| Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579) |
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| 05/15/2002 | CN1349446A Method of conditioning wafer polishing pads |
| 05/14/2002 | US6387812 Ultrasonic processing of chemical mechanical polishing slurries |
| 05/14/2002 | US6387289 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 05/14/2002 | US6386960 Chemical-mechanical polishing method and apparatus |
| 05/09/2002 | US20020055323 Methods, apparatus and slurries for chemical mechanical planarization |
| 05/07/2002 | US6383060 Method of polishing silicon wafer |
| 05/07/2002 | CA2220820C Barrel polishing apparatus |
| 05/02/2002 | US20020052175 Pressurized delivery method for abrasive particulate material |
| 05/02/2002 | US20020052174 Polishing apparatus, cleaning apparatus to be used for such a polishing apparatus and polishing/cleaning method as well as method of making a wiring section |
| 05/02/2002 | US20020052115 Method of eliminating agglomerate particles in a polishing slurry |
| 04/30/2002 | US6379538 Apparatus for separation and recovery of liquid and slurry abrasives used for polishing |
| 04/30/2002 | US6379406 Water polish mixture, abrasive particles of metal oxide for ions |
| 04/30/2002 | US6379235 Wafer support for chemical mechanical planarization |
| 04/25/2002 | US20020049025 Method of abrading silicon substrate |
| 04/25/2002 | US20020048214 Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration |
| 04/23/2002 | US6375551 Angstrom polishing of calcium fluoride optical VUV microlithography lens elements and preforms |
| 04/23/2002 | US6375550 Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer |
| 04/23/2002 | CA2248910C Dispensing system and method for dispensing an aqueous solution |
| 04/18/2002 | WO2002030618A1 Activated slurry cmp system and methods for implementing the same |
| 04/18/2002 | US20020045412 Method for supplying slurry to polishing apparatus |
| 04/18/2002 | US20020045405 Method of forming ink fill slot of ink-jet printhead |
| 04/18/2002 | US20020045349 Method for chemical-mechanical-polishing a substrate |
| 04/17/2002 | EP1197293A1 Polishing device and method |
| 04/09/2002 | US6368512 Process for the filtration and drying of solid particles out of liquids |
| 04/09/2002 | US6368194 Apparatus for controlling PH during planarization and cleaning of microelectronic substrates |
| 04/04/2002 | WO2002026444A1 Wafer carrier for cmp system |
| 04/04/2002 | US20020039878 Apparatus and method for feeding slurry |
| 04/04/2002 | DE10045258A1 Rollenkäfig für eine Festwalzrolle Roll cage for a fixed roller |
| 04/02/2002 | US6364744 CMP system and slurry for polishing semiconductor wafers and related method |
| 03/28/2002 | US20020037692 Clogging-free drain system installed in a cutting apparatus |
| 03/28/2002 | US20020037682 Polishing or grinding method, processing method of optical element, processing method of fluorite, polishing or grinding apparatus, polishing and/or grinding apparatus for optical element, apparatus for processing surface of optical element, and lens |
| 03/27/2002 | EP1190455A2 Dual cmp pad conditioner |
| 03/26/2002 | US6361409 Polymeric polishing pad having improved surface layer and method of making same |
| 03/26/2002 | US6361202 Static mixer for a viscous liquid |
| 03/21/2002 | WO2002022284A1 Roller cage for a hard-rolling roller |
| 03/21/2002 | US20020034922 System for real-time control of semiconductor wafer polishing |
| 03/21/2002 | US20020034122 Conductivity feedback control system for slurry blending |
| 03/19/2002 | US6358125 Polishing liquid supply apparatus |
| 03/14/2002 | US20020029600 Roller cage for a deep rolling work roller |
| 03/12/2002 | US6355184 Method of eliminating agglomerate particles in a polishing slurry |
| 03/12/2002 | US6354921 System for cross stream regassifier for improved chemical mechanical polishing in the manufacture of semiconductors |
| 03/12/2002 | US6354917 Method of processing a wafer utilizing a processing slurry |
| 03/07/2002 | WO2002018101A2 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
| 03/07/2002 | US20020028628 Machining center and method of changing tools thereof |
| 03/06/2002 | EP1184134A2 Machining center with dressing tool |
| 03/05/2002 | US6352469 Polishing apparatus with slurry screening |
| 02/27/2002 | CN1337898A Fluid dispensing fixed abrasive polishing pad |
| 02/26/2002 | US6350393 Use of CsOH in a dielectric CMP slurry |
| 02/21/2002 | WO2002014015A1 Retaining ring for chemical-mechanical polishing head, polishing apparatus, slurry cycle system, and method |
| 02/21/2002 | US20020022441 Slurry supply apparatus and method |
| 02/21/2002 | US20020022440 Supply of controlled amount of polishing slurry to semiconductor wafers |
| 02/21/2002 | US20020020714 Precision liquid mixing apparatus and method |
| 02/21/2002 | US20020020690 Dewatered CMP polishing compostions and methods for using same |
| 02/21/2002 | US20020020495 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 02/20/2002 | EP1180068A2 Method and device for rounding edges |
| 02/14/2002 | WO2001064354A3 Method for repairing and lustering defects on hydrophilic coat surface |
| 02/14/2002 | US20020019197 Method and apparatus for controlling pH during planarization and cleaning of microelectronic substrates |
| 02/14/2002 | US20020017063 Polycrystalline diamond powder and at least one additive of: oxidizing agents, complex-forming agents, surfactants and organic bases; planarizing precious metals for use as electrode and barrier material in intergrated circuits |
| 02/12/2002 | US6346032 Fluid dispensing fixed abrasive polishing pad |
| 02/12/2002 | US6346031 Method of metering fluid polishing agents and metering apparatus for same |
| 02/07/2002 | US20020016131 System for real-time control of semiconductor wafer polishing |
| 02/07/2002 | US20020016066 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 02/07/2002 | US20020014448 Grinding slurry recycling apparatus |
| 02/06/2002 | CN1078835C Buffing method and buffing apparatus |
| 01/30/2002 | EP1175964A2 Polishing surface temperature conditioning system for a chemical mechanical planarization process |
| 01/22/2002 | US6340327 Wafer polishing apparatus and process |
| 01/17/2002 | WO2000060645A3 Dual cmp pad conditioner |
| 01/17/2002 | US20020005504 Ta barrier slurry containing an organic additive |
| 01/16/2002 | EP1171264A1 Method of conditioning wafer polishing pads |
| 01/15/2002 | US6338671 Apparatus for supplying polishing liquid |
| 01/15/2002 | US6338670 Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices |
| 01/15/2002 | US6338669 Polishing device |
| 01/15/2002 | US6338667 System for real-time control of semiconductor wafer polishing |
| 01/10/2002 | US20020002798 CMP polishing slurry dewatering and reconstitution |
| 01/08/2002 | US6336850 Slurry dispenser and polishing apparatus |
| 01/03/2002 | WO2002001618A1 Slurry recycling system and method for cmp apparatus |
| 01/03/2002 | WO2001041973A3 Chemical-mechanical polishing method |
| 01/03/2002 | US20020001956 Method for supplying slurry to a semiconductor processing machine |
| 01/03/2002 | US20020000322 Flow completion system |
| 01/03/2002 | US20020000315 Flow completion apparatus |
| 12/27/2001 | WO2000062977A9 Method of conditioning wafer polishing pads |
| 12/27/2001 | US20010055942 Polishing method using a reconstituted dry particulate polishing composition |
| 12/25/2001 | US6332835 Polishing apparatus with transfer arm for moving polished object without drying it |
| 12/20/2001 | DE10027303A1 Verfahren und Vorrichtung zum Schleifen der Kanten von plattenförmigen Werkstücken Method and apparatus for grinding the edges of plate-shaped workpieces |
| 12/18/2001 | US6331136 CMP pad conditioner arrangement and method therefor |
| 12/13/2001 | US20010051433 Chemical mechanical polishing using cesium hydroxide |
| 12/13/2001 | US20010050142 Chemical-mechanical polishing apparatus with megasonic energy slurry supply system |
| 12/12/2001 | EP1162033A1 Edge grinding method and apparatus |
| 12/06/2001 | WO2001091974A1 Method and apparatus for conditioning a polish pad and for dispensing slurry |
| 12/06/2001 | WO2001091973A1 Method and apparatus for dispensing slurry at the point of polish |
| 12/06/2001 | US20010047978 Using plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 mu m of semiconductor material is removed; accuracy |
| 12/05/2001 | CN1324906A Polishing liquid for structurizing treatment of metal and metal oxide and method thereof |
| 11/29/2001 | WO2001089767A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 11/29/2001 | DE10024874A1 Polierflüssigkeit und Verfahren zur Strukturierung von Metallen und Metalloxiden Polishing liquid and method for patterning of metals and metal oxides |
| 11/29/2001 | DE10023002A1 Verfahren zur beidseitigen Politur von Halbleiterscheiben und Läuferscheiben zur Durchführung des Verfahrens Method for two-sided polishing of semiconductor wafers and rotor disks for performing the method |
| 11/27/2001 | US6322710 Slurry managing system and slurry managing method |
| 11/22/2001 | WO2001032358A3 Method and device for rounding edges |
| 11/22/2001 | US20010044265 Method and apparatus for supplying chemical-mechanical polishing slurries |
| 11/22/2001 | US20010044264 Polishing composition |
| 11/22/2001 | US20010044260 CMP polishing slurry dewatering and reconstitution |