Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
10/2003
10/21/2003US6634930 Method and apparatus for preventing metal corrosion during chemical mechanical polishing
10/16/2003WO2003084715A1 Composite conditioning tool
10/16/2003US20030194953 Methods, apparatus and slurries for chemical mechanical planarization
10/16/2003US20030194948 Chemical-mechanical polishing machine for polishing a wafer of material, and an abrasive delivery device fitted to such a machine
10/15/2003EP1352711A1 Chemical mechanical polishing machine for polishing slice-like material and device for feeding of abrasive for such a machine
10/15/2003EP1009589B1 Chemicals supply system and its use
10/09/2003WO2003082523A1 Fluid mixing device and cutting device
10/09/2003WO2003061904B1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
10/09/2003US20030190874 Composite conditioning tool
10/09/2003US20030189004 Useful for chemical mechanical polishing (CMP) apparatus for polishing a workpiece by using a slurry containing an abrasive, a pH agent and deionized water, also includes a two-step filter: an ultra filter and reverse osmosis filter
10/08/2003EP1349700A2 Method of making optical fluoride laser crystal components
10/07/2003US6630403 Mixing a surfactant to a slurry to form a polishing solution; and planarizing of the microelectronic substrate using polishing solution
10/07/2003US6630051 Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the system
10/07/2003US6629881 Method and apparatus for controlling slurry delivery during polishing
10/07/2003US6629874 Feature height measurement during CMP
10/02/2003WO2003081647A1 Material supply system in semiconductor device manufacturing plant
10/01/2003EP1347824A2 Process and apparatus for blending and distributing a slurry solution
09/2003
09/30/2003US6626967 Polishing composition and polishing method employing it
09/30/2003US6626744 Planarization system with multiple polishing pads
09/30/2003US6626743 Method and apparatus for conditioning a polishing pad
09/30/2003US6626741 Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
09/25/2003WO2003078103A1 Polishing equipment, and method of manufacturing semiconductor device using the equipment
09/25/2003US20030178202 Flow completion system
09/24/2003EP1345735A1 Method and apparatus for chemical-mechanical polishing (cmp) using upstream and downstream fluid dispensing means
09/24/2003CN1122093C Polishing composition used for manufacturing storage hard disk and polishing method
09/23/2003US6623355 Methods, apparatus and slurries for chemical mechanical planarization
09/23/2003US6623338 Method of abrading silicon substrate
09/23/2003US6623335 Method of forming ink fill slot of ink-jet printhead
09/23/2003US6622745 Fluid waster diversion system
09/18/2003US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
09/12/2003WO2002060643A9 Spherical drive assembly for chemical mechanical planarization
09/11/2003US20030171080 Slurry distributor
09/11/2003US20030171076 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
09/11/2003US20030170991 Method of polishing a multi-layer substrate
09/09/2003US6616801 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
09/09/2003US6616014 Precision liquid mixing apparatus and method
09/09/2003US6615817 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
09/04/2003US20030166378 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
09/04/2003US20030166337 Chemical mechanical polishing systems and methods for their use
09/04/2003US20030164356 Slurry collection device and method
09/03/2003EP1339529A1 Methods, apparatus and slurries for chemical mechanical planarization
09/02/2003US6612912 Method for fabricating semiconductor device and processing apparatus for processing semiconductor device
09/02/2003US6612368 Flow completion apparatus
08/2003
08/28/2003WO2003071369A1 System and method for point of use delivery, control and mixing chemical and slurry for cmp/cleaning system
08/28/2003WO2002071445A3 Polishing chemical delivery for small head chemical mechanical planarization
08/27/2003EP1032485B1 Wafer polishing machine
08/27/2003CN1438932A Method of manufacturing a semicondustor component and chemical-mechanical polishing system therefor
08/26/2003US6609957 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
08/26/2003US6609954 Method of planarization
08/26/2003US6609953 Seal rings with improved friction and wear properties
08/21/2003WO2003068405A2 Granular material recovery system
08/21/2003US20030158630 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
08/19/2003US6607570 Abrasive particles having industry specified nominal grade and wide particle size distribution, containing fused crystalline abrasive particles comprising eutectic of crystalline alumina, crystalline rare earth oxide and/or complex of both
08/12/2003USRE38215 Polishing apparatus
08/12/2003US6604849 Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration
08/07/2003WO2003064108A1 Polishing head, polishing device and polishing method
08/07/2003US20030148712 Multiple step CMP polishing
08/07/2003US20030148711 Method of making optical fluoride laser crystal components
08/07/2003US20030148616 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide
08/05/2003US6602430 Methods for finishing microelectronic device packages
08/05/2003US6602123 Finishing pad design for multidirectional use
08/05/2003US6602108 Modular controlled platen preparation system and method
07/2003
07/31/2003WO2003061904A1 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
07/31/2003US20030143927 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
07/31/2003US20030143924 Method and system for slurry usage reduction in chemical mechanical polishing
07/29/2003US6599836 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
07/29/2003US6599175 Apparatus for distributing a fluid through a polishing pad
07/24/2003US20030139117 Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
07/22/2003US6595834 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
07/22/2003US6595829 Slurry pump control system
07/17/2003US20030132417 Method and apparatus for preparing slurry for CMP apparatus
07/17/2003US20030132168 Method and apparatus for preparing slurry for CMP apparatus
07/17/2003US20030131938 Apparatus for preparing and supplying slurry for CMP apparatus
07/15/2003US6592708 Filter apparatus and method therefor
07/09/2003EP1325793A2 Drainage structure in polishing plant
07/08/2003US6589872 Use of low-high slurry flow to eliminate copper line damages
07/03/2003US20030124852 Composition and method for planarizing surfaces
07/03/2003US20030121214 Polishing composition for a substrate for a magnetic disk and polishing method employing it
07/02/2003EP1322450A1 Activated slurry cmp system and methods for implementing the same
07/01/2003US6585570 Method and apparatus for supplying chemical-mechanical polishing slurries
07/01/2003US6585567 Short CMP polish method
07/01/2003US6585560 Apparatus and method for feeding slurry
07/01/2003US6585559 Modular controlled platen preparation system and method
06/2003
06/26/2003WO2003051577A1 Abrasive article for the deposition and polishing of a conductive material
06/26/2003US20030115806 A mixture contains colloidal silica, one bicarbonate selected from ammonium bicarbonate, lithium bicarbonate, potassium bicarbonate, sodium bicarbonate and water; surface treatment of semiconductor
06/25/2003EP1320440A1 Wafer carrier for cmp system
06/25/2003CN1426343A Method and apparatus for chemical-mechanical polishing using upstream and downstream fluid dispensing means
06/19/2003US20030113509 Abrasive article for the deposition and polishing of a conductive material
06/17/2003US6579800 Chemical mechanical polishing endpoint detection
06/17/2003US6579148 Polishing apparatus
06/12/2003US20030109199 Seal rings with improved friction and wear properties
06/11/2003EP1318306A1 Device for dispensing a liquid
06/11/2003CN1423307A Chemical solution conveying device and method for preparing suspension liquid
06/11/2003CN1422922A Polishing composition of magnetic disk substrate and polishing method using said composition
06/10/2003US6575816 Dual purpose handoff station for workpiece polishing machine
06/05/2003US20030104959 Chemical solution feeding apparatus and method for preparing slurry
06/05/2003US20030104699 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
06/05/2003US20030103852 Dispensing apparatus for a fluid
06/04/2003EP1218082B1 Process and filter for filtering a slurry
06/04/2003CN1422200A Integrated chemical-mechanical polishing
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