Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
03/2012
03/22/2012WO2012036164A1 Composition usable as heat-latent polymerization initiator
03/22/2012WO2012035865A1 Method for producing latent curing agent
03/22/2012WO2012035857A1 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate
03/22/2012WO2012035755A1 Liquid curable epoxy resin composition and adhesive agent containing same
03/22/2012WO2012034849A1 Paper coating compositions
03/22/2012US20120070593 Partially hydrogenated bisphenol-a-based polymers as substitutes for bisphenol-a-based polymers
03/22/2012CA2811229A1 Paper coating compositions
03/21/2012CN202170317U 用于环氧树脂生产线中的废水回收装置 Epoxy resin production line for wastewater recovery
03/21/2012CN102388100A Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
03/21/2012CN102388079A One-pack type cyanate-epoxy composite resin composition
03/21/2012CN102388078A Sealing composite and sealing sheet
03/21/2012CN102388077A Photocurable resin and photocurable resin composition
03/21/2012CN102382421A Liquid epoxy resin packaging material and preparation method thereof
03/21/2012CN102382282A Flexible curing agent applicable to electronic packaging material and synthesis method thereof
03/21/2012CN102382281A Resin composition, resin-based composite material and preparation method of the resin-based composite material
03/21/2012CN102382280A Synthesization method of tetraphenolethane epoxy resin
03/21/2012CN102382079A Itaconic acid glycidyl ester, and preparation method and application thereof
03/21/2012CN102040744B Mixed salt flame retardant of phosphoric acid, gluconic acid and melamine and preparation method thereof
03/21/2012CN101831145B Aqueous epoxy resin and preparation method thereof
03/21/2012CN101831053B Aqueous ultraviolet cured epoxy acrylic resin and preparation method thereof
03/21/2012CN101611066B Improved epoxy compositions
03/21/2012CN101426830B Epoxy resin composition for fiber-reinforced composite material
03/20/2012US8138234 Polyurethane composite materials
03/20/2012CA2521758C Epoxy resin composition
03/15/2012WO2012033700A1 Electrodeposition coatings including a lanthanide series element for use over aluminum substrates
03/15/2012WO2012033164A1 Curable resin composition
03/15/2012US20120065362 Polyetheramines, compositions including polyetheramines, and methods of making
03/15/2012CA2810505A1 Electrodeposition coatings including a lanthanide series element for use over aluminum substrates
03/14/2012CN102378772A Epoxy resin based core filler material developing low exothermic heat
03/14/2012CN102372901A Hydantoin epoxy resin composite for encapsulating semiconductor devices
03/14/2012CN102372836A Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
03/14/2012CN102372835A Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
03/14/2012CN101864044B Aqueous acrylic modified epoxy ester resin and synthesizing method thereof
03/14/2012CN101421672B Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same
03/14/2012CN101319041B Polyalkyleneamine adducts as curing agents for thick layer water-based epoxy systems
03/13/2012US8133968 Poly(orthoester) polymers, and methods of making and using same
03/13/2012US8133941 Aqueous epoxy resin compositions
03/08/2012WO2012030969A1 Elastomeric epoxy materials and the use thereof
03/08/2012WO2012030906A1 Elastomeric insulation materials and the use thereof in subsea applications
03/08/2012WO2012030339A1 Elastomeric insulation materials and the use thereof in subsea applications
03/08/2012WO2012030338A1 Elastomeric epoxy materials and the use thereof
03/08/2012WO2012029762A1 Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device
03/08/2012WO2012029690A1 Resin composition, prepreg, and laminate
03/08/2012WO2012029585A1 Dispersant comprising polycarboxylic acid resin that contains unsaturated groups
03/08/2012WO2012029425A1 Thermosetting epoxy resin composition and uses thereof
03/08/2012WO2012028323A1 Halogenation of 4,4'-methylene-bis-anilines
03/08/2012US20120058325 Fiber-reinforced composite sheet
03/07/2012EP2426160A1 Heat curable epoxy resin composition with water as foaming agent
03/07/2012EP2426159A1 Low temperature curable epoxy compositions
03/07/2012EP2426157A1 Diamine compositions and use thereof
03/07/2012EP2424917A1 Thermosettable resin compositions
03/07/2012EP2424916A1 Catalysis of epoxy resin formulations
03/07/2012EP2274359B1 Activator for epoxy resin compositions
03/07/2012EP1992655B9 Method of producing phenol resin and method of producing epoxy resin
03/07/2012EP1621562B1 Curing resin composition
03/07/2012CN102369482A Curable resin composition and printed wiring board
03/07/2012CN102369231A Polyester composite for forming thermoset films
03/07/2012CN102369230A Polyester composite for forming thermoset films
03/07/2012CN102369229A Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
03/07/2012CN101929109B Active diluent modified paper wet strength agent and preparation method thereof
03/06/2012US8129478 Polyester anhydride-based biopolymers
03/06/2012US8129456 Flame retardant compositions with a phosphorated compound
03/06/2012US8128837 particles of an adduct formed through the reaction of an epoxy resin with imidazole compounds and an ethyl cellulose film covering the surfaces of the particles, exhibiting excellent solvent resistance, low temperature quick setting ability and storage stability
03/01/2012WO2012026519A1 Electrically conductive transparent base, touch panel, resistive touch panel, and capacitive touch panel
03/01/2012WO2012026298A1 Photosensitive composition for recording volume hologram, and method for manufacturing medium
03/01/2012WO2012026012A1 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
03/01/2012US20120053302 Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom
03/01/2012US20120052284 Gelator-stabilized crystalline resins
03/01/2012CA2807751A1 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
02/2012
02/29/2012EP2421915A1 Anisotropic composite
02/29/2012EP2421907A1 Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom
02/29/2012EP2421906A1 Polyisocyanate composition
02/29/2012EP2421687A1 Method of making chemically resistant moulds and tools
02/29/2012EP2421661A1 Multilayer varnish, a method for the production thereof and use thereof
02/29/2012EP2148894B1 Flame retardant composition
02/29/2012EP2083019B1 Photocurable/thermosetting resin composition and obtained dry film
02/29/2012CN102365310A Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
02/29/2012CN102365309A Thermosetting compositions containing isocyanurate rings
02/29/2012CN101704990B Method for preparing clay for wind turbine blade mould
02/29/2012CN101495533B Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
02/29/2012CN101223207B Epoxy resin composition and semiconductor device
02/28/2012US8124716 Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound
02/23/2012WO2012023435A1 Epoxy compound, curable composition, and cured product thereof
02/23/2012WO2012022390A1 Process for producing breakdown-resistant ultrathin dielectrics in electronic components using crosslinkable polymeric dielectric materials
02/23/2012US20120046425 Polymeric glycidyl ethers reactive diluents
02/23/2012US20120046381 Method For Curing Resin With Ultrasound
02/22/2012EP2420545A1 Adhesive composition, bonding method, laminate and tire
02/22/2012EP2420529A1 Glass fiber-silsesquioxane composite molded article and method for producing same
02/22/2012EP1666515B1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
02/22/2012CN102361903A Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board
02/22/2012CN101747489B 水性紫外光固化涂料专用环氧树脂及其制备方法与应用 Waterborne UV-curable coatings special epoxy resin and its preparation method and application
02/21/2012US8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
02/16/2012WO2012021253A1 Epoxy formulations with controllable photospeed
02/16/2012WO2012020730A1 Epoxy silicone condensate, curable composition comprising epoxy silicone condensate, and cured product thereof
02/16/2012WO2012020713A2 Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
02/16/2012WO2012020688A1 Low moisture permeability resin composition and hardened material thereof
02/16/2012WO2012020661A1 Epoxy resin composition and hardener
02/16/2012WO2012020625A1 Curable resin composition and cured article thereof
02/16/2012WO2012020572A1 Latent curing agent composition and one-part curable epoxy resin composition
02/16/2012US20120041170 Reactive inorganic clusters
1 ... 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 ... 303