| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/11/2010 | WO2010015779A1 Novel core-shell impact modifiers for transparent polymer matrices |
| 02/11/2010 | US20100036060 Electrolyte compositions |
| 02/11/2010 | US20100036022 Epoxy resin composition |
| 02/11/2010 | US20100035041 Derivatized solid epoxy resin and uses thereof |
| 02/11/2010 | DE102008040551B3 Verwendung von Polyvinylester-Festharzen als Schlagzähmodifizierer für Duroplasten Use of solid polyvinyl ester resins as impact modifiers for thermosets |
| 02/11/2010 | DE102007063698A1 Optisches Bauelement mit Oberflächenbeschichtung An optical device with surface coating |
| 02/10/2010 | CN101643572A Thermosetting resin composition and prepreg and laminate for printed circuits thereby |
| 02/10/2010 | CN101643571A Thermosetting resin composition and prepreg and laminate for printed circuits thereby |
| 02/10/2010 | CN101643570A Halogen-free flame resistance resin composite and prepreg, laminate and laminate for printed circuit prepared from same |
| 02/10/2010 | CN101643569A 环氧树脂组合物 The epoxy resin composition |
| 02/10/2010 | CN100588682C Modified plastic rubber composite material and method of preparing the same |
| 02/04/2010 | WO2010013741A1 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 02/04/2010 | WO2010013740A1 Resin composition for fuel cell separator, process for producing same, and fuel cell separator |
| 02/04/2010 | US20100029848 Process for producing epoxides from olefinic compounds |
| 02/04/2010 | US20100029839 Artificial marble and preparation process thereof |
| 02/04/2010 | US20100029802 Gels |
| 02/04/2010 | US20100025094 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board |
| 02/04/2010 | CA2719911A1 Resin composition for fuel cell separator, process for producing same, and fuel cell separator |
| 02/03/2010 | EP2148894A1 Flame retardant composition |
| 02/03/2010 | CN101638505A Low dielectric-epoxy resin/mesoporous molecular sieve hybrid material and preparation method thereof |
| 02/03/2010 | CN100587005C Self-repaired polymer composite material at room temperature |
| 02/03/2010 | CN100587004C High-performance compound resin and method for making same |
| 02/03/2010 | CN100587003C Semiconductor-sealing epoxy resin composition and semiconductor device using the same |
| 02/03/2010 | CN100587002C Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 02/03/2010 | CN100586980C Non-flow joint-filling composition |
| 02/02/2010 | US7655736 Polyamide curative from substituted amine mixture and dimer fatty acid or ester |
| 02/02/2010 | US7655709 Aqueous self-adhesive coating for electrical steel and its uses |
| 01/28/2010 | WO2010011714A2 Reactive liquid modifiers |
| 01/28/2010 | WO2010011710A2 Two-part epoxy-based structural adhesives |
| 01/28/2010 | WO2010011705A1 Two-part epoxy-based structural adhesives |
| 01/28/2010 | US20100021726 Excellent heat-dissipating black resin composition, method for treating a zinc coated steel sheet using the same and steel sheet treated thereby |
| 01/28/2010 | US20100019271 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same |
| 01/28/2010 | US20100018750 Curable epoxy resin composition |
| 01/27/2010 | EP2147036A1 Method and device for cleaning an absorptive polyester |
| 01/27/2010 | EP1812511B1 Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom |
| 01/27/2010 | CN101633772A Epoxy resin composition for transformers and process for casting transformer by composition |
| 01/27/2010 | CN101633771A Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 01/27/2010 | CN101633770A Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same |
| 01/26/2010 | CA2393667C Blister-resistant molded polyurea polymer and method of making a blister-resistant molded polyurea polymer |
| 01/21/2010 | WO2010008931A1 Structural composites with improved toughness |
| 01/21/2010 | WO2010007859A1 Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device |
| 01/21/2010 | WO2010007150A2 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 01/21/2010 | US20100016498 Epoxy resin composition and cured article thereof |
| 01/21/2010 | US20100016497 Epoxy resin composition and semiconductor device |
| 01/21/2010 | US20100016475 Imidazole salts, method for producing them, use thereof and epoxy resins containing said salts |
| 01/21/2010 | US20100016474 Liquid epoxy resin composition |
| 01/21/2010 | US20100016473 Crystalline resin cured product, crystalline resin composite material, and method for producing the same |
| 01/21/2010 | US20100015551 Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
| 01/21/2010 | US20100015342 Coating composition less susceptible to surface defects |
| 01/21/2010 | US20100014263 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same |
| 01/20/2010 | EP2145924A1 Reaction products based on amphiphilic block copolymers and use thereof as impact modifiers |
| 01/20/2010 | EP2145906A1 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/20/2010 | EP2144953A1 Cross-linked silicone particles and method of manufacturing thereof |
| 01/20/2010 | EP1441008B1 Curable epoxy resin compositions and process for production thereof |
| 01/20/2010 | CN101631832A Photocurable compositions for preparing ABS-like articles |
| 01/20/2010 | CN101629011A Thermosetting epoxy bitumen material for roads and bridges and preparation method thereof |
| 01/20/2010 | CN101629010A Epoxy/POSS/carbon fiber nanometer composite material for light sports equipment and preparation method thereof |
| 01/20/2010 | CN101629009A Bituminous pavement preventive maintenance regenerant |
| 01/20/2010 | CN100584180C Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave |
| 01/20/2010 | CN100582161C Epoxy resin composition and using method thereof |
| 01/19/2010 | US7649041 Contains polyvinylamine, polyallylamine, polyethyleneimine, and polypropyleneimine, nonionic polyalcohol, tetraalkoxysilanes and trialkoxysilanes, and water |
| 01/19/2010 | CA2449590C Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 01/19/2010 | CA2134596C Improved double metal cyanide complex catalysts |
| 01/14/2010 | WO2010005710A1 Toughened curable compositions |
| 01/14/2010 | WO2010005100A1 Composition for reflective film, reflective film, and x-ray detector |
| 01/14/2010 | WO2010004189A2 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 01/14/2010 | US20100010146 Styrenic Thermoplastic Resin Composition Having Excellent Impact Resistance and Paintability |
| 01/14/2010 | US20100009201 thermosetting resins; butadiene-methacrylate core shell particles; high performance; dielectrics; fireproofing |
| 01/14/2010 | US20100009196 Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
| 01/14/2010 | US20100009149 Transparent composite sheet |
| 01/14/2010 | US20100009086 Rapid cure coating system |
| 01/14/2010 | US20100006329 Sealing material and mounting method using the sealing material |
| 01/14/2010 | DE19727540B4 Verfahren zur Herstellung von gehärteten Formstoffen A process for the production of cured molded materials |
| 01/14/2010 | CA2726062A1 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 01/13/2010 | EP1615964B1 Process for the manufacture of phenolic-blocked polyurethane prepolymers |
| 01/13/2010 | CN101624463A Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board |
| 01/12/2010 | US7646088 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 01/12/2010 | US7645514 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 01/12/2010 | CA2454493C Method of forming conductive polymeric nanocomposite materials and materials produced thereby |
| 01/07/2010 | WO2010001754A1 Prepreg for printed wiring board and printed wiring board |
| 01/07/2010 | WO2009085191A3 Syntactic foam compositions, pipelines insulated with same, and method |
| 01/07/2010 | US20100004376 Coating compositions containing reactive diluents and methods |
| 01/07/2010 | US20100004356 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/07/2010 | US20100004355 Anticorrosive coating composition |
| 01/07/2010 | US20100003771 Production method of semiconductor device and bonding film |
| 01/07/2010 | US20100003513 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
| 01/07/2010 | US20100003512 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 01/07/2010 | US20100001415 Liquid epoxy resin composition |
| 01/07/2010 | US20100001311 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same |
| 01/07/2010 | US20100001226 Sheet-like soft magnetic material and production method thereof |
| 01/06/2010 | EP2141201A1 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same |
| 01/06/2010 | EP2141186A1 Resin composition for optical waveguide, and optical waveguide produced by employing the resin composition |
| 01/06/2010 | EP2141184A1 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 01/06/2010 | EP1812512B1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
| 01/06/2010 | EP1812510B1 Amphiphilic block copolymer-toughened epoxy vinyl ester and unsaturated polyester resins |
| 01/06/2010 | EP1683816B1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 01/05/2010 | US7642661 Flip-chip type semiconductor is encapsulated by a cured product of a liquid epoxy resin composition comprising a liquid epoxy resin, an amine type curing agent, sulfur-containing phenol compound, an inorganic filler; easy to handle and allows simplification of semiconductor device production process |
| 01/05/2010 | US7641975 Hardeners |
| 01/05/2010 | US7641967 Comprising heat resistant backing film layer and pressure-sensitive adhesive layer disposed on backing film layer, wherein pressure-sensitive adhesive layer comprises polymer resulting from polymerizing and crosslinking monomer mixture of alkyl(meth)acrylate, glycidyl(meth)acrylate, and (meth)acryic acid |
| 12/31/2009 | US20090326099 Process for continuous production of epoxy resins |