Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
03/2004
03/25/2004US20040055998 Method for providing a smooth wafer surface
03/23/2004US6709313 Apparatus for producing polishing solution and apparatus for feeding the same
03/18/2004US20040053570 Novel finishing pad design for multidirectional use
03/18/2004US20040052154 Chemical solution feeding apparatus and method for preparing slurry
03/17/2004CN1482943A Process and apparatus for blending and distributing a slurry solution
03/16/2004US6706140 Control system for in-situ feeding back a polish profile
03/16/2004US6705928 Through-pad slurry delivery for chemical-mechanical polish
03/11/2004US20040048555 Apparatus for processing a lens and process for processing a lens
03/11/2004US20040048550 Modular method for chemical mechanical planarization
03/10/2004CN1141202C Retaining device for grinded basilar plate
03/04/2004WO2002053320A9 Wafer support for chemical mechanical planarization
03/04/2004US20040043709 Process for machining a wafer-like workpiece
03/04/2004US20040043708 Grinding apparatus with splash protector and improved fluid delivery system
03/03/2004CN1479665A Actived slurry chemical mechanical planarization system and method for implenting the same
02/2004
02/25/2004EP1390184A1 Method for treating an exhausted glycol-based slurry
02/19/2004WO2004014607A1 A method of polishing a wafer of material
02/18/2004EP1389506A1 Automatic metallographic polishing apparatus
02/18/2004EP1389152A1 Delivery system for magnetorheological fluid
02/18/2004CN1139106C Equipment and method for transporting substrate mechanical polishing and grinding suspension
02/17/2004US6692339 Combined chemical mechanical planarization and cleaning
02/12/2004DE10235017A1 Vorrichtung zum Polieren von digitalen Speicherscheiben An apparatus for polishing digital storage discs
02/12/2004DE10010287B4 Verfahren zur Herstellung von flüssigen Gemischen für das chemisch-mechanische Polieren von Wafern Process for the preparation of liquid mixtures for chemical mechanical polishing of wafers
02/10/2004US6688953 Barrel polishing apparatus
02/05/2004WO2003068405A3 Granular material recovery system
02/05/2004US20040023605 Device for polishing digital storage discs
02/03/2004US6685796 CMP uniformity
02/03/2004US6685543 Compensating chemical mechanical wafer polishing apparatus and method
01/2004
01/29/2004US20040018801 Lens stocking device and lens processing system having the same
01/28/2004EP1250390B1 Composition and method for planarizing surfaces
01/28/2004EP1234009B1 Composition and method for planarizing surfaces
01/27/2004US6682409 Wafer carrier structure for chemical-mechanical polisher
01/27/2004US6681850 Flow completion system
01/22/2004WO2003034804A3 Preparation of high performance silica slurry using a centrifuge
01/22/2004WO2003022519A3 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
01/22/2004US20040014403 CMP point of use filtration
01/22/2004US20040014319 Prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
01/22/2004US20040011462 Method and apparatus for applying differential removal rates to a surface of a substrate
01/22/2004DE10230146A1 Verfahren zum Bearbeiten eines scheibenförmigen Werkstückes A method for processing a disk-shaped workpiece
01/21/2004CN1469794A Methods, apparatus and slurries for chemical mechanical planarization
01/21/2004CN1468685A Method for processing disc-shaped workpieces
01/20/2004US6679765 Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
01/20/2004US6679764 Supply system for chemicals and its use
01/15/2004WO2002053273A8 Process and apparatus for blending and distributing a slurry solution
01/15/2004US20040007592 Precision liquid mixing apparatus and method
01/13/2004US6676496 Apparatus for processing semiconductor wafers
01/08/2004WO2004003987A1 Contamination remover
01/08/2004WO2004003986A1 Method and apparatus for applying differential removal rates to a surface of a substrate
01/08/2004US20040005845 Polishing method and apparatus
01/07/2004CN1133510C Regenerating treater for waste liquid of inorganic abradant
01/06/2004US6672946 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
01/06/2004US6672940 Surface polishing slurry cooling system
01/02/2004EP1375065A1 Lens stocking device and lens processing system having the same
01/01/2004US20040002292 Polishing apparatus, polishing method and method of manufacturing semiconductor device
01/01/2004US20040002171 Method and apparatus for real time metal film thickness measurement
12/2003
12/30/2003US6669536 Method of making optical fluoride laser crystal components
12/30/2003US6669534 Surface treatment of oxidizing materials
12/25/2003US20030236056 Polishing station of a chemical mechanical polishing apparatus
12/24/2003WO2003107408A1 Polisher
12/23/2003US6666748 Machining center and method of changing tools thereof
12/17/2003EP1370392A1 Random-orbit head with lock-up feature
12/17/2003CN1462064A Chemical-mechanical machine for grinding chip material, and abrasive material supply equipment installed on the machine
12/16/2003US6663474 Apparatus and system of chemical mechanical polishing
12/16/2003US6663472 Multiple step CMP polishing
12/11/2003US20030228830 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device
12/11/2003US20030226378 Slurry for and method of texturing surface of glass substrate
12/10/2003CN1460574A Slurry cyclic method
12/09/2003US6659849 Platen with debris control for chemical mechanical planarization
12/09/2003US6659848 Slurry dispenser that outputs a filtered slurry to a chemical-mechanical polisher at a constant flow rate over the lifetime of the filter
12/09/2003US6659634 Chemical solution feeding apparatus and method for preparing slurry
12/04/2003US20030224706 Foam buffing/polishing pad
12/03/2003EP1366859A1 Polishing apparatus and method
12/03/2003EP1366856A2 Apparatus for processing a lens and a process for processing a lens
12/02/2003US6657726 In situ measurement of slurry distribution
12/02/2003US6656359 Slurry effluent agglomerated grains are crushed using a mill, ultrasonic oscillation, or pressurized circulation
12/02/2003US6656020 Polishing apparatus and polishing method
12/02/2003US6655455 Flow completion system
11/2003
11/27/2003US20030220055 Slurry recycling method
11/27/2003US20030217518 Abrasive, a method of polishing with the abrasive, and a method of washing a polished object
11/25/2003US6652366 Dynamic slurry distribution control for CMP
11/25/2003US6652365 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/25/2003US6652364 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/20/2003US20030216112 Cleaning device and method for cleaning polishing cloths used for polishing semiconductor wafers
11/20/2003US20030213558 Chemical mechanical polishing endpoint detection
11/18/2003US6648738 Grinding fluid supply device of lens grinding apparatus
11/18/2003US6648736 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/13/2003US20030211743 Method for avoiding slurry sedimentation in CMP slurry delivery systems
11/13/2003US20030209523 Planarization by chemical polishing for ULSI applications
11/06/2003US20030207656 Slurry homogenizer and supply system
11/06/2003US20030207654 Polishing device and polishing method for semiconductor wafer
11/06/2003US20030207582 Use of low-high slurry flow to eliminate copper line damages
11/06/2003US20030205484 Electrochemical/ mechanical polishing
11/05/2003EP1358045A1 Pressure vessel systems and methods for dispensing liquid chemical compositions
11/04/2003US6641631 Controlling pH of an aqueous polishing composition having abrasive particles of a metal oxide that provides ions upon dissolution; equilibrium concentration of said ions at said pH, which avoids drift of said pH
11/04/2003US6641468 Slurry distributor
11/04/2003US6641462 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
10/2003
10/30/2003WO2002018101A9 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
10/28/2003US6638148 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
10/23/2003US20030199229 Flexible polishing fluid delivery system
10/23/2003US20030199227 Methods of preparing semiconductor workpiece process fluid and semiconductor workpiece processing methods
10/22/2003EP1210395B1 Compositions for insulator and metal cmp and methods relating thereto
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