Patents for B81B 7 - Micro-structural systems (8,983)
08/2011
08/31/2011CN101592578B Silicon cantilever sensor, preparation method and application thereof
08/25/2011WO2011102809A1 Process for manufacture of a micro-chamber array
08/25/2011WO2011101272A1 Device including electrical, electronic, electromechanical or electro-optical components having reduced sensitivity at a low dose rate
08/25/2011WO2011064677A3 Combining redundant inertial sensors to create a virtual sensor output
08/25/2011DE102011004550A1 Gehäuste Vorrichtung mit einem akustischen Transducer und Verstärker Packaged device with an acoustic transducer and amplifier
08/25/2011DE102010028305A1 Drucksensor für das Erfassen bzw. Messen aggressiver Medien und flexibles Unterbringen bzw. Konfektionieren Pressure sensor for detecting or measuring aggressive media and flexible housing and making-up
08/25/2011DE102008025691B4 Piezoelektrischer Dünnfilm, piezoelektrisches Material und Herstellungsverfahren für piezoelektrischen Dünnfilm A piezoelectric thin film piezoelectric material and manufacturing method of piezoelectric thin-film
08/25/2011DE102008012825B4 Mikromechanisches Bauelement mit verkippten Elektroden Micromechanical component with tilted electrode
08/25/2011DE102007046498B4 Verfahren zur Herstellung eines mikroelektromechanischen Bauelementes A method for producing a microelectromechanical component
08/25/2011DE102006033693B4 Hindernisdetektor mit Ultraschallsensor The obstacle detection with ultrasonic sensor
08/24/2011EP2359177A1 Digital micro-mirror device
08/24/2011EP2358472A1 Fluidic culture device
08/24/2011CN102165565A Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features
08/24/2011CN102164846A Improved microvalve device
08/24/2011CN102164748A Efficient inkjet nozzle assembly
08/24/2011CN102163531A Flat line type ion trap mass analyzer based on MEMS (micro electro mechanical system) process and manufacturing method thereof
08/24/2011CN102161470A Method of enclosing a micromechnical element formed between a base layer and a metallization layer
08/24/2011CN101290255B Preparing method of 0-50pa single slice silicon based SOI ultra-low micro pressure sensor
08/24/2011CN101289160B 0-100Pa monolithic silicon based SOI high-temperature low drift micropressure sensor and processing method thereof
08/23/2011US8004736 Optical interference display panel and manufacturing method thereof
08/18/2011WO2011100593A2 Microelectromechanical system with reduced speckle contrast
08/18/2011WO2011098187A2 Semiconductor component and corresponding production method
08/18/2011DE102010008044A1 MEMS-Mikrofon und Verfahren zur Herstellung MEMS microphone and methods for preparing
08/18/2011DE102010001824A1 Zusammengepackte Vorrichtung und Herstellungsverfahren davon Packed together device and manufacturing method thereof
08/18/2011DE102005002304B4 Mikroelektromechanischer Sensor und Verfahren zu dessen Herstellung The microelectromechanical sensor and method for its production
08/17/2011CN201935780U 用于真空测量的低量程压阻式压力传感器 Low range piezoresistive pressure sensor for vacuum measurement
08/17/2011CN102156012A Micro electromechanical system (MEMS) pressure sensor and manufacturing method thereof
08/17/2011CN102153045A Packaging structure with micro-electromechanical element and manufacturing method thereof
08/17/2011CN102153044A Micro electro-mechanical system encapsulation module
08/17/2011CN101871825B Membrane stress testing structure and method as well as manufacturing method
08/17/2011CN101776495B Micro/nano fiber structure-based touch sensor and preparation method thereof
08/17/2011CN101738280B Mems pressure sensor and manufacturing method thereof
08/17/2011CN101148242B Electronic detection device and detector comprising such a device
08/17/2011CN101115675B Multisensor assembly and its manufacture method
08/11/2011WO2011096460A1 Variable capacitance element
08/11/2011US20110192248 Microelectromechanical (mems) manipulators for control of nanoparticle coupling interactions
08/11/2011DE102010007605A1 Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals
08/11/2011DE102010001759A1 Mikromechanisches System und Verfahren zum Herstellen eines mikromechanischen Systems A micromechanical system and method for producing a micro-mechanical system
08/10/2011EP2354083A1 Micromechanical device encapsulation process with a mechanically reinforced package cap.
08/10/2011CN1832899B Optical microelectromechanical structure
08/10/2011CN102147420A Blocky fluid sensor of time-division duplex microelectromechanical system and working method thereof
08/10/2011CN102146905A Micro fluid device
08/10/2011CN102145874A Micro-electro-mechanical device and manufacturing method thereof
08/10/2011CN101692016B Atmospheric pressure sensor compatible with CMOS process and preparation process thereof
08/10/2011CN101337652B Packaging of contact surface of sensor element and packaging method thereof
08/09/2011US7994592 Method for integrating micro and nanoparticles into MEMS and apparatus including the same
08/04/2011WO2011094594A2 Microelectromechanical systems embedded in a substrate
08/04/2011DE102010006773A1 Wellenlängensensitives plasmonisch aktives Modul zur spektral aufgelösten Detektion von Licht Wavelength-sensitive plasmonic active module for spectrally resolved detection of light
08/04/2011DE102010006132A1 Miniaturisiertes elektrisches Bauelement mit einem MEMS und einem ASIC Miniaturized electrical component with a MEMS and an ASIC
08/04/2011DE102010001572A1 Method for manufacturing through-contact in plated through structured component that is utilized as e.g. micro-electro mechanical system sensor element, involves separating conductive sheet in trench via physical vapor deposition of film
08/04/2011DE102010001412A1 Mikrofluidisches Bauelement zur Handhabung eines Fluids und mikrofluidischer Chip A microfluidic device for handling a fluid and microfluidic chip
08/03/2011EP2352311A1 Microphone
08/03/2011EP2351076A2 Method and apparatus for wafer bonding with enhanced wafer mating
08/03/2011EP2349916A1 Pressure relief valve
08/03/2011EP2349915A1 Electrical contact configuration of micro-electromechanical component and fabrication method
08/03/2011EP2349914A2 An integrated component and a method of manufacturing an integrated component
08/03/2011EP2156198B1 Operation method and switch arrangement for a capacitive micromechanical sensor with analog reset
08/03/2011EP1907160B1 Method of bonding of surfaces with an adhesive cured by laser
08/03/2011CN102139854A MEMS (micro electro mechanical system) structure and manufacturing method thereof
08/03/2011CN101431319B Electronic component
07/2011
07/28/2011WO2011028484A4 System with recessed sensing or processing elements
07/28/2011US20110180425 Devices and methods for biochip multiplexing
07/28/2011DE102010042438A1 Sensoranordnung Sensor array
07/27/2011EP2346777A1 Hybrid digital and channel microfluidic devices and methods of use thereof
07/27/2011EP2346693A1 Inkjet printhead with titanium aluminium alloy heater
07/27/2011CN201909632U Micro electro mechanical system (MEMS) gyroscope
07/27/2011CN102134053A Manufacturing method of biaxial MEMS (micro-electro-mechanical system) gyroscope
07/27/2011CN102134052A MIS capacitor lower piezoresistance structure adopting substrate grid and making method
07/27/2011CN101551284B Pressure sensor based on Si-Si direct bonding and manufacturing method thereof
07/27/2011CN101204603B Embedded MENS bioelectrode and preparation technology thereof
07/26/2011US7984968 Inkjet printhead nozzle assembly having a raised rim to support an ink meniscus
07/21/2011WO2011086316A2 Use of silicon nanotubes including at least one free filling atom as an electromechanical nano-oscillator
07/21/2011DE102010001023A1 Sensorvorrichtung Sensor device
07/21/2011DE102010001021A1 Method for manufacturing e.g. micromechanical acceleration sensor, utilized in motor car fitting area, involves selectively corroding sacrificial layer in relation to functional components for movement of components via trenches
07/21/2011DE102010000879A1 Micromechanical structure i.e. turning rate sensor, for use during surface area micromechanical manufacturing process, has moving element driven along specific direction, and power unit coupled with moving element over transmission element
07/20/2011EP2346083A1 Mems sensor
07/20/2011CN1944235B Electromagnetic-magnetoelectric type micro mechanical resonant beam structure
07/20/2011CN102131139A Microphone package of micro-electro-mechanical system and manufacturing method thereof
07/20/2011CN102128841A Detecting device of terahertz imaging system
07/20/2011CN102126703A Two-dimensional multi-shell hollow sphere ordered structure array and preparation method thereof
07/20/2011CN102126702A Phase-change material combining hedgehog VO2 nanometer structure on silicon substrate and manufacturing method
07/20/2011CN102126698A Phase-change material used for compounding VO2 hollow sphere structure on silicon wafer and preparation method thereof
07/20/2011CN102126697A Encapsulating structure with micro electromechanical component and manufacturing method thereof
07/20/2011CN101746708B Fully-decoupled capacitance type micromachined gyroscope
07/20/2011CN101504896B Bi-stable acceleration induction micro-switch based on adhesion
07/20/2011CN101447775B Polycrystalline cubic-phase silicon carbide micro-electro-mechanical system resonant device and preparation method thereof
07/20/2011CN101221911B Packaging micro devices
07/20/2011CN101118313B Low temperature fabrication of conductive micro structures
07/20/2011CA2782658A1 Improved biomarker generator
07/19/2011US7982937 Micro mirror unit and its manufacturing process, and optical switch with the micro mirror unit employed therein
07/14/2011WO2011084229A2 Embedded mems sensors and related methods
07/14/2011DE102010055396A1 Elektrostatischer MEMS-Treiber mit einer auf dem Chip ausgeführten Kapazitätsmessung für Autofokusanwendungen Electrostatic MEMS driver with an on-chip capacitance measurement for autofocus applications
07/14/2011DE102010000864A1 Micromechanical component e.g. acceleration sensor, has corrosion protection region for protecting insulation layer regions below strip guard regions against etching during corrosion of sacrificial layer by movement of functional components
07/14/2011DE102010000811A1 Mikromechanischer Drehratensensor mit zwei sensitiven Achsen und gekoppelten Detektionsmoden Micromechanical rotation rate sensor with two sensitive axes and coupled detection modes
07/14/2011DE102010000739A1 Micromechanical magnetic field sense element for magnetic field sensor, has spring element that is arranged within frame, and is designed as leads for current
07/13/2011EP2342160A2 Inertial sensor with dual cavity package and method of fabrication
07/13/2011CN102121859A Micro piezoresistive device for measuring wall shear stress and manufacturing method thereof
07/13/2011CN101339202B Semiconductor device and manufacturing method of the same
07/07/2011WO2011082241A2 Microelectromechanical system having movable element integrated into leadframe-based package
07/07/2011WO2011082214A2 Leadframe-based premolded package having acoustic air channel for microelectromechanical system (mems) device
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