Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579) |
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11/22/2001 | US20010044259 Ultra fine particle film forming method and apparatus |
11/21/2001 | EP1156091A1 Polishing liquid and process of structuring metals and metal oxides |
11/20/2001 | US6319099 Apparatus and method for feeding slurry |
11/20/2001 | US6319098 Method of post CMP defect stability improvement |
11/20/2001 | US6319096 Fumed metal oxide liquid carrier for generating uniformed, layered surfaces with minimal defects |
11/15/2001 | US20010041502 Work polishing method |
11/15/2001 | US20010041501 System for real-time control of semiconductor wafer polishing |
11/15/2001 | US20010039946 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor |
11/13/2001 | US6316365 Chemical-mechanical polishing method |
11/13/2001 | US6315644 Apparatus and process for supplying abrasives for use in the manufacture of semiconductors |
11/13/2001 | US6315643 Polishing apparatus and method |
11/13/2001 | US6315635 Method and apparatus for slurry temperature control in a polishing process |
11/08/2001 | US20010037821 Integrated chemical-mechanical polishing |
11/01/2001 | WO2001081496A1 Polishing compound and method for preparation thereof, and polishing method |
11/01/2001 | WO2001081042A1 Polishing method using a rehydrated dry particulate polishing composition |
11/01/2001 | US20010036799 Method of polishing silicon wafer |
11/01/2001 | US20010036798 Methods for chemical-mechanical polishing of semiconductor wafers |
10/31/2001 | EP1149051A1 Sludge-free treatment of copper cmp wastes |
10/30/2001 | US6309434 Polishing composition and method for producing a memory hard disks |
10/25/2001 | US20010034190 Pure water reusing system |
10/25/2001 | US20010034134 Cmp uniformity |
10/23/2001 | US6306282 Sludge-free treatment of copper CMP wastes |
10/23/2001 | US6306023 Grinding tool, specially for hand-held oscillating devices |
10/23/2001 | US6306020 Multi-stage slurry system used for grinding and polishing materials |
10/23/2001 | US6306009 System for real-time control of semiconductor wafer polishing |
10/18/2001 | WO2001076819A1 Integrated chemical-mechanical polishing |
10/18/2001 | US20010031550 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
10/18/2001 | US20010030152 Compound mixer and filter for lapping machine |
10/17/2001 | EP1144155A2 Ultrasonic transducer slurry dispenser |
10/11/2001 | WO2001074537A1 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
10/10/2001 | EP1142672A1 Grinding slurry recycling apparatus |
10/10/2001 | EP1141154A1 Polishing composition and method |
10/10/2001 | CN1316768A Control for supplying level of semiconductor chip polishing size |
10/10/2001 | CN1316338A Method for making offset printing plate supporting body, affset printing plate supporting body and offset printing plate |
10/09/2001 | US6299515 CMP apparatus with built-in slurry distribution and removal |
10/09/2001 | US6299513 Method of fabricating a semiconductor device |
10/09/2001 | US6299506 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
10/04/2001 | WO2001073259A1 Tubing hanger with annulus bore |
10/04/2001 | WO2001073257A1 Tubing head seal assembly |
10/04/2001 | WO2001032793A8 Use of cesium hydroxide in a dielectric cmp slurry |
10/04/2001 | EP1138439A2 Method and apparatus for recycling abrasive grain slurry |
10/03/2001 | CN1315232A Regenerating treater for waste liquid of inorganic abradant |
10/02/2001 | US6296551 Polishing apparatus and polishing method |
09/27/2001 | WO2001070462A1 A method for chemical-mechanical-polishing a substrate |
09/27/2001 | WO2001017724A3 Ultrasonic transducer slurry dispenser |
09/27/2001 | US20010024935 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
09/27/2001 | EP1144155A3 Ultrasonic transducer slurry dispenser |
09/25/2001 | US6294472 Dual slurry particle sizes for reducing microscratching of wafers |
09/25/2001 | US6293850 Chemical-mechanical polish machines and fabrication process using the same |
09/25/2001 | US6293849 Polishing solution supply system |
09/20/2001 | US20010022214 Apparatus for processing semicondutor wafers |
09/18/2001 | US6291350 Method of polishing semiconductor wafer |
09/18/2001 | US6290576 Semiconductor processors, sensors, and semiconductor processing systems |
09/13/2001 | WO2001066309A1 Polishing method for soft acrylic articles |
09/13/2001 | US20010021628 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
09/13/2001 | DE10010287A1 Mixer arrangement, used in production of suspensions for chemical-mechanical polishing of wafers, comprises mixing container connected to one end of liquid pump, and feed and circulating systems |
09/13/2001 | CA2398616A1 Polishing method for soft acrylic articles |
09/11/2001 | US6287449 Method of electrolytic texturing and electrolytic liquid slurry |
09/11/2001 | US6287192 Slurry supply system for chemical mechanical polishing process having sonic wave generator |
09/07/2001 | WO2001064354A2 Method for repairing and lustering defects on hydrophilic coat surface |
09/07/2001 | CA2401657A1 Method for repairing and lustering defects on hydrophilic coat surface |
09/06/2001 | US20010019934 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
09/05/2001 | EP1128934A1 Chemical-mechanical-polishing system with continuous filtration |
09/04/2001 | US6284092 CMP slurry atomization slurry dispense system |
09/04/2001 | US6283840 Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus |
09/04/2001 | US6283825 Automatic trimmer machine |
08/30/2001 | WO2001062441A1 Mixing device and mixing method |
08/30/2001 | US20010018318 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
08/29/2001 | EP1127658A2 Apparatus for mixing slurry |
08/29/2001 | CN1310074A Cup shape grinding wheel parts, and method and apparatus for processing workpiece end face therewith |
08/28/2001 | US6280300 Filter apparatus |
08/28/2001 | US6280299 Combined slurry dispenser and rinse arm |
08/28/2001 | US6280297 Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
08/28/2001 | US6280295 Apparatus and method to polish a wafer using abrasive flow machining |
08/28/2001 | US6280079 Method of mixing slurries |
08/23/2001 | US20010016470 Polishing apparatus and polishing method |
08/23/2001 | US20010016466 System for real-time control of semiconductor wafer polishing |
08/22/2001 | EP0988133B1 Grinding tool, specially for hand-held oscillating devices |
08/22/2001 | CN1309167A Grinding oil composition for polishing |
08/09/2001 | WO2001057150A1 Polishing composition |
08/09/2001 | WO2001056946A1 FUSED Al2O3-RARE EARTH OXIDE EUTECTIC ABRASIVE PARTICLES, ABRASIVE ARTICLES, AND METHODS OF MAKING AND USING THE SAME |
08/09/2001 | WO2001056742A1 Polishing device and method |
08/08/2001 | CN1307517A Method for separation, regeneration and reuse of exhausted glycol-based slurry |
08/07/2001 | US6270246 Apparatus and method for precise mixing, delivery and transfer of chemicals |
08/02/2001 | WO2001032793A3 Use of cesium hydroxide in a dielectric cmp slurry |
08/02/2001 | US20010010305 Precision polishing method and apparatus of substrate |
08/02/2001 | DE19953131A1 Verfahren und Vorrichtung zum Kantenverrunden Method and apparatus for edge rounding |
07/31/2001 | US6267641 Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor |
07/26/2001 | US20010009840 Non-aqueous solvent and at least one acetylene glycol compound such as the ethylene oxide adduct of 2,4,7,9-tetramethyl-5-decyn-4,7-diol; finish grinding thin film type magnetic head |
07/25/2001 | EP1118431A2 Method and apparatus for detecting polishing endpoint with optical monitoring |
07/25/2001 | CN1305393A Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
07/24/2001 | US6264843 Process for reclaiming a suspension |
07/24/2001 | US6264789 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
07/17/2001 | US6261166 Wire cleaning apparatus |
07/17/2001 | US6261151 System for real-time control of semiconductor wafer polishing |
07/17/2001 | US6260709 Membrane filter element for chemical-mechanical polishing slurries |
07/12/2001 | US20010007809 Apparatus for polishing wafer and method of doing the same |
07/11/2001 | EP1114697A2 Apparatus and method for controlled delivery of slurry to a region of a polishing device |
07/11/2001 | EP1114695A2 Chemical mechanical planarization system |
07/10/2001 | US6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |