Patents for B24B 57 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (2,579)
12/1998
12/08/1998US5846398 CMP slurry measurement and control technique
12/03/1998DE19822495A1 Procedure for processing spherical mirror surfaces
12/01/1998US5843269 Slurry dispensing system for chemical-mechanical polishing apparatus
12/01/1998US5842909 System for real-time control of semiconductor wafer polishing including heater
11/1998
11/24/1998US5839951 Separator for blasting apparatus
11/17/1998US5837610 Chemical mechanical polishing (CMP) apparatus and CMP method using the same
11/03/1998US5830369 Reducing the volume of carbon dioxide generated
10/1998
10/29/1998WO1998047661A1 Chemicals supply system and its use
10/22/1998WO1998046395A1 Slurry distribution system that continuously circulates slurry through a distribution loop
10/22/1998DE19715974A1 Versorgungssystem für Chemikalien und dessen Verwendung Supply system for chemicals and the use thereof
10/15/1998WO1998045089A1 Manufacturing method, polishing method and polishing device for semiconductor devices
10/07/1998EP0868260A1 Reclamation of abrasive grain
10/06/1998US5816900 Apparatus for polishing a substrate at radially varying polish rates
09/1998
09/23/1998EP0865874A2 Polishing apparatus and method
09/22/1998US5810964 Chemical mechanical polishing device for a semiconductor wafer
09/08/1998US5804507 Radially oscillating carousel processing system for chemical mechanical polishing
09/08/1998US5803798 Dual column abrading machine
09/08/1998US5803599 Apparatus and method for mixing chemicals to be used in chemical-mechanical polishing procedures
09/01/1998US5800251 Apparatus and method of lapping works
09/01/1998US5800248 Control of chemical-mechanical polishing rate across a substrate surface
09/01/1998US5800246 For switching pressure between multiple pressure tanks in blasting apparatus
08/1998
08/25/1998US5797789 Polishing system
08/11/1998US5791973 Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
08/11/1998US5791970 Slurry recycling system for chemical-mechanical polishing apparatus
07/1998
07/21/1998US5782678 Dual column abrading machine
07/07/1998US5775980 Polishing method and polishing apparatus
06/1998
06/30/1998US5772900 Filter and filtration of fluids with abrasive grains, cutting chips and circulation of fluids for purification
06/24/1998EP0849778A2 Improvements in or relating to wafer polishing
06/24/1998EP0849041A2 Polishing method
06/24/1998EP0849040A2 Method of polishing
06/10/1998CN1184018A Buffing method and buffing apparatus
06/09/1998US5762537 System for real-time control of semiconductor wafer polishing including heater
06/03/1998EP0845327A2 Buffing apparatus and method
05/1998
05/27/1998CA2323335A1 Work polishing method
05/27/1998CA2323328A1 Barrel polishing apparatus
05/26/1998US5755614 Rinse water recycling in CMP apparatus
05/20/1998EP0842737A1 Drainage structure in polishing plant
05/12/1998US5750440 Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
05/12/1998US5749771 Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
05/06/1998EP0839602A1 Unit for polishing bevels on the edges of glass plates, particularly on numeric-control machines
04/1998
04/21/1998US5741173 Method and apparatus for machining semiconductor material
04/14/1998US5738574 Continuous processing system for chemical mechanical polishing
04/14/1998US5738573 Semiconductor wafer polishing apparatus
04/09/1998WO1998014305A1 Methods and apparatus for measuring and dispensing processing solutions to a cmp machine
03/1998
03/25/1998CN1176864A Slurry recycling in CMP apparatus
03/24/1998US5730642 System for real-time control of semiconductor wafer polishing including optical montoring
03/04/1998EP0826459A1 Apparatus and method for chamfering wafer with loose abrasive grains
03/04/1998CN2275497Y Full-automatic ball-feeding machine pushed by soft body
02/1998
02/04/1998EP0822033A1 Slurry recycling in chemical-mechanical polishing (CMP) apparatus
01/1998
01/20/1998US5709593 Apparatus and method for distribution of slurry in a chemical mechanical polishing system
01/13/1998US5707492 Metallized pad polishing process
12/1997
12/23/1997US5700180 System for real-time control of semiconductor wafer polishing
12/09/1997US5695392 Polishing device with improved handling of fluid polishing media
11/1997
11/25/1997US5690544 Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad
11/11/1997US5685947 Chemical-mechanical polishing with an embedded abrasive
10/1997
10/30/1997DE19715460A1 Poliervorrichtung mit verbesserter Führung eines flüssigen Poliermediums Polishing apparatus with improved management of liquid polishing medium
10/21/1997US5679063 Polishing apparatus
10/01/1997EP0798080A1 Lapping apparatus and method
10/01/1997EP0798079A2 Polishing apparatus and polishing method for silicon wafers
09/1997
09/23/1997US5670011 Apparatus and method for polishing workpiece
09/09/1997US5664990 Slurry recycling in CMP apparatus
09/04/1997DE19606739C1 Precision grinding machine for bearing surfaces of middle and lift bearings
08/1997
08/27/1997EP0791385A1 Method for reusing water soluble slurry waste fluid
08/20/1997EP0790101A1 Shape control method and nc machine using the method
08/19/1997US5658185 Chemical-mechanical polishing apparatus with slurry removal system and method
08/19/1997US5658183 System for real-time control of semiconductor wafer polishing including optical monitoring
07/1997
07/30/1997EP0786317A2 System for reusing oily slurry waste fluid
07/29/1997US5651727 Grout removing tool and adapter which employs a water delivery system
07/24/1997WO1997026087A1 Liquid applicator
07/22/1997US5649508 Liquid dispensing side handle apparatus and method
07/15/1997US5647989 Method for recovering abrasive particles
07/08/1997US5645470 Method of honing a knife blade
07/01/1997US5643406 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
07/01/1997US5643060 System for real-time control of semiconductor wafer polishing including heater
06/1997
06/26/1997WO1997022443A1 Reclamation of abrasive grain
06/26/1997WO1997010925A3 Window polisher
06/19/1997DE19546988A1 Semiconductor material treatment with grinding and ultrasonic cleaning
06/18/1997EP0779647A1 Method and apparatus for treatment of semiconductor material
06/05/1997DE19544947A1 Unwinder for at least one strip of emery paper
05/1997
05/21/1997EP0774323A2 Apparatus and method for polishing substrates
05/07/1997EP0771235A1 Apparatus and method for use in chemical-mechanical polishing procedures
03/1997
03/27/1997WO1997010925A2 Window polisher
03/27/1997DE19535397A1 Separating abrasive material and abraded particles produced during machining
03/04/1997US5607718 Polishing method and polishing apparatus
02/1997
02/27/1997WO1997006922A1 Shape control method and nc machine using the method
02/18/1997US5603654 Method for supplying a polishing liquid and polishing method using the same
01/1997
01/22/1997EP0754525A1 Method of and apparatus for dressing polishing cloth
01/21/1997US5595529 Dual column abrading machine
12/1996
12/25/1996CN1138745A Grinding appts. of retaining device basilar plate of grinded basilar plate and grinding method of basilar plate
12/17/1996US5584749 Surface polishing apparatus
12/11/1996EP0746445A1 Glass beveling machine
11/1996
11/26/1996US5578222 Boiling in alkali metal hydroxide
11/19/1996US5575706 Chemical/mechanical planarization (CMP) apparatus and polish method
10/1996
10/16/1996EP0737546A2 Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
10/11/1996CA2173639A1 Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
10/02/1996EP0734883A1 Method for treating surface of an aluminum support for printing plate
09/1996
09/10/1996US5554064 Orbital motion chemical-mechanical polishing apparatus and method of fabrication
08/1996
08/29/1996WO1996013356A3 Glass beveling machine
07/1996
07/30/1996US5540810 Integrated circuit semiconductors with multilayered substrate from slurries
07/24/1996CN1127426A Chemical-mechanical polisher and a process for polishing
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