Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
02/2012
02/16/2012US20120041102 Novel epoxy resin and epoxy resin composition comprising the same
02/16/2012US20120041101 Catalysis of epoxy resin formulations
02/16/2012US20120040581 Template-supported method of forming patterns of nanofibers in the electrospinning process and uses of said nanofibers
02/15/2012EP2417176A1 Carbon nanotubes comprising hydroxy groups, method for the production thereof and polyurethane polymers comprising said carbon nanotubes
02/15/2012EP2292678B1 Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition
02/15/2012CN102356110A Curable compositions containing cyclic diamine and cured products therefrom
02/15/2012CN102356109A Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
02/15/2012CN102352090A Flame retarded epoxy resin composite material
02/15/2012CN102352089A Vegetable fiber reinforced biomass resin lamellar material and preparation method thereof
02/15/2012CN102352043A Epoxy-polysiloxane resin for paint and preparation method thereof
02/15/2012CN102352040A Process for preparing organic silicon compounds
02/15/2012CN102352025A Preparation method of silica modified epoxy resin curing agent and varnish
02/15/2012CN102352024A Application of waterborne epoxy resin to protection of historic tombs
02/15/2012CN102352023A Preparation method of modified epoxy resin
02/15/2012CN101864146B 印刷电路覆铜板用环氧树脂组合物 Printed circuit CCL epoxy resin composition
02/14/2012US8114948 Photosensitive compositions based on polycyclic polymers
02/14/2012US8114922 Ink and laminated sheet
02/14/2012US8114519 Derivatized solid epoxy resin and uses thereof
02/14/2012US8114508 Composition of modified maleic anhydride and epdxy resin
02/14/2012US8114294 Multi-layered macromolecules and methods for their use
02/09/2012WO2012019073A1 Epoxidized composition and methods for making the same
02/09/2012WO2012018123A1 Anisotropic conductive adhesive film and curing agent
02/09/2012WO2012017948A1 Epoxy compound with nitrogen-containing ring
02/09/2012WO2012017896A1 Epoxy resin composition having monocyclic aliphatic hydrocarbon ring
02/09/2012WO2012017894A1 Method for producing epoxy compound having cyanuric acid skeleton
02/09/2012WO2012017885A1 Composition for forming liquid crystal layer, liquid crystal display device, and method for producing liquid crystal display device
02/09/2012WO2012017816A1 Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board
02/09/2012WO2012017138A1 Novel hydrosilylation catalysts
02/09/2012US20120034464 Diamond particles having organic compounds attached thereto, compositions thereof, and related methods
02/09/2012US20120033913 Optical waveguide-forming epoxy resin composition, optical waveguide-forming curable film, optical-transmitting flexible printed circuit, and electronic information device
02/08/2012EP2414425A1 Epoxy resin based core filler material developing low exothermic heat
02/08/2012EP2414424A1 Thermosetting compositions containing isocyanurate rings
02/08/2012EP1826227B1 Thermosetting epoxy resin composition and use thereof
02/08/2012EP1461387B1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
02/08/2012EP1356002B8 Coating compositions containing alcoholic reactive diluents
02/08/2012CN102349002A Transparent film
02/08/2012CN102348736A Semiconductor-sealing resin composition and semiconductor device
02/08/2012CN102348735A Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
02/08/2012CN102344647A Environmentally-friendly high-seepage epoxy grouting material and preparation method and application thereof
02/08/2012CN102344645A Epoxy resin composite material and manufacturing method thereof
02/08/2012CN102344569A Preparation method of modified organic silicon resin and paint containing prepared modified organic silicon resin
02/08/2012CN102344545A Medium-temperature and quickly-cured colorless transparent epoxy resin curing agent and preparation method thereof
02/08/2012CN102344544A Photocurable resin composition and optical component using the same
02/08/2012CN102344543A Photocurable resin composition and optical component using the same
02/08/2012CN102344539A Silicon-containing double-curing group resin and preparation method thereof
02/08/2012CN101792574B 端环氧基硅油预反应物改性环氧树脂复合材料及制备与应用 End of the epoxy-modified silicone oil pre-reactant epoxy composite material and preparation and application
02/08/2012CN101115782B 潜在性固化剂 Latent curing agent
02/07/2012US8110621 Castor oil-based polyol emulsions
02/02/2012WO2012015011A1 Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting semiconductor element and process for producing same, and semiconductor device
02/02/2012WO2012014715A1 Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
02/02/2012WO2012014499A1 Composition, composition being for end-face sealing agent for display devices and consisting of the composition, display devices, and process for producing same
02/02/2012WO2012014480A1 Phenol resin and epoxy resin and manufacturing method for same
02/02/2012WO2012014478A1 Epoxy resin and manufacturing method for same
02/02/2012WO2012013439A1 Insulation for rotating electrical machines
02/02/2012WO2011142855A3 Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems
02/01/2012EP2412780A1 Composition and procedure for applying phase change materials (pcms) to natural stone
02/01/2012EP2412759A1 Method of storing resin solution and processes for producing prepreg and laminate
02/01/2012EP2412743A1 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
02/01/2012EP2412742A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
02/01/2012EP2412741A1 Epoxy resin composition, prepreg, carbon fiber reinforced composite material, and housing for electronic or electrical component
02/01/2012EP2412740A1 Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board
02/01/2012EP2257586B1 Novel polycarbonate polyorganosiloxane and/or polyurethane polyorganosiloxane compounds
02/01/2012CN102341430A Epoxy resin composition, curing agent, and curing accelerator
02/01/2012CN102341429A Epoxy resin composition, prepreg, carbon fiber reinforced composite material, and housing for electronic or electrical component
02/01/2012CN102341428A Curable resin composition and cured products thereof
02/01/2012CN102341427A Cast resin system for isolators
02/01/2012CN102341426A Epoxy resin composition
02/01/2012CN102341425A Thermosettable composition containing a glycidylether based on trimethyolpropane octadecaethoxilate
02/01/2012CN102341424A Hexafluoropropylene Oxide Polymer Compositions and a Preparing Method of Hexafluoropropylene Oxide Polymer Using Hexafluoropropylene Oligomer
02/01/2012CN102337097A Preparation method of adhesive for powder-filled high-thermal-conductivity mica tape
02/01/2012CN102337006A Resin composition, B stage sheet, metal foil with resin, metal substrate, and LED substrate
02/01/2012CN102337005A Resin composition, method of its composition, and cured formulation
02/01/2012CN102336998A Functional epoxy-modified polyethylene material
02/01/2012CN102336892A Modified cyanate ester resin system for package substrate, and preparation method and application thereof
02/01/2012CN102336891A Nonisocyanate polyurethane-epoxy resin material, preparation method thereof, and application thereof
02/01/2012CN102336890A Radiation or heat curable anti-seepage sealant
02/01/2012CN102336889A Bisphenol S novolac epoxy resin and its preparation method
02/01/2012CN102336635A Epoxy resin and preparation method and application thereof
02/01/2012CN101638481B 一种聚苯基甲氧基硅烷及其制备方法和应用 One poly phenyl-methoxy-silane and its preparation method and application
01/2012
01/31/2012US8106245 preparing an epoxide, wherein halogenated ketones are formed as by-products and there is at least one treatment intended to remove at least part of the halogenated ketones formed.
01/26/2012WO2012010732A1 Composition and method for cross-linking an epoxy resin with an isocyanate, and cross-linked material thus obtained
01/26/2012WO2011101460A3 Cationic acrylic resins
01/25/2012EP2410001A1 Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
01/25/2012EP2408837A1 Curable compositions containing cyclic diamine and cured products therefrom
01/25/2012CN102333808A Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article
01/25/2012CN102333786A Solar cells modules comprising low haze encapsulants
01/25/2012CN102333768A Diolefin compound, epoxy resin and composition thereof
01/25/2012CN102332372A High-temperature and high-strength insulating tube and manufacturing method thereof
01/25/2012CN102329433A Polymer foams containing macropores as acoustic dampening materials
01/25/2012CN102329431A Preparation method of epoxy resin composite material strengthened by in situ growth of CNT (carbon nano tube) on surface of quartz fibre
01/25/2012CN102329428A Block copolymer modified epoxy resin and preparation method thereof
01/25/2012CN101892005B Halogen-free flame retardant high-temperature resistant insulating paint for motor
01/25/2012CN101787127B Method for preparing epoxy carbon nanotube reinforced bismaleimide resin composite material
01/25/2012CN101522752B Thermosetting resin composition and prepreg and laminate obtained with the same
01/25/2012CN101400715B Liquid epoxy resin composition and adhesive using same
01/24/2012CA2518618C Polymeric epoxy resin composition
01/19/2012WO2012008472A1 Photosensitive resin composition and cured product thereof
01/19/2012US20120014916 Polyalkylene polymer compounds and uses thereof
01/19/2012DE112009002625T5 Beschichtungsmittel, Substrat zum Montieren eines optischen Halbleiterelements unter Verwendung desselben und optische Halbleitervorrichtung Coating agent, the substrate for mounting an optical semiconductor element using the same, and optical semiconductor device
01/19/2012CA2804049A1 Curable resin compositions
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