| Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579) |
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| 07/10/2001 | US6257965 Polishing liquid supply apparatus |
| 07/10/2001 | US6257955 Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers |
| 07/05/2001 | US20010006882 Supply system for chemicals and its use |
| 07/05/2001 | DE19960380A1 Verfahren zum Fraktionieren einer Zerspanungssuspension Method for fractionating a machining suspension |
| 07/05/2001 | DE10002450A1 Polish for post-treatment of lacquered surfaces in the automobile industry comprises preferably 5-10 wt.% polish and a 1-1:3, preferably 1:2 mixture of thinner and spray dissolver |
| 06/28/2001 | WO2001045899A1 Polishing pad, and method and apparatus for polishing |
| 06/28/2001 | WO2001045897A1 Automatic trimmer machine |
| 06/28/2001 | WO2001045888A1 Compound mixer and filter for lapping machine |
| 06/28/2001 | US20010005665 Dual purpose handoff station for workpiece polishing machine |
| 06/27/2001 | EP1111665A2 Method of planarizing a substrate surface |
| 06/26/2001 | US6250994 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 06/21/2001 | WO2001044402A1 Method of polishing or planarizing a substrate |
| 06/21/2001 | WO2001044396A1 Polishing compositions for noble metals |
| 06/21/2001 | WO2001044395A1 Polishing compositions for semiconductor substrates |
| 06/21/2001 | WO2001043933A1 Method for separating a machining suspension into fractions |
| 06/21/2001 | US20010004538 Computer readable medium is provided bearing instructions to control polishing system to polish substrate surface at a first removal rate on a first platen and then polish at a second removal rate less than the first rate |
| 06/21/2001 | CA2392399A1 Method for separating a machining suspension into fractions |
| 06/19/2001 | US6248006 CMP uniformity |
| 06/14/2001 | WO2001043178A1 Polishing-product discharging device and polishing device |
| 06/14/2001 | WO2001041973A2 Chemical-mechanical polishing method |
| 06/14/2001 | US20010003700 CMP slurry recycling apparatus and method for recycling CMP slurry |
| 06/14/2001 | US20010003699 Wet type buffing method, deposition plating method work buffing method, work buffing apparatus barrel buffing apparatus, work surface treatingmethod, work supporting unit for barrel buffing apparatus and buffing medium |
| 06/14/2001 | US20010003696 Wet type buffing method, deposition plating method, work buffing method, work buffing apparatus, barrel buffing apparatus, work surface treating method, work supporting unit for barrel buffing apparatus, and buffing medium |
| 06/12/2001 | US6245679 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 06/12/2001 | US6244929 Chemical-mechanical-polishing system with continuous filtration |
| 06/07/2001 | WO2001024969A3 Fluid dispensing fixed abrasive polishing pad |
| 06/05/2001 | US6241586 CMP polishing slurry dewatering and reconstitution |
| 06/05/2001 | US6241582 Chemical mechanical polish machines and fabrication process using the same |
| 05/31/2001 | WO2001039260A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics |
| 05/31/2001 | US20010002361 Polishing liquid supply apparatus |
| 05/31/2001 | US20010002358 Dual purpose handoff station for workpiece polishing machine |
| 05/30/2001 | EP1103295A2 Oil separating apparatus for oil containing substance and method therefor |
| 05/29/2001 | US6238279 Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers |
| 05/29/2001 | CA2326284A1 Oil separating apparatus for oil containing substance and method therefor |
| 05/25/2001 | WO2001036555A1 Composition and method for planarizing surfaces |
| 05/25/2001 | WO2001036554A1 Composition and method for planarizing surfaces |
| 05/24/2001 | US20010001755 System for real-time control of semiconductor wafer polishing |
| 05/22/2001 | US6235635 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning |
| 05/22/2001 | US6234884 Semiconductor wafer polishing device for removing a surface unevenness of a semiconductor substrate |
| 05/22/2001 | US6234876 Chemical-mechanical polish machines and fabrication process using the same |
| 05/22/2001 | US6234874 Wafer processing apparatus |
| 05/16/2001 | EP1099471A1 Apparatus and method for precise mixing, delivery and transfer of chemicals |
| 05/15/2001 | US6231628 Method for the separation, regeneration and reuse of an exhausted glycol-based slurry |
| 05/10/2001 | WO2001032794A1 A ta barrier slurry containing an organic additive |
| 05/10/2001 | WO2001032793A2 Use of cesium hydroxide in a dielectric cmp slurry |
| 05/10/2001 | WO2001032358A2 Method and device for rounding edges |
| 05/08/2001 | US6227950 Dual purpose handoff station for workpiece polishing machine |
| 05/02/2001 | EP1095734A1 Polishing device |
| 05/01/2001 | US6225224 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
| 04/26/2001 | WO2001029145A1 Improved cmp products |
| 04/26/2001 | CA2383504A1 Improved cmp products |
| 04/24/2001 | US6220941 Method of post CMP defect stability improvement |
| 04/24/2001 | US6220934 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/18/2001 | CN1291630A Polishing composition used for manufacturing storage hard disk and polishing method |
| 04/12/2001 | WO2001025505A1 Cemented carbide wear part and lapping method |
| 04/12/2001 | WO2001024969A2 Fluid dispensing fixed abrasive polishing pad |
| 04/12/2001 | CA2383656A1 Cemented carbide wear part and lapping method |
| 04/11/2001 | EP1089801A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
| 04/10/2001 | US6213852 Polishing apparatus and method of manufacturing a semiconductor device using the same |
| 04/05/2001 | WO2001023485A1 Polishing composition and method |
| 04/05/2001 | WO2001023139A1 Polishing pad treatment for surface conditioning |
| 04/05/2001 | US20010000166 Apparatus and method for feeding slurry |
| 04/04/2001 | EP1088622A2 Platen with web release apparatus |
| 04/04/2001 | CN1289628A Filter and using method thereof |
| 04/03/2001 | US6210525 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 03/29/2001 | DE19907457A1 Spray device for polishing paste or abrasive paste has central flow passage with closing valve |
| 03/27/2001 | US6206764 Methods for machining hard materials using alcohols |
| 03/27/2001 | US6206760 Method and apparatus for preventing particle contamination in a polishing machine |
| 03/27/2001 | US6206757 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 03/22/2001 | WO2001019490A1 Process and filter for filtering a slurry |
| 03/20/2001 | US6203412 Submerge chemical-mechanical polishing |
| 03/15/2001 | WO2001017724A2 Ultrasonic transducer slurry dispenser |
| 03/13/2001 | US6200414 Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof |
| 03/13/2001 | US6200202 System and method for supplying slurry to a semiconductor processing machine |
| 03/13/2001 | US6200196 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 03/06/2001 | US6196907 Slurry delivery system for a metal polisher |
| 03/06/2001 | US6196901 Method of double-side lapping a wafer and an apparatus therefor |
| 03/06/2001 | US6196900 Ultrasonic transducer slurry dispenser |
| 03/01/2001 | WO2001014496A1 Compositions for insulator and metal cmp and methods relating thereto |
| 02/22/2001 | WO2001012741A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | WO2001012740A1 Polishing system and method of its use |
| 02/22/2001 | WO2001012739A1 Chemical mechanical polishing systems and methods for their use |
| 02/22/2001 | DE19937784A1 Zweischeiben-Feinschleifmaschine Two slices of fine grinding |
| 02/22/2001 | CA2378793A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | CA2378790A1 Polishing system and method of its use |
| 02/22/2001 | CA2378771A1 Chemical mechanical polishing systems and methods for their use |
| 02/21/2001 | EP1076681A1 A cutting and lubricating composition for use with a wire cutting apparatus |
| 02/14/2001 | EP1075897A1 Lapping machine with two plates |
| 02/14/2001 | EP1075675A1 Conductivity feedback control system for slurry blending |
| 02/13/2001 | US6186872 Polisher |
| 02/06/2001 | US6183352 Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique |
| 02/06/2001 | US6183351 Method of supplying a chemical mechanical polishing liquid and apparatus therefor |
| 02/06/2001 | US6183350 Chemical-mechanical polish machines and fabrication process using the same |
| 02/06/2001 | US6183341 Slurry pump control system |
| 01/30/2001 | US6179699 Shape memory alloy-controlled slurry dispense system for CMP processing |
| 01/30/2001 | US6179694 Extended guide rings with built-in slurry supply line |
| 01/30/2001 | US6179689 Spherical mirror surface processing method and device |
| 01/25/2001 | WO2001006553A1 Polishing mixture and process for reducing the incorporation of copper into silicon wafers |
| 01/25/2001 | DE19929929A1 Chemical-mechanical polishing of semiconductor wafers involves applying pulsed acoustic oscillations to emery powder emulsion container and second of three pipelines |
| 01/24/2001 | EP1069972A1 Apparatus and methods for slurry removal in chemical mechanical polishing |