Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
10/2009
10/29/2009WO2009131101A1 Conductive resin composition
10/29/2009US20090270565 Fuel Cell Separator Material and Process of Producing the Same
10/29/2009US20090267263 Thermosetting resin composition, material for substrate and film for substrate
10/28/2009EP2112195A2 Filled epoxy tubesheet
10/28/2009EP2112192A2 Composite elements with controlled electrical conduction
10/28/2009CN101565549A Resin composition mixed with epoxy resin and silicon resin, and preforming material
10/28/2009CN101565545A Method for preparing ethylene rhodanate-epoxy-POSS hybrid resin
10/28/2009CN101565535A Heat resistant epoxide resin and preparation method thereof
10/28/2009CN101565504A High-temperature endurable active toughener powder used for epoxy resin and preparation method thereof
10/28/2009CN100554311C Process for the alkoxylation of organic compounds
10/27/2009US7608672 Infiltrant system for rapid prototyping process
10/27/2009US7608487 B-stageable underfill encapsulant and method for its application
10/27/2009US7608336 Flame-retardant epoxy resin composition and cured product obtained therefrom
10/27/2009CA2353185C Heat-stable, corrosion-inhibiting polyorganosiloxane resins
10/22/2009WO2009127891A1 Thermosetting resin containing irradiated thermoplastic toughening agent
10/22/2009US20090264581 Polymeric Composite Material for Cold Molding and Process for Obtaining It
10/22/2009US20090264559 Resin Dispersion
10/22/2009US20090264558 Capped polyurethane prepolymers and heat-curable epoxy resin compositions
10/22/2009US20090264547 Visco-elastic polyurethane foam with castor oil
10/22/2009US20090261484 Liquid resin composition, semi-conductor device, and process of fabricating the same
10/22/2009US20090261298 High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility
10/22/2009DE102009018635A1 Duroplastische Schaumstoffe auf Basis nativer Epoxide, Verfahren zu deren Herstellung sowie Halbzeuge Thermosets based on native epoxides, process for their preparation and semi-finished products
10/21/2009EP2110851A1 Film for sealing and semiconductor device using the same
10/21/2009EP1665375B1 Solvent-modified resin compositions and methods of use thereof
10/21/2009CN201330373Y Solar energy road bridge guardrail
10/21/2009CN101563171A Epoxy sealer/healer for sealing strengthening cracked concrete
10/21/2009CN101560323A Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
10/21/2009CN101560322A Polyphenylether-coated epoxy resin microcapsules and preparation method thereof
10/21/2009CN101560226A Novel phosphorus series compound as well as preparation method and application thereof
10/21/2009CN100551971C Solvent free resin applied to vacuum pressure dipping technique for electrical motor in high voltage
10/21/2009CN100551970C Cast agent for blood vessel of no-solvent type epoxy resin
10/21/2009CN100551969C Environment-friendly elastic epoxy grouting material and its preparation method
10/21/2009CN100551968C Epoxy resin composition for semiconductor encapsulation and semiconductor device
10/20/2009US7605213 flame resistance, good fluidity and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant; halogen-free
10/20/2009US7604343 Actinic ray curable composition, actinic ray curable ink, image formation method employing it, and ink-jet recording apparatus
10/15/2009US20090259003 Curing Agent For Low Temperature Cure Applications
10/15/2009US20090258150 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
10/14/2009EP2108024A1 Solid stick compositions comprising vinyl ester
10/14/2009EP1805260B1 Self-bonding coating composition
10/14/2009CN101558490A Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition
10/14/2009CN101558110A Thermally stable cationic photocurable compositions
10/14/2009CN101555341A High-strength fiber glass reinforced ABS composite material and preparation method thereof
10/14/2009CN101555319A Hybrid organic silicon-phosphorus type epoxy modifying agent used for copper clad laminate of printed circuit board, preparation method and application thereof
10/14/2009CN100549092C Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
10/14/2009CN100549091C Epoxy resin composition and epoxy-polysiloxane coating composition
10/14/2009CN100549090C Amine compositions
10/13/2009US7602051 Thermally conductive resin sheet and power module using the same
10/13/2009US7601426 Intumescent substrate coating
10/13/2009US7601425 Corrosion resistant coatings containing carbon
10/13/2009US7601421 Fabrication of carbon nanotube reinforced epoxy polymer composites using functionalized carbon nanotubes
10/13/2009US7600957 Expandable sealant for fasteners
10/08/2009WO2009123285A1 Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device
10/08/2009WO2009123058A1 Epoxy resin composition and molded object
10/08/2009US20090253860 Emulsifiers for Epoxy Resins
10/08/2009US20090253829 Process for the manufacturing of slabs or blocks of conglomerate of stone granulate and polyester resin
10/08/2009US20090252952 Surface treated cr-free steel sheet for used in fuel tank, preparing method thereof and treatment composition therefor
10/08/2009US20090250825 crack resistance, transparency, minimal discoloration; optical semiconductor device; reacting polyester of cyclohexanedicarboxylic acid and neopentyl glycol; methylhexahydrophthalic anhydride; polyepoxide; 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate
10/07/2009EP1899768B1 Toner, and toner production process
10/07/2009EP1687375B1 Weather-resistant compositions based on polyalkylene terephthalate/polycarbonate blends with modified impact resistance and moulded-in colour
10/07/2009EP1587871B1 Preformed compositions in shaped form
10/07/2009EP1452536B1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
10/07/2009CN101553910A Sealing material and mounting method using the sealing material
10/07/2009CN101553909A Sealing material and mounting method using the sealing material
10/07/2009CN101553549A Photobase generator and photocurable resin composition
10/07/2009CN101553443A Sizing for high performance glass fibers and composite materials incorporating same
10/07/2009CN101552047A Epoxy glass fabric gumming product and manufacturing method thereof
10/07/2009CN101550279A Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic
10/07/2009CN101550266A Method for preparing and using foaming epoxy resin base grouting material for treating concrete floor empty drum
10/07/2009CN101550265A Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
10/07/2009CN101550264A Resin matching fluid used for metal foil laminated board
10/07/2009CN101549561A Method for producing epoxy resin insulation sheet material and press equipment thereof
10/07/2009CN100547048C High-strength water-based itaconic acid epoxide resin grouting material and preparation method thereof
10/07/2009CN100547029C Composition of unsaturated resin, preparation method, and method of application
10/07/2009CN100547010C Preparation method of non-ionic room temperature-cured aqueous epoxy curing agent
10/07/2009CN100546992C Oligomeric, hydroxy-terminated phosphonates
10/06/2009US7598325 curable epoxy resins of bisphenol A or bisphenol F type with a curing agent containing adduct of bisphenol A or F, diglycidyl ether and iosphorondiamine; adduct of bisphenol A or F with cyclohexane-1,3-bis/aminomethyl/-; isophorondiamine and cyclohexane-1,3-bis/aminomethyl/-; cured resin for coating film
10/06/2009US7597928 Material composition for packaging of light-sensitive components and method of using the same
10/01/2009WO2009120818A1 Coating for elastomeric substrates
10/01/2009WO2009120211A1 Polymeric compositions for plastic strapping
10/01/2009WO2009119598A1 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board, and semiconductor device
10/01/2009WO2009119467A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same
10/01/2009US20090247670 Epoxy Resin Molding Material for Sealing, and Electronic Component Device
10/01/2009US20090246913 acrylic polymer, epoxy resin, thermosetting resin, and as silicone a polysiloxane having aromatic side chain to improve compatibility with the epoxy resin and/or phenolic resin thermosetting agent, so it does not ooze out or cause outgas; stably connect a wire without contaminating a wire pad part
10/01/2009US20090242855 Voltage switchable dielectric materials with low band gap polymer binder or composite
10/01/2009CA2718437A1 Coating for elastomeric substrates
10/01/2009CA2718171A1 Epoxy resin composition, fiber-reinforced composite material, and method for producing the same
09/2009
09/30/2009CN101547558A Copper clad base plate and preparation method thereof
09/30/2009CN101545850A Composite material based on optical fiber multi-parameter sensing self-monitoring and microcapsule self repair
09/30/2009CN101544807A Epoxy anti-fouling material and preparation method and use of same
09/29/2009US7595351 Actinic radiation curable compositions and their use
09/29/2009CA2246453C Polyester compositions and use thereof in extrusion coating
09/24/2009WO2009116618A1 Curable composition, anisotropic conductive material and connection structure
09/24/2009WO2009116609A1 Resin composition and cured film thereof
09/24/2009US20090240006 A curable mixture of a naphthazine compound having a terminal aromatic ring bearing an hydroxyl group and a epoxy resins; high heat resistance; hardness; tensile strength;mechanical strength; dimensional stability; moldings; electronics; spacecraft; aircraft;automobile parts
09/24/2009US20090236036 Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition
09/24/2009US20090235754 Encapsulation composition for pressure signal transmission and sensor
09/23/2009EP2103652A1 Resin composition, prepreg and laminate
09/23/2009CN101538399A Damping type epoxy resin material and preparation method thereof
09/23/2009CN101538398A Preparation method of aramid fiber/epoxy resin composite material
09/23/2009CN101538397A Epoxy resin composition, glue film made of same and preparation method
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