| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 08/02/2012 | WO2012100360A1 Sensor chip comprising a spacer for protecting the sensor element |
| 08/02/2012 | US20120193754 Mems device with integral packaging |
| 08/02/2012 | DE102011103195A1 Micro system e.g. micro electromechanical system, for use in e.g. electrical engineering, has anchor structure provided at carrier substrate and/or at electrical component, where membrane is fixed to anchor structure in form-fit manner |
| 08/01/2012 | EP2481704A2 Edge-mounted sensor |
| 08/01/2012 | EP2481703A1 Sensor protection |
| 08/01/2012 | CN202362361U Microwave power sensor having terminal filled with heat-conducting medium and based on MEMS technique |
| 08/01/2012 | CN102620865A Beam-film double island structure micro-pressure high-overload sensor chip |
| 08/01/2012 | CN102620814A Orange-peel encapsulating structure for bionic vector hydrophone of micro-electro-mechanical system |
| 08/01/2012 | CN102616729A Structure and method for detecting whether narrow trench isolation grooves are etched to oxide layers based on silicon-on-insulator (SOI) silicon chip |
| 07/26/2012 | WO2012097413A1 A method and apparatus for mixing microliter fluid volumes by application of acoustic signals |
| 07/26/2012 | DE102011003168A1 Lautsprechersystem Speaker system |
| 07/26/2012 | DE102009036175B4 MEMS-Silizium-Resonatorbauelement und Verfahren zur Bestimmung seiner Resonanzfrequenz Silicon MEMS resonator and method for determining its resonant frequency |
| 07/25/2012 | EP2478636A1 Wireless mems sensor and method of reading the same |
| 07/25/2012 | CN102607607A H-shaped micro-nano optical fiber surface plasmon sensor and preparation method thereof |
| 07/25/2012 | CN102602881A Method for forming multiple silicon trenches on MEMS (Micro Electro Mechanical Systems) sealing-cap silicon chip and etching mask structure thereof |
| 07/25/2012 | CN102602878A Silicon substrate nitride based optical micro-electromechanical device and production method thereof |
| 07/25/2012 | CN102121859B Micro piezoresistive device for measuring wall shear stress and manufacturing method thereof |
| 07/25/2012 | CN102030305B Micro suspension structure compatible with semiconductor element and manufacturing method thereof |
| 07/25/2012 | CN102020235B Low-moisture content packaging method for thin outline (TO) packaging structure |
| 07/25/2012 | CN101962166B Packaging structure and packaging method |
| 07/25/2012 | CN101572334B Distributed MEMS phase shifter based on MAM capacitor |
| 07/24/2012 | US8227876 Single crystal silicon sensor with additional layer and method of producing the same |
| 07/24/2012 | US8227331 Method for depositing a solder material on a substrate |
| 07/24/2012 | US8227286 Single crystal silicon sensor with additional layer and method of producing the same |
| 07/19/2012 | WO2012096416A1 Electrodynamic complex sensor for nanomaterials |
| 07/19/2012 | WO2012094722A1 Printed circuit board with an acoustic channel for a microphone |
| 07/19/2012 | US20120180949 Microelectromechanical Device Packages with Integral Heaters |
| 07/19/2012 | CA2823965A1 Printed circuit board with an acoustic channel for a microphone |
| 07/18/2012 | EP2349915B1 Electrical contact configuration of micro-electromechanical component and fabrication method |
| 07/18/2012 | CN202339247U 一种用于微器件真空度测量的标定盒 A method for measuring the degree of vacuum of the micro device calibration cartridge |
| 07/18/2012 | CN102589762A Micro-voltage high-overload sensor chip of beam membrane single island structure |
| 07/18/2012 | CN102589760A Minitype capacitance-type mechanical sensor and preparation method thereof |
| 07/18/2012 | CN102583222A Process of forming a material having nano-particles and a material having nano-particles |
| 07/18/2012 | CN102583221A Bulk silicon moving member with dimple |
| 07/18/2012 | CN102583220A Wafer-level vacuum packaged infrared detector and manufacturing method thereof |
| 07/18/2012 | CN102583219A Vacuum package structure and vacuum packaging method for wafer-level MEMS (micro-electromechanical system) devices |
| 07/18/2012 | CN102583218A Silicon-based airtight packaging casing |
| 07/18/2012 | CN102583217A Micro-electro mechanical system element, deformation preventive structure used therein and manufacturing method thereof |
| 07/18/2012 | CN101955151B Two-dimensional comb tooth electrostatic driver based on silicon plastic deformation principle and manufacturing method thereof |
| 07/18/2012 | CN101871817B Hybrid-type pyroelectric uncooled focal plane detector and manufacturing process thereof |
| 07/18/2012 | CN101852816B Piezoresistive monolithic integrated tri-axial acceleration sensor and manufacturing method thereof |
| 07/18/2012 | CN101726629B Micro-electro-mechanical element, out-plane sensor and manufacturing method of micro-electro-mechanical element |
| 07/18/2012 | CN101691200B Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof |
| 07/18/2012 | CN101687629B Method for the production of a component, and component |
| 07/18/2012 | CN101609101B Micro-accelerometer based on silica-based high speed electro-optical modulation of waveguide ring resonator |
| 07/18/2012 | CN101525116B Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
| 07/18/2012 | CN101272636B Capacitor type microphone chip |
| 07/18/2012 | CN101261977B Electronic device packages and methods of formation |
| 07/18/2012 | CN101189180B Thin package for a micro component |
| 07/17/2012 | US8221605 Apparatus for manipulating droplets |
| 07/17/2012 | CA2577816C Systems and methods using interferometric optical modulators and diffusers |
| 07/12/2012 | WO2012094006A1 Three-dimensional (3d) porous device and method of making a 3d porous device |
| 07/12/2012 | WO2012093105A1 Method for encapsulating a micro-component |
| 07/12/2012 | WO2012037537A3 Sealed packaging for microelectromechanical systems |
| 07/11/2012 | EP2331453B1 Micromechanical component having through electrode and method for the production thereof |
| 07/11/2012 | CN202332799U 一种检测晶圆 A method of detecting wafer |
| 07/11/2012 | CN102577118A A micromechanical resonator |
| 07/11/2012 | CN102569951A Micro electronic mechanical system (MEMS) load line type 2-bit phase shifter based on left-handed transmission line |
| 07/11/2012 | CN102566285A Manufacturing method for microstructure and microstructure |
| 07/11/2012 | CN102565142A Low-temperature drift piezoresistive humidity sensor and manufacturing method thereof |
| 07/11/2012 | CN102564602A Thermal detector and manufacturing method thereof, thermal detection device, electronic instrument |
| 07/11/2012 | CN102564469A Mems vertical comb structure with linear drive/pickoff |
| 07/11/2012 | CN102556956A Vacuum packaging structure of MEMS (Micro Electro Mechanical System) device and manufacture method thereof |
| 07/11/2012 | CN102556946A Method for encapsulating a MEMS structure and encapsulated MEMS structure |
| 07/11/2012 | CN102556941A Cobaltosic oxide nanowire array, preparation method thereof as well as application of nanowire array as cathode of lithium ion battery |
| 07/11/2012 | CN102556940A Structure |
| 07/11/2012 | CN102556939A Systems and methods for a three-layer chip-scale MEMS device |
| 07/11/2012 | CN102556938A Stacked die package structure and manufacturing method thereof |
| 07/11/2012 | CN102556937A Strained germanium device with cantilever structure and preparation method thereof |
| 07/11/2012 | CN102556936A Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same |
| 07/11/2012 | CN102552977A Preparation method and application of metal surface-etched nanoporous array |
| 07/11/2012 | CN101871952B MEMS (Micro Electro Mechanical System) acceleration sensor |
| 07/11/2012 | CN101832965B Laccase biosensor based on magnetic carbon nano tube and chitosan/silicon dioxide gel and preparation method and application thereof |
| 07/10/2012 | US8216884 Production methods of electronic devices |
| 07/05/2012 | WO2012091677A1 Microfluidic valve module and system for implementation |
| 07/05/2012 | WO2012089408A1 Encapsulation of an mems component and method for producing said component |
| 07/05/2012 | WO2012088823A1 Forming method for microelectromechanical system sensor |
| 07/05/2012 | WO2012088820A1 Method for manufacturing mems device |
| 07/05/2012 | WO2011154363A3 Analysis device including a mems and/or nems network |
| 07/05/2012 | DE112006001844B4 Verfahren zum Herstellen einer Elektronikkomponente und Elektronikkomponente A method of manufacturing an electronic component and electronic component |
| 07/05/2012 | DE102011002460A1 Microphone has housing comprising cover that is provided with aperture through which MEMS component is mounted inside housing, and external contact that is fed exclusively over housing cover |
| 07/05/2012 | DE102011002457A1 Mikromechanische Mikrofoneinrichtung und Verfahren zum Herstellen einer mikromechanischen Mikrofoneinrichtung Micromechanical microphone device and method for fabricating a micromechanical microphone means |
| 07/05/2012 | DE102011002456A1 Micromechanical microphone component manufacturing method, involves realizing layer structure on semiconductor substrate, and opening sound pressure-sensitive membrane by extracting sacrificial layer material over corroding entrances |
| 07/05/2012 | DE102010056572A1 Elektronisches Bauelement und Verfahren zur Herstellung des elektronischen Bauelements An electronic device and method for manufacturing the electronic component |
| 07/05/2012 | DE102010056562A1 Elektronisches Bauelement und Verfahren zur Herstellung des elektronischen Bauelements An electronic device and method for manufacturing the electronic component |
| 07/04/2012 | EP2470467A2 Mems device with stress isolation and method of fabrication |
| 07/04/2012 | CN202297106U 一种垂直传感器的封装结构 A vertical sensor package structure |
| 07/04/2012 | CN202297105U 微机电系统mems器件的方形扁平无引脚封装qfn结构 Mems MEMS devices quad flat no-lead package qfn structure |
| 07/04/2012 | CN1953933B MEMS device with conductive path through substrate |
| 07/04/2012 | CN102543971A Chip package and method for forming the same |
| 07/04/2012 | CN102543239A Three-dimensional heterojunction isotope battery based on carbon nanotube film and preparation method of three-dimensional heterojunction isotope battery |
| 07/04/2012 | CN102539832A Biaxially-resonant silicon-micromachined accelerometer structure in shape of Chinese character 'tian' |
| 07/04/2012 | CN102530851A Self-removal anti-stiction coating for bonding process |
| 07/04/2012 | CN102530847A Heat insulation micro-structure and preparation method thereof |
| 07/04/2012 | CN102530844A Microcomponent vacuum packaging method |
| 07/04/2012 | CN102530838A Method for producing oblique surfaces in a substrate and wafer having an oblique surface |
| 07/04/2012 | CN102530835A Method for packaging a sensor chip, and a component produced using such a method |
| 07/04/2012 | CN102530832A Inertia MEMS (micro-electro-mechanical system) sensor and making method thereof |
| 07/04/2012 | CN102530828A Surface-enhanced Raman scattering active substrate based on carbon nanometer pipe arrays and metal nanometer particles |
| 07/04/2012 | CN102530827A Vibration isolation interposer die |