Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
01/2003
01/29/2003EP1149051B1 Sludge-free treatment of copper cmp wastes
01/28/2003US6511368 Spherical drive assembly for chemical mechanical planarization
01/23/2003WO2002018101A3 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
01/23/2003US20030017791 Grinding water tank unit for use in processing eyeglass lens, device for separating processing debris, and eyeglass lens processing apparatus having the tank unit or device
01/23/2003US20030017784 Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
01/21/2003US6508695 Polishing a semiconductor wafer,
01/16/2003US20030013391 Polishing apparatus
01/16/2003US20030013385 Nitride CMP slurry having selectivity to nitride
01/15/2003EP1274540A1 Polishing method using a rehydrated dry particulate polishing composition
01/15/2003CN1098746C Chemical mechanical polishing apparatus and method of chemical mechanical polishing
01/14/2003US6506098 Self-cleaning slurry arm on a CMP tool
01/09/2003WO2003002302A1 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
01/09/2003US20030008603 Grinding water tank unit for use in processing eyeglass lens, device for separating processing debris, and eyeglass lens processing apparatus having the tank unit or device
01/08/2003EP1273391A1 Eyeglass lens processing apparatus
01/08/2003EP1272311A1 Integrated chemical-mechanical polishing
01/08/2003CN1390248A Composition and method for planarizing surfaces
01/07/2003US6503418 Ta barrier slurry containing an organic additive
01/07/2003US6503129 Activated slurry CMP system and methods for implementing the same
01/03/2003WO2003000460A1 Method of making light transmitting optical fluoride crystals
01/02/2003US20030004085 Comprises a component for rendering a water-insoluble compound containing a metal atom or its ion separated from a surface to be polished water-soluble
01/02/2003US20030003857 Polishing pad, and method and apparatus for polishing
01/02/2003US20030003851 Method and apparatus for recycling slurry
01/02/2003US20030003850 Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
01/02/2003US20030003747 Slurry of ceric ammonium nitrate ((NH4)2Ce(NO3)6) providing improved polishing speed under low pressure in one step; deposited as a barrier film for a capacitor using barium strontium titanate as a dielectric layer; semiconductors
01/02/2003EP1268681A2 Method for repairing and lustering defects on hydrophilic coat surface
01/02/2003EP1268132A1 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
12/2002
12/31/2002US6500058 Clogging-free drain system installed in a cutting apparatus
12/31/2002US6500049 Lapping oil composition for finish-grinding
12/27/2002WO2002102919A1 Polishing slurry for use in texturing surface of glass substrate and method
12/27/2002WO2001074537A9 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
12/26/2002US20020197937 Method to increase removal rate of oxide using fixed-abrasive
12/25/2002CN1387556A Use of CsOH in dielectric CMP slurry
12/19/2002US20020193051 Apparatus and method for producing substrate with electrical wire thereon
12/19/2002US20020189813 Flow completion system
12/18/2002EP1266956A1 Composition for washing a polishing pad and method for washing a polishing pad
12/17/2002US6494257 Flow completion system
12/12/2002US20020187735 Polishing apparatus
12/12/2002US20020187731 In-situ pad and wafer cleaning during chemical mechanical polishing
12/12/2002US20020187728 Polishing device and method
12/12/2002US20020186613 Apparatus and method for supplying chemicals
12/12/2002US20020185628 Composition and method of formation and use therefor in chemical-mechanical polishing
12/11/2002EP1263906A1 Polishing composition
12/11/2002CN1384860A Ta barrier slurry containing organic additive
12/11/2002CN1384061A Abrasive recovering apparatus
12/05/2002WO2002096611A1 Method for treating an exhausted glycol-based slurry
12/05/2002US20020182868 Reduction of surface roughness during chemical mechanical planarization (CMP)
12/04/2002EP1261453A1 Polishing method for soft acrylic articles
12/03/2002US6488566 System for real-time control of semiconductor wafer polishing
12/03/2002US6488039 State of the art constant flow device
11/2002
11/28/2002WO2002094503A1 Delivery system for magnetorheological fluid
11/28/2002US20020177392 Delivery system for magnetorheological fluid
11/26/2002US6485355 Method to increase removal rate of oxide using fixed-abrasive
11/21/2002US20020173253 Wafer carrier structure for chemical-mechanical polisher
11/21/2002US20020173249 Dynamic slurry distribution control for cmp
11/21/2002US20020173239 Polishing-washing method
11/21/2002US20020173233 Modular controlled platen preparation system and method
11/21/2002US20020173232 Multizone slurry delivery for chemical mechanical polishing tool
11/20/2002EP1257511A1 FUSED Al 2?O 3?-RARE EARTH OXIDE EUTECTIC ABRASIVE PARTICLES, ABRASIVE ARTICLES, AND METHODS OF MAKING AND USING THE SAME
11/19/2002US6482325 Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing
11/19/2002US6482290 Sweeping slurry dispenser for chemical mechanical polishing
11/14/2002WO2002089951A1 Process for regenerating a filtration cartridge for filtering a slurry
11/14/2002US20020168926 Apparatus and process for recovering abrasive
11/13/2002CN1379803A Improved CMP products
11/06/2002EP0790101B1 Shape control method and nc machine using the method
11/05/2002US6475071 Cross flow slurry filtration apparatus and method
11/05/2002US6475066 Random-orbit head with concentric lock-up feature
10/2002
10/31/2002US20020160698 Electro-chemical machining apparatus
10/30/2002EP1252651A2 Chemical-mechanical polishing method
10/30/2002EP1252248A1 Polishing compositions for noble metals
10/30/2002EP1252247A1 Polishing compositions for semiconductor substrates
10/24/2002US20020155720 Fluid flow variations; rotation; calibration
10/24/2002US20020155650 Reducing defects by polishing with aqueous solvents
10/23/2002EP1250982A2 Polishing-washing method
10/23/2002EP1250390A1 Composition and method for planarizing surfaces
10/22/2002US6468134 Method and apparatus for slurry distribution
10/17/2002US20020151259 Polishing apparatus
10/17/2002DE10160174A1 Chemical/mechanical polishing slurry, used in producing shallow trench insulation in silicon wafer with oxide and nitride coatings, comprises abrasive particles in aqueous solution containing two different passivating agents
10/16/2002CN1092544C Apparatus for dispensing slurry
10/15/2002US6464741 CMP polishing slurry dewatering and reconstitution
10/15/2002US6464566 Apparatus and method for linearly planarizing a surface of a semiconductor wafer
10/15/2002US6464564 System for real-time control of semiconductor wafer polishing
10/15/2002US6464562 System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
10/15/2002US6464561 System for real-time control of semiconductor wafer polishing
10/15/2002US6464560 System for real-time control of semiconductor wafer polishing
10/10/2002US20020146908 Apparatus and process for polishing a workpiece
10/10/2002US20020146907 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/09/2002EP1246879A1 A ta barrier slurry containing an organic additive
10/08/2002US6461230 Chemical-mechanical polishing method
10/03/2002WO2002060643A3 Spherical drive assembly for chemical mechanical planarization
10/03/2002US20020142708 Method and apparatus for polishing an aluminum vehicle wheel
10/01/2002US6458020 Slurry recirculation in chemical mechanical polishing
10/01/2002US6458012 Polishing apparatus
10/01/2002US6457852 Apparatus and method for supplying chemicals
09/2002
09/25/2002EP1242557A1 Method of polishing or planarizing a substrate
09/24/2002US6454637 Edge instability suppressing device and system
09/24/2002US6454636 Method and apparatus for supplying coolant in a grinding machine
09/19/2002WO2002053273A3 Process and apparatus for blending and distributing a slurry solution
09/19/2002US20020132567 Apparatus and system of chemical mechanical polishing
09/18/2002CN1370209A Polishing system with stopping compound and method of its use
09/18/2002CN1370208A Chemical mechanical polishing systems and methods for their use
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