Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
03/2005
03/24/2005DE10338520A1 Method for separating material splitting suspension of cooling lubricant, containing cutting grain and dispersed worked material abraded particles, with suspension treated with gas
03/16/2005CN1192905C Method for making offset printing plate supporting body, offset printing plate supporting body and offset printing plate
03/15/2005US6866784 Slurry recycling system and method for CMP apparatus
03/15/2005US6866567 Activated slurry CMP system and methods for implementing the same
03/10/2005US20050051913 Fluid mixing device and cutting device
03/03/2005US20050048882 Polishing apparatus and method
03/03/2005US20050048880 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
02/2005
02/24/2005US20050040050 Polishing apparatus
02/22/2005US6857940 Electrodes configured to apply pressure to a fluid including dielectric abrasive particles on the workpiece and arrange the particles uniformly by a Coulomb force produced by applying an alternating current voltage; antiagglomerants
02/17/2005DE19929929B4 Verfahren und Vorrichtung zum chemisch-mechanischen Polieren von Halbleiterscheiben Method and apparatus for chemical mechanical polishing of semiconductor wafers
02/16/2005CN1189924C System for controlling instant-compensuted grinded curved surface
02/15/2005US6855035 Apparatus and method for producing substrate with electrical wire thereon
02/15/2005US6855031 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
02/15/2005US6855030 Modular method for chemical mechanical planarization
02/15/2005US6854484 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve
02/09/2005EP1505639A1 Polishing fluid and polishing method
02/08/2005US6852632 Method of polishing a multi-layer substrate
02/03/2005US20050026551 Method to improve control in CMP processing
02/03/2005US20050026549 Zone polishing using variable slurry solid content
02/03/2005US20050026547 Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid
02/01/2005US6849547 Apparatus and process for polishing a workpiece
02/01/2005US6849542 Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives
01/2005
01/27/2005WO2005007342A1 Polishing apparatus
01/27/2005US20050020194 Method and apparatus for polishing a workpiece
01/27/2005US20050016936 Process and filter for filtering a slurry
01/27/2005US20050016861 On a semiconductor wafer with an insulating layer of a field region and a plurality of features, forming a barrier layer overlying the field region; electrodepositing copper filling the features in the insulating layer, polishing to remove the copper layer and the barrier layer from the field region
01/25/2005US6846227 Electro-chemical machining appartus
01/20/2005WO2005005102A1 Application of heated slurry for cmp
01/20/2005US20050011840 Process and filter for filtering a slurry
01/13/2005US20050005629 Anti-stratification-solution delivery system for spin-on dielectrics
01/11/2005US6840971 Chemical mechanical polishing systems and methods for their use
01/11/2005US6840847 Device for polishing digital storage discs
01/11/2005US6840846 Polishing station of a chemical mechanical polishing apparatus
01/06/2005US20050003745 Apparatus and method for feeding slurry
01/06/2005US20050003666 CMP slurry and method of manufacturing semiconductor device
01/05/2005CN1561376A Polishing composition
01/04/2005US6838149 Abrasive article for the deposition and polishing of a conductive material
12/2004
12/30/2004US20040266327 Conductive polishing article for electrochemical mechanical polishing
12/30/2004US20040266321 Method and apparatus to add slurry to a polishing system
12/30/2004US20040266319 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
12/30/2004US20040266192 Application of heated slurry for CMP
12/29/2004WO2004113023A1 Chemical-solution supplying apparatus
12/29/2004WO2004113022A1 Apparatus and method for controlling the film thickness on a polishing pad
12/29/2004WO2004097929A3 Method and apparatus for reduction of defects in wet processed layers
12/28/2004US6835117 Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density
12/23/2004WO2004112091A2 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
12/23/2004US20040259482 Chemical mechanical polishing apparatus and method of chemical mechanical polishing
12/21/2004US6833046 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
12/16/2004DE10323743A1 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus
12/15/2004EP1486308A2 Process for the correction treatment of the pulp in a granite-cutting unit
12/09/2004US20040248418 Fabrication method of semiconductor integrated circuit device
12/09/2004US20040248411 Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
12/07/2004US6827638 Polishing device and method
12/07/2004US6827634 Ultra fine particle film forming method and apparatus
12/02/2004WO2004103640A1 Exposing substance, exposing method, and exposing device
12/02/2004US20040242127 Apparatus and method for feeding slurry
12/02/2004US20040242126 CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method
12/02/2004US20040241989 Method of using multiple, different slurries in a CMP polishing process via a pad conditioning system
11/2004
11/25/2004DE19925696B4 Vorrichtung und Verfahren zum Filtern eines CMP-Breis Device and method for filtering a CMP slurry
11/25/2004DE19905583B4 Vorrichtung für die Zufuhr flüssiger Hilfsmittel mit abrasiven Bestandteilen bei der Feinbearbeitung optischer Flächen Apparatus for supplying liquid containing abrasive tools for precision machining of optical surfaces
11/24/2004CN2657856Y Super-precision free abrasive material honing machine
11/23/2004US6821895 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP
11/23/2004US6821437 Forming reusable cutting fluid; complete removal of abrasive grains and attrition material
11/18/2004US20040229551 Systems for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
11/18/2004US20040229549 Slurry delivery arm
11/11/2004WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers
11/11/2004US20040222100 Process and system for providing electrochemical processing solution with reduced oxygen and gas content
11/10/2004EP1474729A1 System and method for point of use delivery, control and mixing chemical and slurry for cmp/cleaning system
11/09/2004US6814835 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
11/04/2004WO2004078410A3 Agent for increasing selection ratio of polishing rates
11/04/2004US20040219867 Apparatus and method for controlling fluid material composition on a polishing pad
11/04/2004DE10230146B4 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece
11/02/2004US6811583 Polishing composition for a substrate for a magnetic disk and polishing method employing it
11/02/2004US6811473 Process for machining a wafer-like workpiece
11/02/2004US6811468 Polishing apparatus
10/2004
10/28/2004US20040214508 Apparatus and method for controlling film thickness in a chemical mechanical planarization system
10/27/2004CN2650941Y Lapping liquid tank
10/21/2004US20040209549 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/21/2004US20040209548 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/19/2004US6805615 Particle size distribution comprising ceria, alumina, titania, and/or tantalum oxide; abrasive slurry
10/14/2004US20040203327 Grinding apparatus with splash protector and improved fluid delivery system
10/13/2004EP1465750A1 Abrasive article for the deposition and polishing of a conductive material
10/13/2004CN1537037A Multiport polishing fluid delivery system
10/13/2004CN1170903C Ta barrier slurry containing organic additive
10/12/2004US6802983 Preparation of high performance silica slurry using a centrifuge
10/12/2004US6802762 Method for supplying slurry to polishing apparatus
10/07/2004US20040199293 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
10/07/2004US20040198195 Apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/07/2004US20040198194 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/07/2004US20040198190 Method and apparatus for reduction of defects in wet processed layers
10/07/2004US20040198184 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
10/07/2004US20040198183 Turbidity monitoring methods, apparatuses, and sensors
10/07/2004US20040194937 Heat exchanger
10/07/2004US20040194336 Pressure vessel systems and methods for dispensing liquid chemical compositions
09/2004
09/30/2004WO2004084287A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/30/2004WO2004030860A3 Flow control system
09/30/2004US20040192176 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
09/30/2004US20040192174 Method for controlling PH during planarization and cleaning of microelectronic substrates
09/30/2004US20040188244 Electro-chemical machining apparatus
09/30/2004US20040188083 Flow completion system
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