Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
12/2014
12/10/2014CN102442770B 激光割断装置 Laser cut device
12/10/2014CN102280380B 通过加工单晶而制造多个半导体晶片的方法 The method of processing a single crystal is manufactured by a plurality of semiconductor wafers
12/02/2014US8900972 Systems and methods for producing seed bricks
12/02/2014US8899459 Breaking apparatus and breaking method for substrate made of brittle material
11/2014
11/25/2014US8897910 Particle beam-assisted ultra-precision machining method for single-crystal brittle materials
11/25/2014US8895345 Dicing methods
11/18/2014US8890026 Method for cutting processing target
11/18/2014US8889525 Substrate dividing method
11/11/2014US8883701 Method for wafer dicing and composition useful thereof
11/11/2014US8881716 Wire saw with tension detecting means and guide roller speed control
11/04/2014US8877612 Laser processing method
11/04/2014US8875967 Mechanical scoring and separation of strengthened glass
10/2014
10/30/2014US20140318522 Method for slicing workpiece
10/28/2014US8870047 Wafer dicing press and method and semiconductor wafer dicing system including the same
10/23/2014US20140311472 Abrasive Article and Method of Forming
10/23/2014US20140311471 Cutting apparatus having blade cover
10/21/2014US8863957 Wafer separation apparatus, wafer separation and transfer apparatus, wafer separation method, wafer separation and transfer method, and solar cell wafer separation and transfer method
10/09/2014WO2014162945A1 Water soluble cutting fluid for fixed abrasive grain wire saw, ingot cutting method using same, and substrate for electronic material obtained by means of same
10/09/2014WO2014162708A1 Slurry regeneration apparatus, slurry regeneration method, and regenerated slurry
10/07/2014US8852698 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
10/07/2014US8851059 Self-cleaning wiresaw apparatus and method
10/02/2014WO2014156689A1 Laser machining device and laser machining method
10/02/2014WO2014156687A1 Laser machining device and laser machining method
10/02/2014WO2014154863A1 Method for rounding edges of solid parts generated from solid starting material and solid products produced by this method
10/02/2014US20140295126 Method for slicing semiconductor single crystal ingot
09/2014
09/30/2014US8847108 Laser beam machining apparatus with detection laser beam oscillator
09/30/2014US8844511 Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material
09/17/2014EP2777903A1 Ingot feeding system
09/16/2014US8835802 Cleaving wafers from silicon crystals
09/14/2014CA2846332A1 Nuclear reactor fuel element and a method for fabricating components
09/11/2014DE112012004819T5 Verfahren zum Schneiden eines Werkstücks A method for cutting a workpiece
09/04/2014US20140246006 Gemstone processing
09/02/2014US8822882 Scribing sapphire substrates with a solid state UV laser with edge detection
09/02/2014US8820308 Methods, wires, and apparatus for slicing hard materials
08/2014
08/27/2014EP2768628A1 Gemstone processing
08/26/2014US8813349 Device for separating electronic components
08/21/2014DE112012004597T5 Bandsäge-Schneideapparat und Verfahren zum Schneiden eines Ingots Band saw cutting apparatus and method for cutting an ingot
08/21/2014DE102013210882B3 Vorrichtung und Verfahren zum Zersägen von Ingots in Wafer Apparatus and method for sawing ingots into wafers
08/20/2014EP2768012A1 Method of detaching a disc-shaped single crystal from a base body using an electron beam
08/20/2014EP2767375A1 Wire guide and a method for forming a wire guide
08/13/2014EP2764966A1 Device and method for machining a workpiece
08/13/2014EP2763828A1 Method and device for producing edge cutouts in sheet glass
08/13/2014EP2763824A1 Method for performing a mechanical operation in a structure comprising two layers of different stiffness
08/13/2014CN203765819U 用于多线切割机晶托的拆卸装置 MWS crystal holder means for demolition
08/13/2014CN203765818U 一种硅切割机床用外部防护体系 A silicone cutting machine with external protection system
08/13/2014CN203765817U 一种多线切割机导轮 A multi-wire cutting guide wheel
08/13/2014CN203765816U 一种分体式多线切割机排线器 A separate-type multi-wire cable device
08/13/2014CN203765815U 立式多层平面线网线切割机 Vertical multi-planar nets Cutting
08/13/2014CN203765814U 一种大直径、超长度高纯硅晶体切割设备 One kind of large diameter, ultra-high-purity silicon crystal length cutting equipment
08/13/2014CN203765813U 丝锯装置 Wire sawing device
08/13/2014CN103987490A 宝石加工 Gem Processing
08/13/2014CN103978563A 多线切割机恒张力控制系统 MWS constant tension control system
08/13/2014CN103978560A 一种快换式超声振动辅助锯切装置 One kind of quick-change ultrasonic vibration assisted cutting device
08/13/2014CN103978311A 丝线导引器和用于形成丝线导引器的方法 The method for forming the thread guide guiding the thread
08/12/2014US8802543 Laser processing method
08/07/2014WO2014118035A1 Dicing method
08/06/2014EP2762286A1 Dicing method
08/06/2014CN203752353U 内圆切割机同步旋转机械手 Inner circle cutter synchronous rotation manipulator
08/06/2014CN203752350U 一种蓝宝石开方机机头过线轮安装机构 One kind of machine head sapphire prescribing excessive wheel mounting mechanism
08/06/2014CN203752349U 一种蓝宝石开方机机头结构 One kind of sapphire prescribing machine head structure
08/06/2014CN203752348U 一种蓝宝石开方机罗拉安装机构 One kind of machine roller mounting mechanism sapphire prescribing
08/06/2014CN203752347U 一种蓝宝石开方机机壳走线布局结构 One kind of sapphire prescribing machine cabinet trace layout structure
08/06/2014CN203752346U 一种蓝宝石开方机线筒双导轨辅助排线机构 One kind of machine bobbin double sapphire prescribing guide auxiliary cable institutions
08/06/2014CN203752345U 一种双变形锯齿切割钢丝 A dual deformation serrated cutting wire
08/06/2014CN203752344U 多晶硅多线切片机砂浆引流设备 Multi-line slicer polysilicon mortar drainage equipment
08/06/2014CN203752343U 一种宝石切割机 One kind of gem cutting machine
08/06/2014CN103963181A 一种复合变形的高强度切割钢丝及其制造方法 A composite cutting wire deformation of high strength and its manufacturing method
08/06/2014CN103963180A 一种多线切割机钢丝线走线系统 A multi-wire cutting steel wire alignment system
08/06/2014CN103963179A 金刚石环形带锯条 Diamond ring band saw blade
08/06/2014CN103963178A 刻划轮用销、保持具单元及刻划装置 Scored a pin wheel, the holder unit and scribing device
08/06/2014CN103963177A 刻划轮用保持具、保持具单元及刻划装置 Scribing wheel-holder, the holder unit and scribing device
08/06/2014CN103962958A 加工装置 Processing device
08/06/2014CN102744424B 可用于薄板类光学零件的单点金刚石补偿式切削加工方法 Single point diamond cutting compensation method can be used in sheet-based optical components
07/2014
07/31/2014DE102005047123B4 Siliziumwafer-Laserbearbeitungsverfahren und Laserstrahl-Bearbeitungsmaschine Silicon wafer laser processing method and laser beam processing machine
07/30/2014EP2759386A1 Device and method for cleaning the wire of a wire saw
07/30/2014CN203746818U 晶圆劈裂机 Wafer splitting machine
07/30/2014CN203739038U 多线开方机气缸张力调节装置 Multi-line prescribing machine cylinder tension adjusting device
07/30/2014CN203739037U 多线开方机用升降机部件 Multi-line prescribing machine lifts parts
07/30/2014CN203739036U 一种多线开方机用跳丝报警装置 A multi-line prescribing machine jump wire alarm device
07/30/2014CN203739035U 一种半导体热电材料切割装置 A semiconductor thermoelectric material cutting device
07/30/2014CN203739034U 硅棒开断装置 Silicon rods breaking device
07/30/2014CN203739033U 硅块粘接固化计时装置 Silicon block adhesive curing timing device
07/30/2014CN203739032U 多线开方机用排丝机构 Multi-line prescribing machine drain wire agencies
07/30/2014CN203739031U 一种改进型多线开方机用升降机部件 An improved multi-line prescribing machine lifts parts
07/30/2014CN203739030U 一种改进型多线开方机 An improved multi-line prescribing machine
07/30/2014CN203739029U 多线开方机 Multi-line prescribing machine
07/30/2014CN203739028U 多线开方机用台车 Multi-line prescribing machine trolley
07/30/2014CN203739027U 多线开方机用摆臂张力调节装置 Multi-line prescribing machine arm tension adjustment device
07/30/2014CN203739026U 应用于非圆形晶状体的切割工作台机构 Applied to non-circular lens cutting table mechanism
07/30/2014CN203739025U 新型多线切片机砂浆管 The new multi-line slicer mortar tube
07/30/2014CN203739024U 具有传感器设备的丝锯装置 Wire sawing device having a sensor device
07/30/2014CN203739023U 一种mems 晶圆辅助切割的对准装置 Mems wafer alignment device for cutting aid
07/30/2014CN203738521U 一种光学加工磨削和飞切组合机床床身 An optical processing and fly-cutting combination of grinding machine bed
07/30/2014CN103958140A 用于晶片切割的晶片切割牺牲基板 Cutting the wafer for wafer dicing sacrificial substrate
07/30/2014CN103952754A 类单晶硅锭制备方法及切割制备类单晶硅片方法 Type monocrystalline silicon ingot preparation and cutting class preparation methods Monocrystalline
07/30/2014CN103950122A 数控金刚线蓝宝石切片机 NC sapphire diamond wire cutting machine
07/30/2014CN103950121A 一种多线切割机专用挡砂装置 A multi-wire cutting device-specific block sand
07/30/2014CN103950120A 一种六导轮多线切割机 One kind of six multi-wire guide wheels
07/30/2014CN103950119A 一种多线切割机断线续切方法 A multi-cut method Cutting break Continued
07/30/2014CN102398315B 应用于切片机的切割方法 Microtome cutting method is applied
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