Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
04/2000
04/18/2000US6051499 Rotation
04/13/2000DE19845241A1 Dispensing flowing polishing material involves controlling spray head with at least one external pre-set command from the group time and displacement pre-sets
04/11/2000US6048256 Apparatus and method for continuous delivery and conditioning of a polishing slurry
04/06/2000WO2000018544A1 Apparatus and method for supplying slurry either to a polishing pad or to a return line
04/06/2000WO2000018543A1 Method of post cmp defect stability improvement
04/05/2000EP0990486A1 Polishing solution feeder
04/04/2000US6045605 Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material
04/04/2000US6045437 Method and apparatus for polishing a hard disk substrate
03/2000
03/29/2000EP0988133A1 Grinding tool, specially for hand-held oscillating devices
03/21/2000US6040245 IC mechanical planarization process incorporating two slurry compositions for faster material removal times
03/21/2000US6039635 Surface polishing apparatus including a dresser
03/15/2000CN1247381A Equipment and method for transporting substrate mechanical polishing and grinding suspension
03/14/2000US6036356 In-situ slurry mixing apparatus
03/08/2000EP0983822A1 Surface polishing apparatus
02/2000
02/29/2000US6030899 Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
02/29/2000US6030487 Wafer carrier assembly
02/23/2000EP0980741A1 Method and apparatus for abrasive slurry distribution in mechanical polishing of substrate
02/22/2000US6028006 Monitoring the ph of the polishing slurry circulating through wafer polishing apparatus, mixing an agent into the polishing slurry to adjust the ph of the polishing slurry as needed
02/22/2000US6027240 Apparatus and method for precise mixing, delivery and transfer of chemicals
02/15/2000US6024829 Eliminating agglomerate particles in a polishing slurry used for polishing a semiconductor wafer
02/08/2000US6021806 Slurry distribution system for a CMP process in semiconductor device fabrication
02/01/2000US6019665 Controlled retention of slurry in chemical mechanical polishing
02/01/2000US6019250 Liquid dispensing apparatus and method
01/2000
01/18/2000US6015499 Filter media for physically separating agglomerations of abrasive particles from a chemical-mechanical polishing process slurry stream
01/13/2000WO2000001519A1 Method for the separation, regeneration and reuse of an exhausted glycol-based slurry
01/05/2000EP0968801A1 A method for separating and regenerating polyethylene glycol and silicon carbide abrasive material to enable re-use thereof
01/04/2000US6010010 Process for reclaiming a grinding suspension
12/1999
12/28/1999US6007411 Wafer carrier for chemical mechanical polishing
12/28/1999US6007406 Polishing systems, methods of polishing substrates, and method of preparing liquids for semiconductor fabrication process
12/23/1999WO1999065592A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
12/23/1999CA2335175A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
12/21/1999US6004192 Unit for polishing bevels on the edges of glass plates, particularly on numeric-control machines
12/14/1999US6001265 Recovery of coolant and abrasive grains used in slicing semiconductor wafers
12/07/1999US5997392 Slurry injection technique for chemical-mechanical polishing
11/1999
11/30/1999US5994224 IC mechanical planarization process incorporating two slurry compositions for faster material removal times
11/30/1999US5993647 Circulation system of slurry
11/30/1999US5993299 Method and apparatus of uninterrupted slurry supply
11/30/1999US5993298 Lapping apparatus and process with controlled liquid flow across the lapping surface
11/24/1999EP0958106A2 Window polisher
11/17/1999EP0956926A1 Work polishing method
11/17/1999EP0956925A1 Barrel polishing apparatus
11/16/1999US5985045 Polishing semiconductor in polisher with polishing fluid including two components mixed within polisher and flowed through tube before reaching substrate
11/09/1999US5980368 Polishing tool having a sealed fluid chamber for support of polishing pad
11/04/1999WO1999056189A1 Conductivity feedback control system for slurry blending
11/02/1999US5975997 Method of double-side lapping a wafer and an apparatus therefor
10/1999
10/21/1999WO1999053121A1 Automated chemical process control system
10/14/1999WO1999051398A1 Apparatus and methods for slurry removal in chemical mechanical polishing
10/14/1999DE19814333A1 Rotating grinding or polishing disk tool
10/12/1999US5964645 Window polisher
10/12/1999US5964413 Apparatus for dispensing slurry
10/06/1999EP0947291A2 Slurry recycling system of CMP apparatus and method of same
09/1999
09/28/1999US5957759 Slurry distribution system that continuously circulates slurry through a distribution loop
09/01/1999CN1227152A Chemical mechanical polishing apparatus and method of chemical mechanical polishing
08/1999
08/31/1999US5944593 Retainer ring for polishing head of chemical-mechanical polish machines
08/31/1999US5944584 Apparatus and method for chamfering wafer with loose abrasive grains
08/24/1999US5940926 Multiple port evacuation apparatus having independent vacuum level control
08/11/1999EP0934802A2 Method of dispensing abrasive materials, and an abrasive material.
08/03/1999US5932486 Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
08/03/1999US5931725 Wafer polishing machine
08/03/1999US5931722 Chemical mechanical polishing apparatus
07/1999
07/29/1999WO1999037441A1 Polishing apparatus
07/21/1999CN1223194A Apparatus for dispensing slurry
07/15/1999WO1999034956A1 Economic supply and mixing method for multiple component cmp slurries
07/15/1999WO1999029505A8 Polishing solution feeder
07/13/1999US5922620 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
07/13/1999US5921853 Apparatus for polishing substrate using resin film or multilayer polishing pad
07/13/1999US5921849 Method and apparatus for distributing a polishing agent onto a polishing element
07/08/1999WO1999033612A1 Polishing device
06/1999
06/17/1999WO1999029505A1 Polishing solution feeder
06/16/1999EP0922534A2 Slurry mixing apparatus and method
06/09/1999EP0920956A2 Polishing apparatus and method
06/08/1999US5910040 Method of controlling shape and NC processing apparatus utilizing the method
06/03/1999WO1999026760A1 Wafer polishing machine
06/02/1999EP0919329A1 Liquid dispensing system and method
05/1999
05/19/1999EP0916463A1 Method for recycling an abrasive suspension
05/12/1999EP0914904A2 Apparatus for dispensing slurry
05/12/1999CN1216266A Chemical mechanical polishing system and method therefor
05/06/1999EP0913233A2 Polishing solution supply system
05/04/1999US5899799 Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
04/1999
04/27/1999US5897427 Particle supply valve for use in blasting apparatus
04/21/1999EP0909610A2 Liquid dispensing apparatus and method
04/20/1999US5895550 To enhance the planarization of semiconductor substrate wafer surfaces.
04/20/1999US5895315 Recovery device for polishing agent and deionizing water for a polishing machine
04/08/1999DE19743721A1 Spent grinding suspension, used for machining silicon, quartz or ceramic, is reprocessed
03/1999
03/30/1999US5887974 Slurry mixing apparatus and method
03/24/1999EP0903200A1 Improved grinding process
03/23/1999US5885134 Polishing apparatus
03/11/1999WO1999011432A1 Device and method for heating a liquid or semiliquid polishing agent, and device for polishing wafers
03/11/1999DE19737849A1 Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern Device and method for heating a liquid or viscous as well as polishing agent for polishing wafers device
03/03/1999EP0899005A1 Aqueous dispersion slurry of inorganic particles and production methods thereof
03/02/1999US5876271 Slurry injection and recovery method and apparatus for chemical-mechanical polishing process
01/1999
01/14/1999DE19755705A1 Double sided lapping method for large sized wafer
01/12/1999US5857898 Method of and apparatus for dressing polishing cloth
01/12/1999US5857893 Methods and apparatus for measuring and dispensing processing solutions to a CMP machine
12/1998
12/30/1998WO1998058771A1 Fine abrasive grain-containing buffing material and shaft-carrying tool
12/30/1998EP0887153A2 Combined slurry dispenser and rinse arm and method of operation
12/22/1998US5851135 System for real-time control of semiconductor wafer polishing
12/10/1998WO1998055266A1 Grinding tool, specially for hand-held oscillating devices
12/10/1998WO1998055263A1 Method and apparatus for distributing a polishing agent onto a polishing element
12/10/1998DE19723987A1 Schleifwerkzeug, insbesondere für Hand-Oszillationsgeräte Grinding tool, especially for hand-Oszillationsgeräte
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