Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
11/1999
11/04/1999WO1999055754A1 Powder coatings or adhesives employing silanes or silane treated fillers
11/03/1999EP0953621A1 Adhesive resin composition and sealing resin composition
11/03/1999EP0953606A1 Polyarylene sulfide resin composition
11/03/1999EP0953603A2 Flame retardant semiconductor encapsulating epoxy resin compositions
11/03/1999EP0953587A2 Coating composition containing a non-halogen onium salt
11/03/1999EP0953008A1 Thermosetting resin compositions
11/03/1999EP0837908A4 Electroactive polymer coatings for corrosion control
11/03/1999CN1234044A Crosslinkable polymers
11/03/1999CN1233626A Latence catalyst and use thereof
11/02/1999US5977238 Rubber composition based on carbon black having silica fixed to its surface and on diene polymer functionalized with alkoxysilane
11/02/1999US5976700 Aqueous coating composition
10/1999
10/28/1999WO1999054417A1 Resin compositions for coatings
10/28/1999WO1999054393A1 Polymer composite and a method for its preparation
10/28/1999DE19918580A1 Epoxy resin composition, useful for encapsulation of semiconductor devices
10/28/1999CA2328777A1 Polymer composite and a method for its preparation
10/27/1999EP0644914B1 Inorganic fillers and organic matrix materials whose refractive index is adapted
10/27/1999CN1233262A Epoxy resin mixtures
10/26/1999US5973034 Glass powder/diluent/epoxy-containing (meth)acrylate copolymer resin mixture for forming accurately patterned resistors, phosphors, conductors with good adhesion and low organic residue after pyrolysis
10/26/1999US5972432 Aqueous coating composition
10/20/1999EP0951070A1 Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
10/20/1999EP0951064A1 Manufacture of semiconductor device
10/20/1999CN1232054A Compound epoxy resin
10/19/1999US5969060 Mixing with controlled heating between melting point of crystalline epoxy resin and softening point of amorphous epoxy resin yields uniform dispersion, for paints, adhesives, encapsulation of semiconductors
10/19/1999US5969059 Composition comprising alicyclic epoxy compound, acid anhydride curing agent, organic aluminum compound, butyl glycidyl ether
10/19/1999US5969053 Treating surface with gas of chlorine, fluorine, oxygen, ozone, sulfur trioxide or an oxidative acid
10/19/1999US5969036 Epoxy-containing die-attach compositions
10/19/1999CA2023122C Polyamide and/or polyetheresteramide powdery thermoplastic compositions; process for preparing the same and their use for coating metallic substrates
10/14/1999WO1999051675A1 Conductive sheet molding compound
10/14/1999WO1999051659A1 Low viscosity compositions of epoxy functional polyester resins
10/14/1999CA2327496A1 Low viscosity compositions of epoxy functional polyester resins
10/14/1999CA2327269A1 Conductive sheet molding compound
10/13/1999EP0949286A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition
10/13/1999EP0948554A2 Material containing polyreactions products and method for the production thereof
10/13/1999CN1231764A Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same
10/13/1999CN1231307A Curable polyphenylene ether-thermosetting resin composition and process
10/13/1999CN1231306A Epoxy resin composition
10/12/1999US5965668 Polyamide injection mouldings which include an impact strength modifier that has a particular distribution in the polyamide
10/12/1999US5965665 Rubber modified thermoplastic resin, gel polymer of inert carrier polymer such as polycarbonate or polystyrene resin, and low molecular weight polyolefin gives improved impact strength and low surface gloss
10/12/1999US5965645 Plastisol composition
10/12/1999US5965637 Use of silicone-modified epoxy resins as sealing compound
10/06/1999EP0947532A1 Epoxy resin composition for printed circuit board and printed circuit board using the same
10/06/1999EP0760829B1 Polyester/polycarbonate blends having enhanced properties
10/06/1999CN1230572A Ionizing radiation curable resin composition for fresnel lens and transmission screen
10/05/1999US5962629 Blend of epoxy resin, polyamide curing agent and water
10/05/1999US5962602 Ultra-low viscosity epoxy sealer/healer
10/05/1999US5962586 Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
10/05/1999US5962139 Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer
09/1999
09/30/1999WO1999048980A1 Thermosetting resinous binder compositions, their preparation and use as coating materials
09/30/1999CA2325518A1 Thermosetting resinous binder compositions, their preparation and use as coating materials
09/29/1999EP0945491A2 Resin composition and molded products
09/28/1999US5959062 Polyester resin having an acid value of 5-80 koh mg/g, epoxidized diene-based block copolymer, unvulcanized rubber; fracture strength, modulus
09/28/1999US5959043 Halogen-free flame resistant epoxy resins
09/28/1999US5959042 Material comprising a polyamide, a polymer having polyamide and polyether blocks and a functionalized polyolefin, and film and object obtained therefrom
09/28/1999US5958996 Method for producing a diffusion barrier and polymeric article having a diffusion barrier
09/23/1999WO1999047604A1 A method of producing modified polyester moulded articles, and said moulded articles
09/22/1999EP0943639A2 Epoxy resin composition and resin-encapsulated semiconductor device
09/22/1999EP0942949A1 Gas barrier coating compositions containing platelet-type fillers
09/22/1999EP0757067B1 Thermosetting composition
09/21/1999US5955195 Glass fibre size composition, method using same, and resulting products
09/21/1999US5955184 Bisphenol a type epoxy resin, novolak type epoxy resin, nitrogen-containing phenolic resin acting as a curing agent which is a reaction product of a phenolic compound, a guanamine compound and an aldehyde compound.
09/21/1999US5955149 Release coatings on substrates
09/21/1999CA2184406C Epoxy/amine barrier coatings
09/21/1999CA2114552C Moisture resistant thermoset cable jacket
09/16/1999WO1999046343A1 High temperature resistant coating composition and method of using thereof
09/15/1999EP0942028A1 Epoxy resin composition
09/15/1999EP0942026A2 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus using same
09/15/1999EP0942025A2 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same
09/15/1999EP0941287A1 Polycarbonate blend compositions
09/15/1999EP0773272B1 Photochromic curable composition
09/15/1999EP0752980B1 Substituted phenyl compounds and processes for preparing the same
09/15/1999EP0591207B1 Plastic molded pieces having the appearance of a solid metallic piece
09/14/1999US5952439 Epoxy group-containing silicone resin and compositions based thereon
09/14/1999US5952438 Polymeric polyamines from alternating polyketones
09/14/1999US5952435 A cured blends comprising a glycidylamine epoxy resin thermosetting resin, a 2-functional epoxy resin, an aromatic polycarbonate thermoplastic resin, an acid anhydride curing agent and reinforcing fibers; a belt for snowmobile
09/14/1999CA2091063C Aminoplast resin or aminoplast resin precursor
09/13/1999CA2265216A1 Epoxy resin composition and resin-encapsulated semiconductor device
09/10/1999WO1999045063A1 Polyolefin resin composition, laminate thereof, and process for producing the same
09/08/1999EP0939963A1 Method of impregnating components
09/08/1999EP0531511B1 Post-extended anionic acrylic dispersion
09/07/1999US5948881 Polyamide curing agents based on mixtures of polyethylene-amines, piperazines and deaminated bis-(p-aminocyclohexyl) methane
09/07/1999US5948514 Photocurable thermosettting resin composition developable with aqueous alkali solution
09/02/1999WO1999043730A1 Epoxy resin hardener and one-pack type epoxy resin composition
09/02/1999WO1999043729A1 Curable composition comprising epoxidised natural oils
09/02/1999WO1999043638A1 Preparation of polyindanebisphenols and polymers derived therefrom
09/02/1999CA2322279A1 Preparation of polyindanebisphenols and polymers derived therefrom
09/02/1999CA2319569A1 Curable composition comprising epoxidised natural oils
08/1999
08/31/1999US5945501 Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls
08/31/1999US5945500 Low free resorcinol content; vulcanizable rubbers
08/31/1999US5945487 Vinyl copolymer; improved finished appearance, blocking resistance
08/31/1999US5945188 Insulating film of adhesive layer, polyamide resin, inorganic filler, epoxy resin layer with siloxane
08/26/1999WO1999042524A1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures
08/26/1999WO1999042449A1 Novel compounds, hardening accelerator, resin composition, and electronic part device
08/26/1999CA2319218A1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures
08/25/1999EP0937763A2 Conductive epoxy adhesive
08/25/1999EP0937736A2 Crosslinking a water-absorbing agent
08/25/1999CN1226580A High optical contrast resin composition and electronic package utilizing same
08/25/1999CA2228283A1 Chemical anchor bolt and cap assembly
08/24/1999US5942583 Primer composition
08/24/1999US5942285 Extrusion coating compositions and method
08/24/1999US5942182 One component room temperature stable epoxy resin compositions for VARTM/RTM systems
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