| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/11/2010 | US7713621 Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine |
| 05/11/2010 | CA2532282C Method for preparing and processing a sample for intensive analysis |
| 05/11/2010 | CA2331162C Curable two-component mortar composition and its use |
| 05/06/2010 | WO2010050472A1 Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| 05/06/2010 | WO2010050220A1 Organic-inorganic composite and manufacturing method therefor |
| 05/06/2010 | WO2010049221A1 Epoxide-based structural foam comprising thermoplastic polyurethanes |
| 05/06/2010 | WO2010049220A1 Epoxide-based structural foam having improved tenacity |
| 05/06/2010 | WO2010011710A3 Two-part epoxy-based structural adhesives |
| 05/06/2010 | WO2010004189A3 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 05/06/2010 | US20100113678 Fluorine-containing novolac resin, fluorine-containing surfactant, fluorine-containing surfactant composition, and resin composition |
| 05/06/2010 | US20100113643 Curatives for epoxy adhesive compositions |
| 05/06/2010 | US20100108368 Resin composition for forming insulating layer of printed wiring board |
| 05/06/2010 | US20100108364 Flame retardant compositions |
| 05/06/2010 | US20100108258 Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam |
| 05/06/2010 | DE102008053520A1 Strukturschaum auf Epoxidbasis mit thermoplastischen Polyurethanen Structural foam epoxy with thermoplastic polyurethanes |
| 05/06/2010 | CA2741738A1 Epoxide-based structural foam comprising thermoplastic polyurethanes |
| 05/06/2010 | CA2741736A1 Epoxide-based structural foam having improved tenacity |
| 05/05/2010 | EP2182025A1 Heat curable epoxide resin compositions suitable as bodyshop adhesive or structural foam |
| 05/05/2010 | CN1962752B Epoxy plastic packaging material and its preparation method |
| 05/05/2010 | CN101701099A Epoxy resin film for resin film melt impregnating process and preparation method thereof |
| 05/05/2010 | CN101701058A Epoxy resin containing melamine-organic silicon hybrid structure and preparation method and application thereof |
| 05/04/2010 | US7709852 Wavelength-converting casting composition and light-emitting semiconductor component |
| 05/04/2010 | US7709582 Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material |
| 05/04/2010 | US7709085 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| 04/29/2010 | WO2010048297A2 Passive electrical article |
| 04/29/2010 | WO2010047411A1 Thermosetting resin composition |
| 04/29/2010 | WO2010047200A1 Anisotropic electroconductive film |
| 04/29/2010 | US20100105811 Semi-mineral paint composed of three agglutinants or film-forming agents |
| 04/29/2010 | US20100104804 Three-Dimensional Object Having Smoothed Fabricated Edge Surface |
| 04/29/2010 | US20100104794 Thermosetting epoxy resin composition and semiconductor device |
| 04/28/2010 | CN1867631B Electric conductor provided with an adherent layer and method for the production of said electric conductor |
| 04/28/2010 | CN1735654B Flame-retardant for engineering thermoplastic applications |
| 04/28/2010 | CN101698741A Synthetic resin composite for pouring low-voltage bus bar |
| 04/28/2010 | CN101698740A Synthetic resin composite for pouring middle-voltage bus bar |
| 04/28/2010 | CN101698739A Carbon fiber composite core composition and method for preparing carbon fiber composite core |
| 04/27/2010 | US7704559 Epoxy resins with improved elasticity |
| 04/27/2010 | US7704424 Method of making models |
| 04/22/2010 | WO2010044244A1 Curable resin composition and reflective sheet |
| 04/22/2010 | WO2009030604A3 Flame-retardant additives |
| 04/22/2010 | US20100099800 Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof |
| 04/22/2010 | DE102009048434A1 Leitfähige Polymerzusammenfassung, Verfahren zu ihrer Herstellung und Festelektrolytkondensator Conductive polymer summary, process for their preparation and solid electrolytic capacitor |
| 04/21/2010 | EP2177546A1 Resin material for optical purposes, and optical element utilizing the same |
| 04/21/2010 | EP2176348A1 Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
| 04/21/2010 | CN1732199B Curable resin composition and products of curing thereof |
| 04/21/2010 | CN101696317A Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof |
| 04/21/2010 | CN101696316A Method for preparing radiation protection materials |
| 04/21/2010 | CN101696303A Novel compatibilized polypropylene/glass fiber composite material and preparation method thereof |
| 04/21/2010 | CN101696264A Epoxy resin sealing material and method for preparing same |
| 04/21/2010 | CN101696263A Epoxy resin curing agent, method for preparing same and application thereof |
| 04/15/2010 | WO2010042369A1 Epoxy resins and composite materials with improved burn properties |
| 04/15/2010 | WO2009150449A3 Water absorbing polymeric material. |
| 04/15/2010 | US20100093947 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof |
| 04/15/2010 | US20100092782 Process for treating wood for increasing the lifetime thereof and wood thus obtained |
| 04/15/2010 | US20100092764 Epoxy resin varnishes, laminates and printed circuit boards |
| 04/15/2010 | DE102008049888A1 Sealant between magnetic system and sheathing, useful e.g. for magnetic system of sintered rare earth magnetic material, comprises multi-component solvent-free epoxide resin mixture and epoxide resin hardener based on aliphatic diamine |
| 04/14/2010 | EP2174969A1 Resin composition |
| 04/14/2010 | EP2173791A2 Water-based dispersions of highly-branched polymers |
| 04/14/2010 | EP1608717B1 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 04/14/2010 | CN101694251A Self-heating high pressure resistant oil transmission pipeline and manufacturing process thereof |
| 04/14/2010 | CN101104727B Halogen-free resin composition and resin-coated copper foil of the same for high-density interconnection |
| 04/13/2010 | US7696286 resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation |
| 04/13/2010 | US7695806 solvent-free mixture of epoxy resin, hardener for epoxy resin( phenol novolaks and cresol novolaks), microgel which is reaction product of unsaturated carboxylic acid ( acrylic acid ) and base ( 2-ethyl-imidazole), and electroconductive filler like graphite; biopolar plates |
| 04/08/2010 | WO2010038673A1 Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
| 04/08/2010 | WO2010038644A1 Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board |
| 04/08/2010 | WO2010037918A1 Chemically gelled curable composition based on epoxy-amine resins and on ionic liquids |
| 04/08/2010 | WO2009140087A3 Windmill propeller blade and method of making same |
| 04/08/2010 | US20100087590 Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin |
| 04/08/2010 | US20100087588 Hydroxy Ester Pre-Extended Epoxy-Terminated Viscosifiers and Method for Producing the Same |
| 04/08/2010 | US20100087568 Aqueous epoxy resin compositions |
| 04/08/2010 | US20100087567 Epoxy group-terminated polymers, the compositions thereof and the use thereof as impact resistance modifiers |
| 04/08/2010 | US20100084170 Composite-forming method, composites formed thereby, and printed circuit boards incorporating them |
| 04/08/2010 | DE102008049199A1 Sealing compound, useful for preparing a scintillator-composite that is useful for detecting X-ray radiation, comprises a scintillator-powder distributed in a crosslinked organic matrix material with a ceramic scintillator-material |
| 04/07/2010 | CN101691440A Resin composition for optical components, optical component using the same and production method of optical lens |
| 04/07/2010 | CN101691418A Adhesive epoxy composition and process for applying it |
| 04/07/2010 | CN101215369B Optical cured resin, photosensitive resin composition and preparation method thereof |
| 04/06/2010 | US7692318 Liquid epoxy resin composition and semiconductor device |
| 04/06/2010 | US7691944 placing a thermoplastic or elastomeric substrate in a mold, placing a primer in the mold comprising a film of an epoxy-grafted polypropylene or copolymer coupling through a maleic acid or maleic anhydride coupling agent, heating to form moldings; repairing, inserting, assembling or coating |
| 04/01/2010 | WO2010035859A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 04/01/2010 | WO2010035601A1 Printed wiring board and method for manufacturing same |
| 04/01/2010 | WO2010035571A1 Composition for antireflective layer, antireflective film, polarizing plate and image display device |
| 04/01/2010 | WO2010035502A1 Sealant, sealing member and organic el device |
| 04/01/2010 | WO2010035452A1 Resin composition, cured body and multilayer body |
| 04/01/2010 | WO2010035451A1 Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body |
| 04/01/2010 | WO2010034531A1 Photocurable composition |
| 04/01/2010 | WO2009141438A3 Novel fast curing ultra high solids low voc coating system for aggressive corrosive environments |
| 04/01/2010 | US20100081732 Method of using hyperbranched polyamine to exfoliate inorganic clay into random form of nanosilicate platelet |
| 04/01/2010 | US20100081258 die bonding a semiconductor chip onto an adherent substrate and a lead frame; dicing die-bonding film; excellent adhesion and has preferable peel/pickup properties; surface free energy before heat curing is 37 mJ/m.sup.2 or more and less than 40 mJ/m2; 15 to 30% thermoplastic and 60 to 70% thermosetting |
| 04/01/2010 | US20100078830 Adhesive tape and semiconductor device using the same |
| 04/01/2010 | CA2735996A1 Epoxy resin composition, prepreg and fiber-reinforced composite material |
| 04/01/2010 | CA2734404A1 Photocurable composition |
| 03/31/2010 | EP2168994A1 Photocurable composition |
| 03/31/2010 | EP1551890B1 Curable compositions and rapid prototyping process using the same |
| 03/31/2010 | EP1505090B1 Reactive diluent composition and curable resin composition |
| 03/31/2010 | CN101688051A Epoxy resin-forming liquid preparation containing inorganic particle |
| 03/31/2010 | CN101684191A Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same |
| 03/30/2010 | US7687556 Flame retardant compositions |
| 03/25/2010 | WO2010032650A1 Phosphorus-containing phenol compounds, manufacturing method therefor, curable resin compositions and cured products using same |
| 03/25/2010 | US20100075134 Interfacial Functionalization For Self-Healing Composites |
| 03/24/2010 | EP2166037A1 Epoxy resin-forming liquid preparation containing inorganic particle |
| 03/24/2010 | EP2166036A1 Resin composition, embedding material, insulating layer, and semiconductor device |