Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
11/2001
11/22/2001US20010044259 Ultra fine particle film forming method and apparatus
11/21/2001EP1156091A1 Polishing liquid and process of structuring metals and metal oxides
11/20/2001US6319099 Apparatus and method for feeding slurry
11/20/2001US6319098 Method of post CMP defect stability improvement
11/20/2001US6319096 Fumed metal oxide liquid carrier for generating uniformed, layered surfaces with minimal defects
11/15/2001US20010041502 Work polishing method
11/15/2001US20010041501 System for real-time control of semiconductor wafer polishing
11/15/2001US20010039946 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
11/13/2001US6316365 Chemical-mechanical polishing method
11/13/2001US6315644 Apparatus and process for supplying abrasives for use in the manufacture of semiconductors
11/13/2001US6315643 Polishing apparatus and method
11/13/2001US6315635 Method and apparatus for slurry temperature control in a polishing process
11/08/2001US20010037821 Integrated chemical-mechanical polishing
11/01/2001WO2001081496A1 Polishing compound and method for preparation thereof, and polishing method
11/01/2001WO2001081042A1 Polishing method using a rehydrated dry particulate polishing composition
11/01/2001US20010036799 Method of polishing silicon wafer
11/01/2001US20010036798 Methods for chemical-mechanical polishing of semiconductor wafers
10/2001
10/31/2001EP1149051A1 Sludge-free treatment of copper cmp wastes
10/30/2001US6309434 Polishing composition and method for producing a memory hard disks
10/25/2001US20010034190 Pure water reusing system
10/25/2001US20010034134 Cmp uniformity
10/23/2001US6306282 Sludge-free treatment of copper CMP wastes
10/23/2001US6306023 Grinding tool, specially for hand-held oscillating devices
10/23/2001US6306020 Multi-stage slurry system used for grinding and polishing materials
10/23/2001US6306009 System for real-time control of semiconductor wafer polishing
10/18/2001WO2001076819A1 Integrated chemical-mechanical polishing
10/18/2001US20010031550 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
10/18/2001US20010030152 Compound mixer and filter for lapping machine
10/17/2001EP1144155A2 Ultrasonic transducer slurry dispenser
10/11/2001WO2001074537A1 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
10/10/2001EP1142672A1 Grinding slurry recycling apparatus
10/10/2001EP1141154A1 Polishing composition and method
10/10/2001CN1316768A Control for supplying level of semiconductor chip polishing size
10/10/2001CN1316338A Method for making offset printing plate supporting body, affset printing plate supporting body and offset printing plate
10/09/2001US6299515 CMP apparatus with built-in slurry distribution and removal
10/09/2001US6299513 Method of fabricating a semiconductor device
10/09/2001US6299506 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using
10/04/2001WO2001073259A1 Tubing hanger with annulus bore
10/04/2001WO2001073257A1 Tubing head seal assembly
10/04/2001WO2001032793A8 Use of cesium hydroxide in a dielectric cmp slurry
10/04/2001EP1138439A2 Method and apparatus for recycling abrasive grain slurry
10/03/2001CN1315232A Regenerating treater for waste liquid of inorganic abradant
10/02/2001US6296551 Polishing apparatus and polishing method
09/2001
09/27/2001WO2001070462A1 A method for chemical-mechanical-polishing a substrate
09/27/2001WO2001017724A3 Ultrasonic transducer slurry dispenser
09/27/2001US20010024935 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
09/27/2001EP1144155A3 Ultrasonic transducer slurry dispenser
09/25/2001US6294472 Dual slurry particle sizes for reducing microscratching of wafers
09/25/2001US6293850 Chemical-mechanical polish machines and fabrication process using the same
09/25/2001US6293849 Polishing solution supply system
09/20/2001US20010022214 Apparatus for processing semicondutor wafers
09/18/2001US6291350 Method of polishing semiconductor wafer
09/18/2001US6290576 Semiconductor processors, sensors, and semiconductor processing systems
09/13/2001WO2001066309A1 Polishing method for soft acrylic articles
09/13/2001US20010021628 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
09/13/2001DE10010287A1 Mixer arrangement, used in production of suspensions for chemical-mechanical polishing of wafers, comprises mixing container connected to one end of liquid pump, and feed and circulating systems
09/13/2001CA2398616A1 Polishing method for soft acrylic articles
09/11/2001US6287449 Method of electrolytic texturing and electrolytic liquid slurry
09/11/2001US6287192 Slurry supply system for chemical mechanical polishing process having sonic wave generator
09/07/2001WO2001064354A2 Method for repairing and lustering defects on hydrophilic coat surface
09/07/2001CA2401657A1 Method for repairing and lustering defects on hydrophilic coat surface
09/06/2001US20010019934 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using
09/05/2001EP1128934A1 Chemical-mechanical-polishing system with continuous filtration
09/04/2001US6284092 CMP slurry atomization slurry dispense system
09/04/2001US6283840 Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
09/04/2001US6283825 Automatic trimmer machine
08/2001
08/30/2001WO2001062441A1 Mixing device and mixing method
08/30/2001US20010018318 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
08/29/2001EP1127658A2 Apparatus for mixing slurry
08/29/2001CN1310074A Cup shape grinding wheel parts, and method and apparatus for processing workpiece end face therewith
08/28/2001US6280300 Filter apparatus
08/28/2001US6280299 Combined slurry dispenser and rinse arm
08/28/2001US6280297 Apparatus and method for distribution of slurry in a chemical mechanical polishing system
08/28/2001US6280295 Apparatus and method to polish a wafer using abrasive flow machining
08/28/2001US6280079 Method of mixing slurries
08/23/2001US20010016470 Polishing apparatus and polishing method
08/23/2001US20010016466 System for real-time control of semiconductor wafer polishing
08/22/2001EP0988133B1 Grinding tool, specially for hand-held oscillating devices
08/22/2001CN1309167A Grinding oil composition for polishing
08/09/2001WO2001057150A1 Polishing composition
08/09/2001WO2001056946A1 FUSED Al2O3-RARE EARTH OXIDE EUTECTIC ABRASIVE PARTICLES, ABRASIVE ARTICLES, AND METHODS OF MAKING AND USING THE SAME
08/09/2001WO2001056742A1 Polishing device and method
08/08/2001CN1307517A Method for separation, regeneration and reuse of exhausted glycol-based slurry
08/07/2001US6270246 Apparatus and method for precise mixing, delivery and transfer of chemicals
08/02/2001WO2001032793A3 Use of cesium hydroxide in a dielectric cmp slurry
08/02/2001US20010010305 Precision polishing method and apparatus of substrate
08/02/2001DE19953131A1 Verfahren und Vorrichtung zum Kantenverrunden Method and apparatus for edge rounding
07/2001
07/31/2001US6267641 Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
07/26/2001US20010009840 Non-aqueous solvent and at least one acetylene glycol compound such as the ethylene oxide adduct of 2,4,7,9-tetramethyl-5-decyn-4,7-diol; finish grinding thin film type magnetic head
07/25/2001EP1118431A2 Method and apparatus for detecting polishing endpoint with optical monitoring
07/25/2001CN1305393A Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
07/24/2001US6264843 Process for reclaiming a suspension
07/24/2001US6264789 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
07/17/2001US6261166 Wire cleaning apparatus
07/17/2001US6261151 System for real-time control of semiconductor wafer polishing
07/17/2001US6260709 Membrane filter element for chemical-mechanical polishing slurries
07/12/2001US20010007809 Apparatus for polishing wafer and method of doing the same
07/11/2001EP1114697A2 Apparatus and method for controlled delivery of slurry to a region of a polishing device
07/11/2001EP1114695A2 Chemical mechanical planarization system
07/10/2001US6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
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