Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
01/2001
01/23/2001US6176765 Accumulator for slurry sampling
01/17/2001EP1068373A1 Automated chemical process control system
01/11/2001WO2000060917A3 Bi-modal abrasive slurries for planarization
01/04/2001WO2001000907A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography
01/04/2001DE10032819A1 Slurry management system has re-utilization units for used slurry, used cutting liquid, mixer unit with central cutting liquid production device, slurry production unit, ring pipelines systems
01/03/2001CN2412695Y Feeding device of metal polishing machine
12/2000
12/27/2000EP1063058A2 Method and apparatus for supplying coolant in a grinding machine
12/26/2000US6165048 Chemical-mechanical-polishing system with continuous filtration
12/14/2000DE19930353A1 Method for slicing semiconductor bars with grinding suspension continuously refreshed
12/12/2000US6159086 Dust collecting work station
12/12/2000US6159082 Slurry circulation type surface polishing machine
12/07/2000DE19925696A1 Removal of impurities from chemical-mechanical polishing slurry in manufacture of semiconductor materials includes using a magnetic filter to remove magnetic particles and then removing non-magnetic particles
12/06/2000CN1275799A Method for making semiconductor device
12/05/2000US6156659 Linear CMP tool design with closed loop slurry distribution
11/2000
11/29/2000CN1274949A System for transfering polishing liquid when semiconductor wafer is chemimechanical polished
11/23/2000WO2000037215A9 Auxiliary surface treating arrangement for surface treating device
11/22/2000EP1053830A2 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
11/21/2000US6149078 Slurry nozzle
11/15/2000EP1052063A1 System for chemical mechanical planarization
11/15/2000EP1052061A2 System for chemical mechanical planarization
11/15/2000EP1052060A2 Method for chemical mechanical planarization
11/15/2000EP1052059A2 Method for chemical mechanical planarization
11/14/2000US6146246 Method for supplying flush fluid
11/09/2000DE19919108A1 Suspension abrasive agent feeder for polishing workpieces
11/02/2000WO2000064822A1 Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing
10/2000
10/31/2000US6139406 Combined slurry dispenser and rinse arm and method of operation
10/26/2000WO2000062977A1 Method of conditioning wafer polishing pads
10/24/2000US6135865 CMP apparatus with built-in slurry distribution and removal
10/24/2000US6135863 Method of conditioning wafer polishing pads
10/24/2000US6135856 Apparatus and method for semiconductor planarization
10/19/2000WO2000060917A2 Bi-modal abrasive slurries for planarization
10/17/2000US6132301 Auxiliary surface treating arrangement for surface treating device
10/17/2000US6132078 Slurry providing system
10/12/2000WO2000060645A2 Dual cmp pad conditioner
10/11/2000EP1043122A2 Apparatus and method for continuous delivery and conditioning of a polishing slurry
10/10/2000US6130163 Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water
10/03/2000US6126531 Used to restores the state of agglomeration of the abrasive grains to the initial state to enable reuse of the slurry and thereby reduces the cost of polishing work and improves operating rate of mechanical chemical polishing apparatus
10/03/2000US6126517 System for chemical mechanical polishing having multiple polishing stations
10/03/2000US6125876 Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
09/2000
09/28/2000DE19912252A1 Verfahren zum Wiederaufarbeiten einer Suspension A method for reprocessing a suspension
09/27/2000EP1038636A2 A carrier head for providing a polishing slurry
09/27/2000CN1267903A Uniformity for improving chemical-mechanically polishing
09/26/2000US6123602 Portable slurry distribution system
09/20/2000EP1036640A1 Method for reclaiming slurry by a magnetic separator
09/20/2000EP1036632A2 Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices
09/20/2000EP1036631A1 Apparatus and method for polishing a semiconductor wafer
09/19/2000US6121147 Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance
09/19/2000US6120347 System for real-time control of semiconductor wafer polishing
09/14/2000WO2000053371A1 Secondary dual purpose station for workpiece polishing machine
09/12/2000US6116993 Chemicomechanical polishing device for a semiconductor wafer
09/12/2000US6116988 Method of processing a wafer utilizing a processing slurry
09/12/2000US6116986 Drainage structure in polishing plant and method of polishing using structure
09/06/2000EP1033203A2 Spherical lapping method
09/06/2000EP1032485A1 Wafer polishing machine
08/2000
08/31/2000DE19905583A1 Fluid supply device for fine grinding of optical surfaces, with connecting sector rotating together with tool
08/31/2000DE19904345A1 Vorrichtung zum Schleifen der Messer von Zerspanern Device for grinding the knife of flakers
08/29/2000US6110012 Chemical-mechanical polishing apparatus and method
08/24/2000WO2000049111A1 A cutting and lubricating composition for use with a wire cutting apparatus
08/24/2000CA2329216A1 A cutting and lubricating composition for use with a wire cutting apparatus
08/22/2000US6107203 Chemical mechanical polishing system and method therefor
08/22/2000US6106728 Slurry recycling system and method for CMP apparatus
08/22/2000US6106374 Acoustically agitated delivery
08/22/2000US6106369 Polishing system
08/15/2000US6102782 System and apparatus for distributing flush fluid to processing equipment
08/09/2000EP1025956A1 Device for dressing the knives of a crusher
08/08/2000US6099386 Control device for maintaining a chemical mechanical polishing machine in a wet mode
08/08/2000US6098901 Apparatus for dispensing slurry
08/01/2000US6096162 Chemical mechanical polishing machine
08/01/2000US6095904 Orbital motion chemical-mechanical polishing method and apparatus
07/2000
07/27/2000DE19955387A1 Polishing agent feed to semiconductor disc polisher based on chemical-mechanical polishing (CMP) for flattening intermediate insulation foil
07/19/2000EP1020271A1 A saw wire cleaning apparatus
07/13/2000WO2000040512A1 Sludge-free treatment of copper cmp wastes
07/11/2000US6086457 Washing transfer station in a system for chemical mechanical polishing
07/11/2000US6086454 Method of fabricating a semiconductor device using a CMP process
06/2000
06/29/2000WO2000037215A1 Auxiliary surface treating arrangement for surface treating device
06/29/2000DE19860090A1 Chemical-mechanical polishing unit for semiconductor elements, comprises a polishing table, a polishing plate with inner and outer ring sections, a wafer carrier, and a sludge supply tube
06/28/2000CN2384741Y Water supply sealing device for polishing liquor internal circulation system
06/27/2000US6080673 Particle coagulation in the polishing slurry is minimized and the microelectronic device experiences minimal damage.
06/27/2000US6080670 Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie
06/27/2000US6080046 Underwater wafer storage and wafer picking for chemical mechanical polishing
06/21/2000EP1009589A1 Chemicals supply system and its use
06/20/2000US6077785 Ultrasonic processing of chemical mechanical polishing slurries
06/20/2000US6077437 Polishing agent recovery and reuse method and device for the same removes large impurities by a filtration device, concentrates by an ultrafiltration device, and continuously recovers polishing agent; used for semiconductor polishing
06/20/2000US6077148 Spherical lapping method
06/20/2000US6076541 Dispensing system and method for dispensing an aqueous solution
06/13/2000US6074286 Wafer processing apparatus and method of processing a wafer utilizing a processing slurry
06/13/2000US6074276 Polishing apparatus
06/06/2000US6071818 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
05/2000
05/30/2000US6068769 Tank of a kneader
05/24/2000EP1002626A2 A linear CMP tool design using in-situ slurry distribution and concurrent pad conditionning
05/18/2000WO2000027591A1 Chemical-mechanical-polishing system with continuous filtration
05/16/2000US6062964 Chemical mechanical polishing apparatus for controlling slurry distribution
05/16/2000US6062963 Retainer ring design for polishing head of chemical-mechanical polishing machine
05/09/2000US6059920 Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method
05/03/2000EP0997230A1 Method and apparatus for distributing a fluid polishing media
05/02/2000US6056851 Slurry supply system for chemical mechanical polishing
04/2000
04/27/2000DE19849025A1 Crank shaft grinding machine has nozzle arrangement with head, rotational axle, grinding wheel, guide and drive connection
04/25/2000US6054422 Polyoxyalkylene glycol
04/25/2000US6053802 Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse
04/25/2000US6053801 Substrate polishing with reduced contamination
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