| Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579) |
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| 09/28/2004 | US6796885 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therfor |
| 09/28/2004 | US6796703 Conductivity feedback control system for slurry bending |
| 09/23/2004 | US20040184890 Fluid transport system with vibrators |
| 09/21/2004 | US6794289 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/16/2004 | WO2004078412A2 Grinding apparatus with splash protector and improved fluid delivery system |
| 09/16/2004 | WO2004078410A2 Agent for increasing selection ratio of polishing rates |
| 09/16/2004 | DE10308064A1 Mechanism for chemo-mechanical polishing (CMP) of semiconductor wafers with polishing medium specified supply, polishing plate and polishing head, which presses wafer onto plate, with supply appliance for polishing medium |
| 09/14/2004 | US6790769 CMP slurry and method of manufacturing semiconductor device |
| 09/14/2004 | US6790128 Fluid conserving platen for optimizing edge polishing |
| 09/14/2004 | US6790127 Apparatus and method for feeding slurry |
| 09/09/2004 | US20040173307 Apparatus and method for supplying chemicals in chemical mechanical polishing systems |
| 09/08/2004 | CN1165408C Fluid dispensing fixed abrasive polishing pad |
| 09/01/2004 | CN2637099Y Liquid feed filter |
| 08/31/2004 | US6783448 Foam buffing/polishing pad |
| 08/31/2004 | US6783446 Chemical mechanical polishing apparatus and method of chemical mechanical polishing |
| 08/31/2004 | US6783433 Polishing-washing method |
| 08/26/2004 | WO2004073055A1 Method for simulating slurry flow for a grooved polishing pad |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | US20040166686 Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
| 08/25/2004 | CN1523461A Automatic control device and method for grinding slurry feed arm |
| 08/19/2004 | US20040162688 Method for simulating slurry flow for a grooved polishing pad |
| 08/18/2004 | CN1162490C Composition and method for flatting surfaces |
| 08/17/2004 | US6776691 Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus |
| 08/12/2004 | US20040157538 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
| 08/12/2004 | US20040154931 Polishing liquid, polishing method and polishing apparatus |
| 08/12/2004 | DE202004008100U1 Electric-powered industrial injection polishing tool has thumb lever controlled discharge regulation valve for polishing agent |
| 08/05/2004 | WO2004064965A1 Transmitter for wireless control |
| 08/05/2004 | US20040152401 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool |
| 08/05/2004 | US20040152308 heating a rare earth carboxylates with alkoxyalcoholst to form solutions, then adding a silicon alkoxide and activators, mixing with water to form gels and thermal decomposition under slightly reductive atmosphere, to form rare earth element-activated rare earth silicate phosphors |
| 08/05/2004 | US20040149592 Electropolishing apparatus and polishing method |
| 08/04/2004 | EP1261453B1 Polishing method for soft acrylic articles |
| 08/04/2004 | CN1160430C Composition and method for planarizing surfaces |
| 08/03/2004 | US6769961 Chemical mechanical planarization (CMP) apparatus |
| 08/03/2004 | US6769960 System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| 08/03/2004 | US6769959 Method and system for slurry usage reduction in chemical mechanical polishing |
| 07/29/2004 | US20040147123 Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| 07/29/2004 | US20040144722 Separating the exhausted slurry into a first liquid fraction and a first solids fraction, mixing the first solids fraction with a first etchant to form a first solid/etchant mixture in which silicon particulate and metal particulate is dissolved |
| 07/27/2004 | US6767124 Slurry mixing feeder and slurry mixing and feeding method |
| 07/22/2004 | WO2004060609A1 Modular method for chemical mechanical planarization |
| 07/22/2004 | US20040142636 Slurry pump control system |
| 07/21/2004 | EP1439030A1 Process for processing a lens |
| 07/15/2004 | WO2004058450A1 Method for producing glass substrate for information recording medium, polishing apparatus and glass substrate for information recording medium |
| 07/13/2004 | US6761620 Finishing pad design for multidirectional use |
| 07/08/2004 | WO2004056532A1 A system and a method for polishing optical connectors |
| 07/08/2004 | US20040132386 Apparatus and method for feeding slurry |
| 07/07/2004 | CN1510722A Grinding method and producing method for semiconductor device, and grinder |
| 07/01/2004 | US20040127148 Polishing method for semiconductor device, method for fabricating semiconductor device and polishing system |
| 07/01/2004 | US20040127143 Apparatus and methods for slurry flow control |
| 06/24/2004 | US20040121710 Method and apparatus for conditioning a polishing pad |
| 06/17/2004 | US20040116048 Ultra fine particle film forming method and apparatus |
| 06/15/2004 | US6750145 Method of eliminating agglomerate particles in a polishing slurry |
| 06/08/2004 | US6746316 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 06/08/2004 | US6746314 Nitride CMP slurry having selectivity to nitride |
| 06/03/2004 | US20040106355 High selectivity slurry delivery system |
| 06/03/2004 | US20040104200 Methods for finishing microelectronic device packages |
| 06/01/2004 | US6743081 In-line oscillating device |
| 06/01/2004 | US6743078 Methods, apparatus and slurries for chemical mechanical planarization |
| 05/26/2004 | CN1498724A Lapping machine and method of grinding workpiece |
| 05/25/2004 | US6740629 Comprises a component for rendering a water-insoluble compound containing a metal atom or its ion separated from a surface to be polished water-soluble |
| 05/25/2004 | US6739944 System for real-time control of semiconductor wafer polishing |
| 05/19/2004 | CN1150600C Uniformity for improving chemical-mechanically polishing |
| 05/18/2004 | US6736154 Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 05/12/2004 | CN1494982A Base plate lapping device and method |
| 05/11/2004 | US6733368 Method for lapping a wafer |
| 05/06/2004 | WO2004037937A1 A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| 05/06/2004 | US20040087257 CMP equipment for use in planarizing a semiconductor wafer |
| 05/04/2004 | US6732017 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
| 04/29/2004 | WO2003022519A9 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 04/29/2004 | US20040082273 Abrasive machine and method of abrading work piece |
| 04/29/2004 | DE10296958T5 Verfahren zur Herstellung von lichtdurchlässigen, optischen Fluorkristallen Process for the preparation of light-transmitting, optical fluorine crystals |
| 04/28/2004 | EP1413396A1 Abrasive machine and method of abrading work piece |
| 04/27/2004 | US6726550 Polishing apparatus |
| 04/22/2004 | US20040077297 Polishing apparatus and polishing method |
| 04/22/2004 | US20040074636 Flow completion system |
| 04/20/2004 | US6722958 Apparatus and process for recovering abrasive |
| 04/20/2004 | US6722953 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus |
| 04/20/2004 | US6722943 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| 04/15/2004 | WO2004030865A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization |
| 04/15/2004 | WO2004030860A2 Flow control system |
| 04/15/2004 | US20040072503 Dual mode hybrid control and method for CMP slurry |
| 04/15/2004 | US20040069878 Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors |
| 04/15/2004 | DE10245610A1 Verfahren zum selektiven Entfernen von Metallresten von einer dielektrischen Schicht mittels chemischen mechanischen Polierens A method for the selective removal of metal residues from a dielectric layer by chemical mechanical polishing |
| 04/14/2004 | EP0990486B1 Polishing solution feeder |
| 04/13/2004 | US6721628 Closed loop concentration control system for chemical mechanical polishing slurry |
| 04/13/2004 | US6720264 Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 04/13/2004 | US6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper |
| 04/13/2004 | US6719823 Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces |
| 04/13/2004 | US6719617 Slurry homogenizer and supply system |
| 04/07/2004 | CN1487868A Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 04/06/2004 | US6716802 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 04/06/2004 | US6716755 Composition and method for planarizing surfaces |
| 04/06/2004 | US6716090 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 04/06/2004 | US6716089 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/01/2004 | US20040063387 Through-pad slurry delivery for chemical-mechanical polish |
| 04/01/2004 | US20040063318 Method of selectively removing metal residues from a dielectric layer by chemical mechanical polishing |
| 04/01/2004 | US20040060607 Flow control system |
| 03/31/2004 | EP1234010B1 Use of cesium hydroxide in a dielectric cmp slurry |
| 03/30/2004 | US6712678 Polishing-product discharging device and polishing device |
| 03/30/2004 | US6712676 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 03/25/2004 | WO2004024391A1 Novel finishing pad design for multidirectional use |