalised Nanoparticles |
| 03/18/2010 | US20100068499 Leather-like sheet |
| 03/18/2010 | US20100068491 Non-stick coating |
| 03/18/2010 | US20100065878 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 03/17/2010 | EP2163579A2 Epoxy resin composition |
| 03/17/2010 | CN101675092A Method and device for cleaning an absorptive polyester |
| 03/17/2010 | CN101671474A Room-temperature self-repairing polymeric material containing single component liquid reactive repairing agent |
| 03/17/2010 | CN101671473A Anisotropic conductive material |
| 03/17/2010 | CN101671465A Preparation method of ethoxyline resin/polytetrafluoroethylene composite material |
| 03/16/2010 | US7678879 Polyamides from (hydroxy)isophthalic acid and a C36 diamine, endcapped with a hydroxybenzoic acid, and an epoxy resin, acrylic resin, polyimide, vinyl ether, vinyl ester, aromatic olefin or allyl resin; die-attach tapes; electronic packagings; curable with or without a catalyst |
| 03/11/2010 | WO2010007150A3 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 03/11/2010 | US20100063183 Intercalation agent free compositions useful to make nanocomposite polymers |
| 03/11/2010 | US20100063182 Epoxy composition |
| 03/11/2010 | US20100062275 Antistatic ionomer composition and articles therewith |
| 03/11/2010 | US20100062211 Epoxy resin composition for fiber reinforced composite material |
| 03/11/2010 | US20100062199 Protective sealable coating compositions |
| 03/10/2010 | EP2161292A1 Epoxy resin composition |
| 03/10/2010 | EP1754734B1 Curing agent for epoxy resins and epoxy resin compositions |
| 03/10/2010 | CN101665615A Toughened epoxy resin composition, composite material and laminate plate manufactured by using same |
| 03/09/2010 | US7675185 contains mesophase pitch; cyclic phosphazenes; for semiconductors with narrow distances between pads or wires |
| 03/09/2010 | US7674865 Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin |
| 03/09/2010 | US7674846 Paint composition of cationic electrodeposition and method of preparing the same |
| 03/04/2010 | WO2010024166A1 Magnetic sheet composition, magnetic sheet, and process for producing magnetic sheet |
| 03/04/2010 | WO2010023217A1 Use of polymerisable resins with low vacuum degassing for making space-grade composite materials |
| 03/04/2010 | WO2010023166A1 Method for gluing components, forming a temperature resistant adhesive layer |
| 03/04/2010 | WO2009131913A3 Thermal interconnect and interface materials, methods of production and uses thereof |
| 03/04/2010 | US20100055842 Thermosetting die-bonding film |
| 03/03/2010 | EP2159262A2 Resin composition for optical material, resin film for opical material, and optical waveguide using same |
| 03/03/2010 | EP2158249A1 Catalyst for curing epoxides |
| 03/03/2010 | EP2158248A1 Catalyst for curing epoxides |
| 03/03/2010 | EP1731554B1 Prepreg, metal-clad laminate and printed circuit board using same |
| 03/03/2010 | CN101659782A Preparation method of acrylonitrile grafting pseudo-tree root type poly-phenylene benzobisoxazazole/epoxy material |
| 03/03/2010 | CN101659781A Epoxy resin micro-particle, dispersion liquid and method for preparing same |
| 03/02/2010 | US7671147 Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent |
| 03/02/2010 | US7671145 polymerization catalysts; sealants, coatings, and adhesives used in aviation and aerospace with improved flexibility, fuel resistance, and high-temperature resistance |
| 03/02/2010 | US7671114 glycidyl epoxy resins containing substitution on epoxide ring used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives suitable for use with silver-based alloys |
| 03/02/2010 | US7670683 protecting pipelines, chairs, wires, manifolds, etc. from extreme environmental conditions such as corrosion and wear; balance of toughness and flexibility; specified amount of a butadiene-methyl methacrylate-styrene triblock copolymer improves crack resistance, crosslinkable epoxy resin and filler |
| 03/02/2010 | US7670500 Reaction product of polyamine, acyclic carbonate and cyclic carbonate |
| 03/02/2010 | US7670499 curing agent for epoxy resins; for bridging cracks in a substrate; low temperature crosslinking; good adhesion to the substrate, good resistance to chemicals and resilience |
| 02/25/2010 | WO2010021569A1 Antifriction polymer composition and a method for the production thereof |
| 02/25/2010 | US20100048832 Alkylated 4-Aminobenzyl-4-Aminocyclohexane |
| 02/25/2010 | US20100048828 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 02/25/2010 | US20100048826 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 02/25/2010 | US20100048772 Synthetic quartz composition and production process therefor |
| 02/25/2010 | US20100048766 Halogen-free phosphorous epoxy resin composition |
| 02/25/2010 | US20100047558 Diffusion barrier for electronic display devices |
| 02/25/2010 | US20100044090 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
| 02/24/2010 | EP2157079A1 Alkylated 4-aminobenzyl-4-aminocyclohexane |
| 02/24/2010 | EP1812513B1 Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
| 02/24/2010 | CN101654544A Insulating encapsulating material |
| 02/24/2010 | CN101654543A Epoxy resin composition |
| 02/24/2010 | CN100591720C Preparation method of hybridized epoxyresin/silica material |
| 02/23/2010 | US7667339 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 02/23/2010 | US7666955 Methods for producing branched-polyether resin composition and acid pendant branched-polyether resin composition |
| 02/23/2010 | US7666954 Epoxy resin amine curing agent of N,N′-dimethyl secondary diamine polymer |
| 02/23/2010 | US7666953 Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent |
| 02/23/2010 | US7666952 Powder coating of polyepoxide and polyisocyanate-amine reaction product |
| 02/23/2010 | US7666804 Resin storable at ambient temperatures; first and second non-crystalline thermosetting resins; crystalline thermosetting resins; curing agent; melting point that is above ambient temperature and below curing temperature |
| 02/23/2010 | US7666509 Resin composition, prepreg and metal-foil-clad laminate |
| 02/23/2010 | CA2469820C Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 02/18/2010 | WO2010018829A1 Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 02/18/2010 | WO2010018008A1 Thermosetting composition |
| 02/18/2010 | US20100041814 Methods for preparing toughened epoxy polymer composite systems |
| 02/18/2010 | US20100041794 Hydroxyl-terminated or carboxylic acid-terminated reactive monomer compositions, their preparation and their use |
| 02/18/2010 | US20100040794 Placental blood extractor |
| 02/18/2010 | US20100040793 Coating composition and method for forming multilayer topcoat film |
| 02/18/2010 | US20100040339 Resin composition for optical material, resin film for optical material, and optical waveguide using them |
| 02/17/2010 | EP2154171A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 02/17/2010 | EP2154170A1 Thermosetting epoxy resin compositions and use thereof |
| 02/17/2010 | EP2152792A1 Insulation coating composition for electrical steel |
| 02/17/2010 | CN201408942Y Flow inducing connecting device for 10 kV lines |
| 02/17/2010 | CN101652425A Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
| 02/17/2010 | CN101649106A Material composition of halogen-free printed circuit board with low dielectric loss and manufacturing method thereof |
| 02/16/2010 | US7662902 Phenolic resin with low level of free bisphenol |