Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
06/2010
06/24/2010WO2010071107A1 Thermosetting modified polyamide resin composition
06/24/2010WO2010070947A1 Resin paste for die bonding, method for producing semiconductor device, and semiconductor device
06/24/2010WO2010069049A1 Epoxy resin compositions and curing agents for thermally insulating ultra-deep sea equipment used for oil and gas production
06/24/2010US20100160555 Resin composition
06/24/2010US20100160494 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate
06/24/2010US20100155739 Light-emitting device, method for manufacturing same, molded body and sealing member
06/24/2010DE102009055188A1 Zusammensetzung aus verzweigtem Polycarbonatharz, sowie verzweigtes Polycarbonatharz und Formkörper daraus Composition of branched polycarbonate resin, and branched polycarbonate resin and molded article thereof
06/23/2010EP2199339A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
06/23/2010EP2199338A2 Polyetheralkanolamine dispersants
06/23/2010EP2197953A1 End use applications prepared from certain block copolymers
06/23/2010CN1946795B Dual-stage wafer applied underfills
06/23/2010CN1926214B Adhesive sheet for light-emitting diode device and light-emitting diode device
06/23/2010CN101755008A Curable resin composition and cured product
06/23/2010CN101754993A catalyst for curing epoxides
06/23/2010CN101754989A Flame retardant composition
06/23/2010CN101747649A Resin composition, electronic component using the same and production method therefor
06/23/2010CN101747646A Composite systems, articles incorporating the system, methods for in-situ, non-destructive testing of these and array probes useful for the methods
06/23/2010CN101747643A Voltage sensitive material, preparation and application thereof
06/23/2010CN101747594A Epoxy acrylate prepolymer resin and preparation method thereof and application in photocurable coating
06/23/2010CN101747593A Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof
06/23/2010CN101747592A Formulation of small glass fiber reinforced plastic sleeve and underground structure
06/23/2010CN101747591A Prescription and production process of water source well glass steel sleeve
06/23/2010CN101747590A Photocurable resin composition for sealing organic el device
06/23/2010CN101747589A Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material
06/23/2010CN101747587A Flame-retarded resin compound, prepreg and preparation method thereof, copper-clad plate and preparation method thereof
06/23/2010CN101747533A Modification clay and clay-high polymer composite
06/23/2010CN101747491A Fast thickening vinyl ester resin as well as preparation method and application thereof
06/23/2010CN101747368A Partially alkylated phosphinic acid nonalkali metal salt and preparing method and application thereof
06/23/2010CN101746102A Compound base copper-clad laminate and manufacturing method thereof
06/23/2010CN101250315B Utilization and processing method for substrate material of waste and old printed circuit board
06/23/2010CN101228621B Adhesive composition for semiconductor, semiconductor device using the same and method for producing semiconductor device
06/22/2010US7741413 A cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid; the ether and thiocarbonate and/or the amine and the carboxylic acid may be combined in one compound; low volume shrinkage upon curing; high precision applications; enhanced pot life; no foaming during curing
06/22/2010US7741388 A phenol-aldehyde glycidyl either resin, phenolic resin with biphenyl units, inorganic filler, a 3-mercapto-1,2-4-triazole, and curing accelerator; high flame resistance without any flame retardant; high solder reflow resistance; lead-free flowable solder
06/22/2010US7740734 An epoxy compound, a cationic catalyst such as diaryliodonium hexafluorophosphate, and as a shrinkage suppressant a dibenzo- or benzonaphtho- oxepinane or oxepinone such as 6,7-Dihydro-5H-dibenz[c,e]oxepin; adhesives, sealants and coatings.
06/17/2010WO2010066647A1 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
06/17/2010US20100152365 Carboxylic acid-modified nitrile copolymer latex and latex composition for dip forming comprising the same
06/17/2010US20100152362 Aliphatic Polyester Copolymer, Method for Preparing the Same and Polylactic Acid Resin Composition Using the Same
06/17/2010US20100152312 polymerizing in presence of gelling catalyst bis-(N,N-dimethylaminopropyl)amine and a blowing catalyst N,N-dimethylamino-ethyl-N'-methyl-ethanolamine; reacting polyoxyethylene glycol polyether from a premix and diphenylmethane diisocyanate with water blowing agent; insulation; low amine emissions
06/17/2010US20100151253 Primer Compositions for Adhesive Bonding Systems
06/17/2010US20100148380 Thermosetting epoxy resin composition and semiconductor device
06/17/2010US20100148379 Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same
06/17/2010US20100148130 Composition for circuit connection film and circuit connection film using the same
06/16/2010EP2196501A1 Thermoseting epoxy resin composition and semiconductor device
06/16/2010EP2195813A1 Electrical insulation system with improved electrical breakdown strength
06/16/2010CN1854186B Semiconductor encapsulating epoxy resin composition and semiconductor device
06/16/2010CN1854185B Semiconductor encapsulating epoxy resin composition and semiconductor device
06/16/2010CN1795238B 环氧树脂组合物 The epoxy resin composition
06/16/2010CN1730548B Resin composition, method of its composition, and cured formulation
06/16/2010CN1637037B Hardeners
06/16/2010CN101735667A Sol-gel modified organic montmorillonoid and organic silicon sol-gel for modification
06/16/2010CN101735623A Warm mixed epoxy bitumen material and preparation method thereof
06/16/2010CN101735611A Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate
06/16/2010CN101735573A Modified epoxy resin film for RFI molding process and preparation method thereof
06/16/2010CN101735572A Formula of eccentric wear-resistant oil pipe and production process
06/16/2010CN101735571A Formula for layered water injection pipe and production technology thereof
06/16/2010CN101735570A Epoxy resin system used for blades of wind driven generator and modification method thereof
06/16/2010CN101735569A Preparation method of transparent inflaming retarding epoxy resin
06/16/2010CN101735568A Epoxy resin component used for blades of wind driven generator
06/16/2010CN101735567A Powdered epoxy resin toughener and preparation method thereof
06/16/2010CN101735566A Processable full sea-depth buoyancy material and manufacture method
06/16/2010CN101735565A Self-healing and scratch resistant shape memory polymer system
06/16/2010CN101735564A Vacuum infusion resin for wind turbine blades and preparation method thereof
06/16/2010CN101735563A Composite heat-conducting insulated film and method for manufacturing same
06/16/2010CN101735562A Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition
06/16/2010CN101735561A Electrothermal organic power resistance slurry for heater
06/16/2010CN101735560A Casting mixture for epoxy casting transformer and preparation method thereof
06/16/2010CN101735559A Glue liquor for making copper clad laminates
06/16/2010CN101735558A Glue solution for copper-clad plate
06/16/2010CN101735557A Insulation material for cable joint
06/16/2010CN101735556A Glue solution for reinforced plate
06/16/2010CN101735456A High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby
06/16/2010CN101735428A Preparation method of epoxy resin system used for blades of wind driven generator
06/16/2010CN101734862A Method for preparing environment-friendly high-modulus glass fiber
06/16/2010CN101733993A Manufacturing method of lead-free copper-clad plate
06/16/2010CN101319085B Light-high-strength epoxy foam material and preparation method thereof
06/16/2010CN101056932B Polyetheralkanolamine dispersants
06/15/2010US7737199 enhanced adhesion to sheet molding compound; improved toughness, impact resistance; for use in vehicle assembly
06/15/2010US7736744 microstructure particles comprising graft polymers, water soluble polyetherurethane copolymers, polyepoxides and polyesters, used as primers for automobile coatings; bonding strength and solvent resistance
06/15/2010US7736743 Liquid epoxy resin; solid epoxy resin; propellant; curing agent; 2-component filler of muscovite-mica and quartz; composition contains no hollow glass beads; stiffening and reinforcing of hollow metal structures such as hollow car parts
06/10/2010WO2010064560A1 Connecting film, joined body, and manufacturing method therefor
06/10/2010WO2010019539A3 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates
06/10/2010US20100144977 Curing agents for epoxy resins
06/10/2010US20100144972 Polymer composition, transferring belt for electrophotography, image-forming apparatus and method for producing polymer composition
06/10/2010US20100144965 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
06/10/2010US20100144929 Liquid solventless synthetic-rubber-based composition
06/10/2010US20100144928 Curable Epoxy Resin Composition, Cured Body Thereof, and Use Thereof
06/10/2010US20100144926 Epoxy resin composition
06/10/2010US20100140638 Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
06/10/2010US20100140537 Curable Silicone Composition
06/09/2010EP2194098A1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
06/09/2010EP2194085A1 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
06/09/2010CN1903919B Polymer electrolyte for a fuel cell, a method of producing the same, and a fuel cell system comprising the same
06/09/2010CN101730862A Liquid crystal aligning agent, liquid crystal alignment film, method for producing the same, and liquid crystal display device
06/09/2010CN101724228A Epoxy resin composition for repairing plastics, and preparation and application thereof
06/09/2010CN101724227A Insulating material of electric locomotive transformer output terminal and production process thereof
06/09/2010CN101724226A Modified hot setting resin and preparation method thereof
06/09/2010CN101724225A Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
06/09/2010CN101724224A Composite material of NiMnGa magnetic memorial alloy and epoxide resin and preparation method thereof
06/09/2010CN101724223A Epoxy resin compound for pouring high-tension current inductor, preparation and application thereof
06/09/2010CN101724218A Unsaturated resin composition as well as preparation method and a purpose thereof
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