Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
03/2007
03/21/2007CN1305547C Filter and using method thereof
03/15/2007DE19839086B4 Rückhaltering für eine chemisch-mechanische Poliervorrichtung und chemisch-mechanische Poliervorrichtung damit Retaining ring for a chemical mechanical polishing apparatus, and chemical-mechanical polishing apparatus so that
03/13/2007US7189146 Method for reduction of defects in wet processed layers
03/01/2007US20070049183 Chemical-mechanical polishing apparatus and method of conditioning polishing pad
02/2007
02/28/2007EP1756253A1 Matrix liquid for producing a chip removal suspension, and used as a lubricating or machining liquid
02/27/2007US7182668 Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
02/21/2007CN1915595A Method for batch processing polishing fluid in situ for chemico-mechanical polishing metal, and equipment utilized
02/20/2007US7180591 Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
02/14/2007CN1914004A Multi-step pad conditioning system and method for chemical planarization
02/14/2007CN1299878C Apparatus for preparing grinding liquid
02/06/2007US7172492 Polishing method and polishing system
01/2007
01/25/2007WO2007010717A1 Double side polishing method for wafer
01/23/2007US7166018 Apparatus and method for feeding slurry
01/23/2007US7166015 Apparatus and method for controlling fluid material composition on a polishing pad
01/18/2007US20070015443 Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor
01/18/2007DE10323743B4 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus
01/16/2007US7163438 Zone polishing using variable slurry solid content
01/16/2007US7163053 Heat exchanger
01/11/2007US20070007012 Flow completion system
01/03/2007CN2853282Y Polishing equipment for ceramic product
12/2006
12/28/2006WO2006137098A1 Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
12/28/2006CA2613475A1 Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
12/26/2006US7153425 Process and filter for filtering a slurry
12/26/2006US7153196 Method of polishing using a polishing agent
12/06/2006CN1288093C Elimination method of eliminated article
12/05/2006US7144312 Scratch removal tool and system
12/05/2006US7144301 Method and system for planarizing integrated circuit material
11/2006
11/29/2006EP1726402A1 Wafer polishing apparatus and method for polishing wafers
11/28/2006US7140955 Polishing apparatus
11/23/2006US20060264157 Wafer polishing apparatus and method for polishing wafers
11/22/2006CN1285979C Automatic control device and method for grinding slurry feed arm
11/21/2006US7138073 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
11/14/2006US7134947 Chemical mechanical polishing system
11/09/2006US20060249134 Multi-wire saw
11/08/2006CN2834785Y Liquid dripping device for metallographic polishing machine
11/02/2006US20060246821 Method for controlling polishing fluid distribution
11/02/2006EP1715979A2 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
10/2006
10/31/2006US7128803 Integration of sensor based metrology into semiconductor processing tools
10/26/2006US20060241006 Contains abrasive grains such as magnesium oxide (MnO, MnO2, Mn2O3, Mn3O4), with hydrogen peroxide as solvent, washing with hydrofluoric acid solution, spin drying
10/26/2006DE10023002B4 Satz von Läuferscheiben sowie dessen Verwendung Set of carriers and the use thereof
10/25/2006CN1852787A Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
10/18/2006CN1280077C Method for separation, regeneration and reuse of exhausted glycol-based slurry
10/17/2006US7122475 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/12/2006US20060229001 Exposing substance, exposing method, and exposing device
10/12/2006US20060228991 Polishing method and apparatus
10/11/2006EP1626838B1 Exposing substance, exposing method, and exposing device
10/10/2006US7118456 Polishing head, retaining ring for use therewith and method fo polishing a substrate
10/10/2006US7118455 Semiconductor workpiece processing methods
10/10/2006US7118447 Semiconductor workpiece processing methods
10/10/2006US7118445 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor
09/2006
09/28/2006US20060217049 Perforation and grooving for polishing articles
09/28/2006US20060217039 Polishing apparatus and method of polishing work piece
09/27/2006CN1839015A Apparatus and method for controlling film thickness and fluid material composition on a polishing pad
09/20/2006CN1833821A Abrasive liquid feeder and abrasive liquid mixing method of chemical machinery abrasive machine
09/19/2006US7108580 Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
09/14/2006US20060205325 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/13/2006CN2815609Y Spiral-slice automatic drooling device
09/13/2006CN2815608Y Sedimentation tank capable of efficiently purifying feed pulp
09/13/2006CN2815607Y Auto-controlled feed pulp discharging device
09/07/2006US20060199480 Apparatus and method for feeding slurry
09/06/2006CN1828840A Multipurpose slurry delivery arm for chemical mechanical polishing
09/05/2006US7101252 Polishing method and apparatus
08/2006
08/31/2006US20060194525 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/29/2006US7097544 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/29/2006US7096937 Flow completion system
08/24/2006DE10157452B4 Verfahren zum chemisch-mechanischen Polieren von Wafern A method for chemical mechanical polishing of wafers
08/23/2006EP1693152A1 Apparatus for finishing edge-strips of plate-like workpieces
08/08/2006US7086933 Flexible polishing fluid delivery system
08/03/2006WO2006054732A3 Polishing apparatus and polishing method
08/02/2006EP1685927A1 Multi-wire saw
07/2006
07/27/2006WO2006076827A1 Blasting device for premixed abrasive slurry
07/26/2006CN1807016A Method and system for lowering impurity content in abrasive slurry
07/20/2006US20060160470 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
07/18/2006US7077730 Method and apparatus for polishing a workpiece
07/12/2006EP1536920B1 Polishing pad
07/06/2006US20060148374 Transmitter for wireless control
07/04/2006US7071108 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
07/04/2006US7070486 Polishing apparatus and method of polishing work piece
07/04/2006US7070485 Polishing composition
07/04/2006US7069988 Flow completion system
06/2006
06/28/2006CN1795074A Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
06/27/2006US7066800 Conductive polishing article for electrochemical mechanical polishing
06/21/2006EP1322450B1 Activated slurry cmp system and methods for implementing the same
06/21/2006EP1278935B1 Tubing head seal assembly
06/21/2006EP1180068B1 Method and device for rounding edges
06/21/2006CN2788966Y 研磨机 Grinder
06/21/2006CN1791497A Method for cleaning sic particles
06/15/2006US20060128286 Polishing apparatus
06/13/2006US7059948 Articles for polishing semiconductor substrates
06/13/2006US7059943 Method and apparatus for recycling slurry
06/07/2006CN1781971A Polishing composition
06/01/2006WO2005072338A3 Multi-step pad conditioningh system and method for chemical planarization
06/01/2006US20060112647 Polishing composition
05/2006
05/31/2006CN1780901A Slurry for slicing silicon ingot and method for slicing silicon ingot using same
05/30/2006US7054719 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
05/30/2006US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
05/30/2006US7052599 Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors
05/30/2006US7052377 Apparatus and method for feeding slurry
05/30/2006US7052371 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
05/24/2006EP1370392B1 Random-orbit head with lock-up feature
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