| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/02/1999 | CN1218073A Poly (phenylene ether) thermoset compositions |
| 06/01/1999 | US5908902 Self-emulsifying aqueous epoxy resin dispersions |
| 06/01/1999 | US5908889 Polyamide binders for ceramics manufacture |
| 06/01/1999 | US5908882 Epoxy resin composition |
| 05/27/1999 | WO1999025768A1 Water compatible curing agents for epoxy resins |
| 05/27/1999 | WO1999009089A3 Aqueous dispersions of epoxy resins |
| 05/27/1999 | DE19750147A1 One-component epoxy resin for coating electronic components |
| 05/26/1999 | EP0918073A2 Flame retardant resin compositions |
| 05/26/1999 | EP0918071A1 Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives |
| 05/26/1999 | CN1217356A High-temp.-resisting wear-resisting anti-corrosion material of glass fiber reinforced plastics |
| 05/25/1999 | US5907333 Ink jet print head containing a radiation curable resin layer |
| 05/25/1999 | US5906784 Curable epoxy resin compositions |
| 05/25/1999 | CA2039050C Curing resin composition and its cured product |
| 05/20/1999 | WO1999024508A1 Crystallization resistant amidoamine compositions |
| 05/19/1999 | EP0916692A1 Ready-to-use two-component adhesive composition |
| 05/19/1999 | EP0916691A2 Process for molding and shaping of polymer blends |
| 05/19/1999 | EP0916688A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device |
| 05/19/1999 | EP0438524B1 Flame retardant epoxy molding compound, method and enscapsulated device |
| 05/19/1999 | CN1217005A UV curable composition |
| 05/19/1999 | CN1043416C Porous, absorbent, polymeric macrostructures and method for making same |
| 05/18/1999 | US5905103 Bisphenol-epichlorohydrin copolymer with hydroxyalkylamine and with formaldehyde and amines for pigment pastes |
| 05/18/1999 | US5904888 Curable compositions |
| 05/12/1999 | EP0915118A1 Epoxy resin composition and semiconductor device encupsulated therewith |
| 05/12/1999 | EP0914936A2 Cationic catalysts for epoxy resin formulations in pultrusion molding systems |
| 05/12/1999 | EP0914362A1 Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry |
| 05/12/1999 | EP0782593A4 Layered silicate-epoxy nanocomposites |
| 05/12/1999 | EP0705304B1 Process for preparing ceramic-like materials and the ceramic-like materials |
| 05/12/1999 | DE19851810A1 Curable resin material, e.g. for printed circuit boards |
| 05/12/1999 | CA2253622A1 Cationic catalysts for epoxy resin formulations in pultrusion molding systems |
| 05/11/1999 | US5902755 Acid resistant, reinforced composite of at least one thermoplastic and thermosetting matrix resin for heat resistance; high tensile fibers, sodium tetraborate or borosilicate glass particles |
| 05/11/1999 | CA2253099A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device |
| 05/11/1999 | CA2052286C Flexible intumescent coating composition |
| 05/11/1999 | CA2050024C Improved aqueous emulsion dispersion adhesives based on a polyol and a hindered isocyanate compound |
| 05/06/1999 | WO1999021907A1 Epoxy resin mixture, composites produced therefrom and the use thereof |
| 05/06/1999 | EP0913429A2 Siloxane-modified polyamideimide resin composition adhesive film, adhesive sheet and semiconductor device |
| 05/06/1999 | EP0913428A2 Ketone polymer-epoxy blend compositions |
| 05/06/1999 | EP0779904B1 Epoxy resin mixtures for prepregs and composites |
| 05/05/1999 | CN1215902A Process for impregnating electrical coils, and selected epoxy resin composition for carrying out the impregnation |
| 05/05/1999 | CN1043191C Double-component emulsifying agent for rosin and mfg method thereof |
| 05/04/1999 | US5900468 Epoxy resin composition |
| 05/04/1999 | CA2168390C Curable coating composition and method of forming a top coat |
| 05/04/1999 | CA2009303C Polymeric reaction product that becomes waterthinnable on protonation with an acid |
| 04/29/1999 | DE19747553A1 Epoxy resin mixture for fire-resistant composites |
| 04/28/1999 | EP0910600A1 Flexibilized epoxy resins |
| 04/21/1999 | CN1043065C Process for coating electroconductive substrate, and aqueous varnish solution for electrophoretic coating |
| 04/20/1999 | US5895620 Process for encapsulating an electronic component |
| 04/20/1999 | US5895186 Releasable barrier coating for chemical anchor bolt |
| 04/14/1999 | EP0908497A2 Dispensable resin paste |
| 04/14/1999 | EP0785953B1 Monohydroxylated diene polymers and epoxidized derivatives thereof |
| 04/14/1999 | CN1213678A Injection epxoy resin for high voltage switch and its mfg. method |
| 04/08/1999 | WO1999016618A1 Sealant composition, article including same, and method of using same |
| 04/08/1999 | DE19845050A1 Encapsulating material for semiconductors |
| 04/08/1999 | DE19845021A1 Epoxy resin composition for encapsulation of semiconductor devices |
| 04/08/1999 | DE19756577C1 Acoustic damping backing material for ultrasound transducer |
| 04/07/1999 | EP0906352A1 Novolak compounds useful as adhesion promoters for epoxy resins |
| 04/07/1999 | CN1212975A Polymer alloy and composition therefrom |
| 04/06/1999 | US5891969 Curable blends of polyepoxide and a polysiloxane/epoxy-containing polysilsesquioxane; storage stability; protective coatings for electronic components, e.g. semiconductors, integrated circuits; adhesion; |
| 04/06/1999 | US5891367 Based on a silver flake-filled polymeric reaction product of a liquid bisphenol a having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents. |
| 04/06/1999 | CA2131580C Novel phosphorus-containing flameproofing agents for epoxy resin materials |
| 03/31/1999 | EP0905180A2 Dust free stabiliser granules containing epoxide and process of their preparation |
| 03/31/1999 | CN1212716A Polymer-organoclay-composites and their preparation |
| 03/30/1999 | US5889125 Curing component for epoxy resins and the use thereof |
| 03/30/1999 | US5889124 Consists of an oxyalkylene polymer with atleast one silicon containing group having atleast one hydroxyl or hydrolyzable group bonded to a silicon atom, an epoxy resin, a ketimine compound and an aldehyde or ketone compound |
| 03/30/1999 | US5889115 Curable coating composition and method of forming a top coat |
| 03/30/1999 | US5889076 Blend of a polyepoxide and acrylic polymer |
| 03/30/1999 | US5888322 Sandwiching the slurry containing dispersion of gypsum and slip viscosity reducing agent selected from ethylene oxide-propylene oxide block copolymer or modified copolymer or homopolymer of ethylene oxide in a paper envelop, heating |
| 03/30/1999 | US5887345 Method for applying curable fill compositon to apertures in a substrate |
| 03/29/1999 | CA2248529A1 Dust-free, epoxy-containing stabilizer granules and the preparation process |
| 03/23/1999 | US5886099 Blend of thermoplastic polyester and a modified block polymer of vinyl aromatic compound and hydrogenated and/or nonhydrogenated conjugated diene compound which is also partially or wholly epoxidized; high tensile strength |
| 03/23/1999 | US5885723 High polymer epoxy resin, denatured polyamide obtained by reacting epoxy resin and polyamide, polyfunctional epoxy resin, curing agent |
| 03/18/1999 | WO1999013003A1 Biodegradable polyester compositions with natural polymers and articles thereof |
| 03/18/1999 | WO1999013000A1 Laminar prepreg |
| 03/18/1999 | CA2302618A1 Laminar prepreg |
| 03/17/1999 | EP0902054A1 A polymer alloy and a composition therefrom |
| 03/17/1999 | EP0792328B1 Coating composition for metal substrates |
| 03/17/1999 | EP0720630B1 Epoxy resin composition |
| 03/16/1999 | US5883160 Flame-retardant epoxy resin composition for case potting of film capacitors |
| 03/11/1999 | WO1999011691A1 Epoxy resin compositions |
| 03/10/1999 | EP0832163B1 Solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 03/10/1999 | EP0676456B1 Heat-resistant adhesive film for printed board and method of use thereof |
| 03/10/1999 | CN1210119A Rubber composition based on carbon black having silica fixed to its surface and on diene polymer functionalized with alkoxysilane |
| 03/09/1999 | US5880229 Urethane modified epoxy resin |
| 03/09/1999 | US5880180 Aldimine surface quality enhancers |
| 03/09/1999 | US5880179 Molded products for high voltage apparatus comprising brominated epoxy resins |
| 03/03/1999 | EP0899304A2 Hydrophobic epoxy resin composition |
| 03/03/1999 | EP0899300A2 Epoxy resin type composition for stiffening vehicle body |
| 03/03/1999 | EP0898595A1 Polyester compositions and use thereof in extrusion coating |
| 03/03/1999 | EP0824569B1 Flame resistant polyester resin composition |
| 03/03/1999 | CN1209829A Heat-fusible composition and multi-layer mouldings comprising layers made therefrom |
| 03/03/1999 | CN1209821A Polymerizable substances based on epoxides |
| 03/03/1999 | CN1209442A Photogeneration of amine by using alpha-amino acetophenone |
| 03/03/1999 | CN1209313A Compositions which undergo light-induced cationic curing and their use |
| 03/03/1999 | CN1042343C Epoxy-resin powder coating composition |
| 03/02/1999 | US5877260 Method of producing thermoplastic synthetic resin compositions with reduced diffusion cofficients |
| 03/02/1999 | US5877229 High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
| 02/27/1999 | CA2245469A1 Hydrophobic epoxy resin system |
| 02/25/1999 | WO1999009101A1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 02/25/1999 | WO1999009089A2 Aqueous dispersions of epoxy resins |
| 02/25/1999 | DE19736850A1 Curable plugging material for fixing anchor bars in bore holes |
| 02/24/1999 | EP0897710A2 Light-initiated cationic curable compositions and their use |