Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
06/2003
06/04/2003CN1421299A Scroll saw and its cutting method
06/03/2003US6572731 Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMP
06/03/2003US6572453 Multi-fluid polishing process
06/03/2003US6572449 Dewatered CMP polishing compositions and methods for using same
06/03/2003US6572445 Multizone slurry delivery for chemical mechanical polishing tool
05/2003
05/29/2003US20030100455 Aqueous grinding fluid for wire-sawing or band-sawing
05/29/2003US20030100253 In-line oscillating device
05/29/2003US20030100247 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
05/29/2003US20030100196 Compensating chemical mechanical wafer polishing apparatus and method
05/29/2003US20030100186 CMP slurry and method of manufacturing semiconductor device
05/29/2003US20030100144 Process for chemically mechanically polishing wafers
05/22/2003US20030096559 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
05/22/2003US20030095894 Suctioning the fluid through gel film to filter out the objects; micro-particles can be removed by keeping suction pressure weak to keep rate fixed and to maintain capacity while delaying clogging of second filter
05/20/2003US6565619 Mixture of colloidal silica, acid and water
05/20/2003US6565422 Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
05/15/2003WO2002053490A3 Method of making optical fluoride laser crystal components
05/15/2003US20030089456 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
05/14/2003EP1309422A1 Retaining ring for chemical-mechanical polishing head, polishing apparatus, slurry cycle system, and method
05/14/2003CN1417130A Elimination method of eliminated article
05/13/2003US6561878 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
05/13/2003US6561875 Apparatus and method for producing substrate with electrical wire thereon
05/08/2003US20030087590 Method of planarization
05/06/2003US6558238 Apparatus and method for reclamation of used polishing slurry
05/02/2003EP1305139A2 Fluid dispensing fixed abrasive polishing pad
05/01/2003WO2003034804A2 Preparation of high performance silica slurry using a centrifuge
04/2003
04/29/2003US6554467 Process and apparatus for blending and distributing a slurry solution
04/24/2003US20030077988 Activated slurry CMP system and methods for implementing the same
04/24/2003US20030077906 Manufacturing method of semiconductor device and apparatus thereof
04/23/2003CN1411955A Polishing equipment
04/22/2003US6551174 Supplying slurry to a polishing pad in a chemical mechanical polishing system
04/17/2003WO2003031119A1 Chemical mechanical polishing endpoint detection
04/17/2003US20030073390 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies of planarizing pads
04/17/2003US20030073389 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/17/2003US20030073388 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/17/2003US20030073387 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/17/2003US20030073384 System for real-time control of semiconductor wafer polishing
04/17/2003US20030073319 Chemical mechanical polishing endpoint detection
04/15/2003US6547961 Grinding slurry recycling apparatus
04/15/2003US6547960 Oil separating apparatus for oil containing substance and method therefor
04/15/2003US6547652 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning
04/15/2003US6547646 Method for supplying slurry to a semiconductor processing machine
04/10/2003WO2003030233A1 Method and device for simulation, method and device for polishing, method and device for preparing control parameter or control program, polishing system, recording medium, and method of manufacturing semiconductor device
04/10/2003US20030068964 Polishing apparatus
04/10/2003US20030068963 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
04/10/2003US20030068962 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/10/2003US20030068961 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/10/2003US20030068959 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
04/09/2003EP0746445B1 Glass beveling machine
04/09/2003CN1409749A Method for polishing or planarizing substrate
04/08/2003US6544435 Composition and method of formation and use therefor in chemical-mechanical polishing
04/08/2003US6544109 Slurry delivery and planarization systems
04/02/2003CN1408124A Chemical-mechanical polishing method
04/01/2003US6541135 Seal rings with improved friction and wear properties
04/01/2003US6540935 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
04/01/2003US6540590 Chemical mechanical polishing apparatus and method having a rotating retaining ring
04/01/2003US6540589 Method and device for rounding edges
03/2003
03/27/2003WO2003025996A1 Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/26/2003CN1405850A System for controlling instant-compensuted grinded curved surface
03/25/2003US6537137 Methods for chemical-mechanical polishing of semiconductor wafers
03/20/2003WO2003022519A2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
03/20/2003US20030054734 Preparation of high performance silica slurry using a centrifuge
03/20/2003US20030054648 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/13/2003US20030051035 Control system for in-situ feeding back a polish profile
03/11/2003US6530827 Apparatus for polishing wafer and method of doing the same
03/06/2003WO2003018258A1 Short cmp polish method by maintaining a high ph at the wafer suface
03/06/2003WO2003018256A1 Method and apparatus for chemical mechanical planarization end-o f-polish optimization
03/06/2003US20030045097 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
03/06/2003US20030041877 State of the art constant flow device
03/06/2003DE10137577C1 Ventilmittel für eine Slurry-Auslassöffnung einer Vorrichtung für Chemisch-Mechanisches Polieren Valve means for a slurry outlet port of a device for chemical-mechanical polishing
03/05/2003EP1286808A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices
03/04/2003US6527969 Method and apparatus for rejuvenating polishing slurry
03/04/2003US6527817 Composition and method for planarizing surfaces
03/04/2003US6527625 Chemical mechanical polishing apparatus and method having a soft backed polishing head
03/04/2003US6527624 Carrier head for providing a polishing slurry
02/2003
02/26/2003CN1399668A Composition and method for planarizing surfaces
02/25/2003CA2248386C Liquid dispensing apparatus and method
02/20/2003WO2003013689A1 No drip valve
02/18/2003US6521079 Linear CMP tool design with closed loop slurry distribution
02/18/2003US6520843 High planarity chemical mechanical planarization
02/18/2003US6520834 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
02/13/2003WO2003011523A1 Multiport polishing fluid delivery system
02/13/2003US20030031086 Slurry mixing feeder and slurry mixing and feeding method
02/13/2003US20030029939 No drip valve
02/13/2003US20030029840 Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces
02/11/2003US6518188 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
02/11/2003US6517419 Shaping polishing pad for small head chemical mechanical planarization
02/06/2003US20030027506 Apparatus for distributing a fluid through a polishing pad
02/06/2003US20030027505 Multiport polishing fluid delivery system
02/06/2003US20030024582 Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve
02/04/2003US6514863 Method and apparatus for slurry distribution profile control in chemical-mechanical planarization
02/04/2003US6514424 Using plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 mu m of semiconductor material is removed; accuracy
02/04/2003US6514129 Multi-action chemical mechanical planarization device and method
02/04/2003US6514121 Polishing chemical delivery for small head chemical mechanical planarization
01/2003
01/30/2003US20030022597 Surface treatment of oxidizing materials
01/30/2003US20030022593 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor
01/30/2003US20030022502 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
01/30/2003US20030022499 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
01/29/2003EP1279713A1 Polishing compound and method for preparation thereof, and polishing method
01/29/2003EP1278936A1 Tubing hanger with annulus bore
01/29/2003EP1278935A1 Tubing head seal assembly
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