Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
09/2002
09/18/2002CN1370207A Polishing system and method of its use
09/18/2002CN1369355A Lapping liquid feeder of lens abrasive working appts
09/12/2002WO2002071445A2 Polishing chemical delivery for small head chemical mechanical planarization
09/12/2002WO2002053320A3 Wafer support for chemical mechanical planarization
09/12/2002US20020127860 Filter apparatus and method therefor
09/12/2002US20020124475 CMP polishing slurry dewatering and reconstitution
09/11/2002EP1238417A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics
09/11/2002EP1237691A1 Method for separating a machining suspension into fractions
09/10/2002US6447381 Polishing apparatus
09/10/2002US6447375 Chemical mechanical polishing; drying, solidifying, batch processing, packaging
09/10/2002US6447374 Chemical mechanical planarization system
09/06/2002WO2002068151A1 Random-orbit head with lock-up feature
09/06/2002CA2432950A1 Random-orbit head with lock-up feature
09/03/2002US6443822 Wafer processing apparatus
08/2002
08/29/2002US20020119733 See attached list (k. yasui et al)
08/29/2002US20020119732 Random-orbit head with concentric lock-up feature
08/29/2002US20020119286 Conductive polishing article for electrochemical mechanical polishing
08/28/2002EP1234010A2 Use of cesium hydroxide in a dielectric cmp slurry
08/28/2002EP1234009A1 Composition and method for planarizing surfaces
08/28/2002CN1366549A Polishing compound and method for preparation thereof, and polishing method
08/28/2002CN1366547A Polishing composition and magnetic recording disk substrate polished with polishing composition
08/27/2002US6439978 Substrate polishing system using roll-to-roll fixed abrasive
08/27/2002US6439977 Rotational slurry distribution system for rotary CMP system
08/27/2002US6439019 Roller cage for a deep rolling work roller
08/22/2002US20020112758 Pressure vessel systems and methods for dispensing liquid chemical compositions
08/20/2002US6436830 Delivering processed slurry to the polishing device. the slurry processor including a metal separator for separating metal particles, polished from the semiconductor wafer, from the used slurry. the slurry can be continuously recirculated
08/20/2002US6435950 Pressurized delivery method for abrasive particulate material
08/15/2002WO2001041973A9 Chemical-mechanical polishing method
08/15/2002US20020111027 Polishing compositions for noble metals
08/13/2002US6431957 Directional flow control valve with recirculation for chemical-mechanical polishing slurries
08/08/2002WO2002060643A2 Spherical drive assembly for chemical mechanical planarization
08/07/2002EP1228159A1 Improved cmp products
08/07/2002CN1362907A Dual CMP pad conditioner
08/06/2002US6429131 CMP uniformity
08/06/2002US6428400 Drainage structure in polishing plant
08/06/2002US6428387 Method for chemical mechanical polishing using a high selective slurry
08/01/2002WO2002058885A1 Pressure vessel systems and methods for dispensing liquid chemical compositions
08/01/2002US20020102930 Grinding fluid supply device of lens grinding apparatus
08/01/2002US20020102853 Articles for polishing semiconductor substrates
08/01/2002DE10103062A1 Chemisch-mechanisches Polierverfahren für emulsionsfreie feste Schleifkissen Chemical mechanical polishing method for emulsion-free solid abrasive pad
07/2002
07/31/2002EP1226220A1 Polishing system and method of its use
07/31/2002CN1361923A Polishing mixture and process for reducing the incorporation of copper into silicon wafers
07/30/2002US6426295 Mixing surfactant of at least 100 parts per million to slurries to form polishing solution, chemical-mechanical planarizing of semiconductor wafer using polishing solution to form microelectronic substrate
07/30/2002US6425804 Pressurized delivery system for abrasive particulate material
07/30/2002US6425802 Apparatus for supplying flush fluid
07/25/2002WO2001089767A3 A chemical-mechanical polishing system for the manufacture of semiconductor devices
07/25/2002US20020098702 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
07/23/2002US6423638 Filter apparatus and method therefor
07/23/2002US6422067 Slurry useful for wire-saw slicing and evaluation of slurry
07/18/2002WO2002056356A1 Polishing method, polishing device, and semiconductor device producing method
07/16/2002US6419567 Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
07/11/2002WO2002053490A2 Method of making optical fluoride laser crystal components
07/11/2002WO2002053320A2 Wafer support for chemical mechanical planarization
07/11/2002WO2002053273A2 Process and apparatus for blending and distributing a slurry solution
07/11/2002US20020090893 Method for improving curvature of the polished surface by chemical mechanical polishing
07/10/2002CN1087493C Process for polishing semiconductor substrate
07/04/2002WO2002051955A1 Prevention of precipitation defects on copper interconnects during cmp by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
07/04/2002WO2002051589A1 Method and apparatus for chemical-mechanical polishing (cmp) using upstream and downstream fluid dispensing means
07/04/2002US20020086617 Rotary union for semiconductor wafer applications
07/04/2002US20020085447 Process and apparatus for blending and distributing a slurry solution
07/04/2002US20020083650 Polishing of semiconductor substrates
07/03/2002EP1218565A1 Cemented carbide wear part and lapping method
07/03/2002EP1218465A1 Polishing system with stopping compound and method of its use
07/03/2002EP1218464A1 Chemical mechanical polishing systems and methods for their use
07/03/2002EP1218082A1 Process and filter for filtering a slurry
07/03/2002CN1356369A Apparatus for preparing grinding liquid
07/03/2002CN1356184A Transfer apparatus and method for recovering solid substance
07/02/2002US6413873 System for chemical mechanical planarization
07/02/2002US6413288 CMP polishing slurry dewatering and reconstitution
07/02/2002US6413154 Polishing apparatus
07/02/2002US6413151 CMP slurry recycling apparatus and method for recycling CMP slurry
06/2002
06/26/2002EP1217322A2 Heat Exchanger
06/26/2002EP1216316A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography
06/26/2002EP1216118A1 Polishing pad treatment for surface conditioning
06/25/2002US6410441 Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system
06/25/2002US6409936 Integrated circuit; corundum abrasive particles; etchant; nonionic surfactant brij (polyoxyethylene cetyl ether)
06/25/2002US6409579 Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
06/20/2002US20020077047 Barrel polishing apparatus
06/20/2002US20020076932 Method of polishing or planarizing a substrate
06/19/2002CN2495411Y Automatic device for dropping liquid grinding agent
06/18/2002US6407000 Microelectronics
06/18/2002US6406364 Polishing solution feeder
06/13/2002US20020072310 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus
06/13/2002US20020069967 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
06/12/2002EP1212789A1 Polishing mixture and process for reducing incorporation of copper into silicon wafers
06/11/2002US6402884 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
06/11/2002US6402602 Rotary union for semiconductor wafer applications
06/11/2002US6402599 Slurry recirculation system for reduced slurry drying
06/06/2002WO2002043923A1 Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers
06/06/2002US20020068516 Apparatus and method for controlled delivery of slurry to a region of a polishing device
06/06/2002US20020068508 Directional flow control valve with recirculation for chemical-mechanical polishing slurries
06/05/2002EP1210395A1 Compositions for insulator and metal cmp and methods relating thereto
06/04/2002US6399501 Method and apparatus for detecting polishing endpoint with optical monitoring
06/04/2002US6398627 Slurry dispenser having multiple adjustable nozzles
05/2002
05/30/2002US20020065022 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
05/23/2002US20020061722 Apparatus for producing polishing solution and apparatus for feeding the same
05/23/2002US20020061651 Polishing agent, method of producing same, and method of polishing
05/21/2002US6390891 Method and apparatus for improved stability chemical mechanical polishing
05/16/2002WO2002038335A1 Methods, apparatus and slurries for chemical mechanical planarization
05/16/2002US20020056548 Heat exchanger
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