Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
08/2005
08/31/2005EP1550152A4 Method and apparatus for applying differential removal rates to a surface of a substrate
08/25/2005US20050186891 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
08/25/2005US20050185180 Semiconductor processor control systems
08/17/2005EP1390184B1 Method for treating an exhausted glycol-based slurry
08/17/2005EP1141154B1 Polishing composition and method
08/16/2005US6929537 Slurry recycling method
08/16/2005US6929533 Methods for enhancing within-wafer CMP uniformity
08/16/2005US6929532 Method and apparatus for filtering a chemical polishing slurry of a wafer fabrication process
08/11/2005WO2005072338A2 Multi-step pad conditioningh system and method for chemical planarization
08/11/2005US20050177273 Material supply system in semiconductor device manufacturing plant
08/11/2005US20050176351 System, method, and apparatus for non-traditional kinematics/tooling for efficient charging of lapping plates
08/10/2005EP1561557A1 Method for treating an exhausted glycol-based slurry
08/09/2005US6926587 CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method
08/09/2005US6926584 Dual mode hybrid control and method for CMP slurry
08/04/2005WO2005069951A2 Scratch removal tool and system
08/04/2005US20050170761 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
08/04/2005US20050170758 Scratch removal tool and system
08/03/2005CN1650400A Material supply system in semiconductor device manufacturing plant
07/2005
07/28/2005US20050164603 Pivotable slurry arm
07/27/2005CN1644317A Polishing apparatus and method of polishing work piece
07/19/2005US6918824 Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device
07/14/2005US20050153632 Methods of preparing semiconductor workpiece process fluid
07/14/2005US20050153560 Performing first and second polishing steps, polishing mixtures used in first and second steps include ceria abrasives of different grain concentrations; polishing rate being changed between steps; dishing is prevented
07/13/2005CN1638920A 流体混合装置及切削装置 Fluid mixing device and cutting device
07/13/2005CN1210767C Chemical solution conveying device and method for preparing suspension liquid
07/07/2005US20050148187 Chemical mechanical polishing systems and methods for their use
07/06/2005EP1550152A1 Method and apparatus for applying differential removal rates to a surface of a substrate
07/06/2005EP1549465A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization
07/06/2005EP1349700A4 Method of making optical fluoride laser crystal components
07/06/2005CN1634682A Grinding liquid reusing device and system thereof
07/06/2005CN1209436C Polishing composition and magnetic recording disk substrate polished with polishing composition
07/06/2005CN1209430C Chemical mechanical polishing systems and methods for their use
07/05/2005US6914001 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide
07/05/2005US6913523 Method for controlling pH during planarization and cleaning of microelectronic substrates
07/05/2005US6913510 Lens stocking device and lens processing system having the same
06/2005
06/30/2005WO2004084287A9 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
06/30/2005US20050142883 Apparatus and method for supplying chemicals
06/30/2005DE10392232T5 Fluidmischvorrichtung und Schneidvorrichtung Fluid mixing device and cutting device
06/29/2005EP1545835A2 Flow control system
06/28/2005US6910954 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
06/23/2005US20050133923 Semiconductor device and method for manufacturing the same
06/22/2005CN1207374C Grinding oil composition for polishing
06/16/2005US20050130566 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
06/15/2005CN1206081C Method for processing disc-shaped workpieces
06/14/2005CA2249965C Slurry mixing apparatus and method
06/08/2005EP1536920A1 Novel finishing pad design for multidirectional use
06/08/2005EP1536918A1 A method of polishing a wafer of material
06/08/2005EP1278936B1 Tubing hanger with annulus bore
06/07/2005US6902467 Apparatus for processing a lens and process for processing a lens
05/2005
05/31/2005US6899609 CMP equipment for use in planarizing a semiconductor wafer
05/31/2005US6899601 Method and apparatus for conditioning a polishing pad
05/31/2005US6899116 Pressure vessel systems and methods for dispensing liquid chemical compositions
05/26/2005US20050113007 Polishing apparatus and method of polishing work piece
05/26/2005US20050113001 Semiconductor device fabrication method and apparatus
05/25/2005EP1533077A1 Polishing apparatus and method of polishing work piece
05/25/2005EP1533075A1 Polishing pad having slurry utilization enhancing grooves
05/25/2005CN1620639A System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
05/24/2005US6896601 Grinding apparatus with splash protector and improved fluid delivery system
05/24/2005US6896600 Liquid dispense manifold for chemical-mechanical polisher
05/24/2005US6895776 Anti-stratification-solution delivery system for spin-on dielectrics
05/19/2005US20050107016 Polishing equipment, and method of manufacturing semiconductor device using the equipment
05/19/2005US20050107010 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
05/19/2005US20050107009 Polishing pad having slurry utilization enhancing grooves
05/19/2005US20050107003 Ultra fine particle film forming method and apparatus
05/18/2005CN1617308A Polishing pad having slurry utilization enhancing grooves
05/17/2005US6893322 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid
05/17/2005US6893321 Modular fluid-dispensing system
05/12/2005US20050101223 Chemical mechanical polishing slurry pump monitoring system and method
05/11/2005CN1200796C Slurry cyclic method
05/06/2005WO2005039824A1 Multi-wire saw
05/05/2005US20050095963 Chemical mechanical polishing system
05/05/2005US20050092620 Incrementally introducing abrasive particles; accurate removal of conductive barrier material; reduced defects
05/05/2005US20050092434 Dynamic polishing fluid delivery system for a rotational polishing apparatus
05/03/2005US6887132 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
04/2005
04/27/2005CN1608803A Automatic fluid-supplying polishing machine
04/27/2005CN1608802A Two-site polishing machine
04/27/2005CN1199243C Method for making semiconductor device
04/26/2005US6884152 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
04/26/2005US6884145 High selectivity slurry delivery system
04/21/2005US20050082165 Electro-chemical machining apparatus
04/21/2005DE202005002637U1 Vorrichtung zur Nachbearbeitung von Kantenstreifen an plattenförmigen Werkstücken A device for post-processing of edging strips to plate-shaped workpieces
04/19/2005US6881132 Grinding water tank unit for use in processing eyeglass lens, device for separating processing debris, and eyeglass lens processing apparatus having the tank unit or device
04/19/2005US6880727 Precision liquid mixing apparatus and method
04/14/2005WO2005032764A1 System, method and apparatus for applying liquid to a cmp polishing pad
04/14/2005US20050079801 Methods for enhancing within-wafer CMP uniformity
04/13/2005CN1196760C Method for polishing or planarizing substrate
04/12/2005US6878037 Slurry pump control system
04/07/2005US20050075052 Method and system for planarizing integrated circuit material
04/07/2005US20050072528 Integration of sensor based metrology into semiconductor processing tools
04/06/2005CN1604834A Abrasive article for the deposition and polishing of a conductive material
04/05/2005US6874929 Apparatus and method for supplying chemicals
03/2005
03/31/2005US20050070214 Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device
03/31/2005US20050070212 System, method and apparatus for applying liquid to a cmp polishing pad
03/30/2005EP1237691B1 Method for separating a machining suspension into fractions
03/30/2005EP1218465B1 Polishing system with stopping compound and method of its use
03/29/2005US6872328 Method of polishing or planarizing a substrate
03/29/2005US6872280 Slurry collection device and method
03/29/2005US6872262 State of the art constant flow device
03/29/2005US6872128 System, method and apparatus for applying liquid to a CMP polishing pad
03/24/2005WO2004112091A3 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
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