Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
02/2008
02/20/2008EP1888300A1 Floor sanding machine
02/20/2008CN101125414A Polishing pad with built-in photosensor
02/19/2008US7332438 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
02/19/2008US7331842 Contour follower for tool
02/14/2008WO2008019050A1 System and method for improved hand tool operation
02/14/2008WO2007114964A3 A method for adjusting substrate processing times in a substrate polishing system
02/14/2008US20080038990 Blasting apparatus for outer surface of pipe
02/14/2008US20080038989 Two-side working machine
02/14/2008DE102006037490A1 Doppelseiten-Bearbeitungsmaschine Double sided processing machine
02/13/2008CN101121242A Method for detecting chemical and mechanical flattening endpoint
02/13/2008CN100369210C Polising method and device
02/12/2008US7329169 Apparatus and method for fabricating liquid crystal display panel
02/07/2008US20080032604 Servo Stroking Apparatus and System
02/07/2008US20080032602 Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
02/07/2008US20080032601 System and method for improved hand tool operation
02/07/2008US20080031510 Method of and apparatus for inspecting wafers in chemical mechanical polishing equipment
02/06/2008EP1884325A1 Motor driven appliance and application tool therefor
02/06/2008CN101118866A Method for improving STI-CMP terminal detection
02/06/2008CN101116955A operating parameter self-feedback method for chemical mechanical lapping device and system for controlling the same
02/06/2008CN101116952A Chemical mechanism grinding duration control method
02/06/2008CN100367468C System and method of broad band optical end point detection for film change indication
02/06/2008CN100366386C Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
02/06/2008CN100366385C Grinding device and method for determining thickness of grinded material
02/05/2008US7325324 Method for the in-process dimensional checking of orbitally rotating crankpins
02/05/2008CA2352754C Method and grinding machine for controlling the process during rough grinding of a workpiece
01/2008
01/31/2008US20080026681 Conductive polishing article for electrochemical mechanical polishing
01/31/2008US20080026677 Lapping machine and head device manufacturing method
01/30/2008CN201012467Y Turbine blade numerical-controlled abrasive belt grinding machine
01/30/2008CN201012415Y Digital intelligent feedback thread grinding and compensating gear
01/30/2008CN101113996A Element for detecting the amount of lapping having a resistive film electrically connected to the substrate
01/30/2008CN101112749A Configurable polishing apparatus
01/29/2008US7324184 Indicator for deciding grinding amount of liquid crystal display panel and method for detecting grinding failure using the same
01/29/2008US7322876 Apparatus for preparing a tire surface for application of a patch
01/29/2008US7322875 Sanding machine having malfunction indicating device
01/24/2008US20080020691 Polishing head for a polishing machine
01/24/2008US20080020677 Sanding machine having malfunction indicating device
01/24/2008US20080020676 Run-To-Run Control Of Backside Pressure For CMP Radial Uniformity Optimization Based On Center-To-Edge Model
01/24/2008US20080019013 Lens Made of a Crystalline Material
01/24/2008US20080017521 Process control in electro-chemical mechanical polishing
01/23/2008CN201009153Y Surface polishing device
01/23/2008CN101108471A Method monitoring termination detecting state
01/23/2008CN101108469A On-line monitor control system carrying out ultra-lapping machine with communication technique
01/23/2008CN100364062C Device for two-sided lapping wafer type workpiece simultaneously
01/17/2008US20080014836 Device for Production of a Pre-Formed Shape on a Workpiece by Grinding and Corresponding Method
01/17/2008US20080012556 Element for detecting the amount of lapping having a resistive film electrically connected to the substrate
01/16/2008EP1817137A4 Razor blade sharpener
01/16/2008CN101107097A Substrate polishing method and apparatus
01/16/2008CN100361785C Digitized precise curve grinding integrated control system
01/16/2008CN100361784C Method and apparatus for heating polishing pad
01/16/2008CN100361783C Digital profile grinder
01/15/2008US7318767 Device and method for machine control
01/10/2008WO2008005951A2 Polishing pad with window having multiple portions
01/10/2008WO2008003129A1 Probe emulation and spatial property measurement in machine tools
01/10/2008US20080009227 Optical head for chemical mechanical polishing
01/09/2008CN101100046A Device for detecting interlayer membrane abnormal grinding and its realizing method
01/08/2008US7316600 Metal working method to reduce thermal damage
01/03/2008WO2008002291A1 Stone corner veneer saw apparatus and methods
01/03/2008US20080003936 Polishing pad for eddy current monitoring
01/03/2008US20080003923 Polishing pad with window having multiple portions
01/02/2008EP1872393A1 Device for and method of polishing peripheral edge of semiconductor wafer
01/02/2008EP1872392A1 Substrate processing apparatus
01/01/2008US7314403 Apparatus and method for fabricating liquid crystal display panel
01/01/2008US7314401 Methods and systems for conditioning planarizing pads used in planarizing substrates
12/2007
12/27/2007US20070298694 Wafer polishing head
12/26/2007EP1263547B1 Apparatus and method to measure the dimensional and form deviation of crankpins at the place of grinding
12/26/2007CN200995358Y Semi-online contact manual measuring equipment of planar grinding tool
12/26/2007CN200995353Y Electric controlling system of self-adaptive five-coordinate blade polisher
12/26/2007CN200995352Y Pneumatic controlling system of self-adaptive five-coordinate blade polisher
12/25/2007US7311862 Phase separation to form interpenetrating polymer network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase; binodal or spinodal decomposition; solidifying polymer-rich phase; evaporating or solvent stripping polymer-depleted phase
12/25/2007US7311586 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
12/20/2007US20070293128 Grinding and polishing machine for grinding and/or polishing workpieces to an optical quality
12/20/2007DE112004003024T5 Ausgangspositionseinstellverfahren für eine Schleifscheibe in einer Vertikal-Doppelscheiben-Flächenschleifmaschine Ausgangspositionseinstellverfahren for a grinding wheel in a vertical double disc surface grinding machine
12/19/2007EP1868231A1 Bonded wafer manufacturing method, bonded wafer, and plane polishing apparatus
12/19/2007CN200991854Y Rolling roller measuring device
12/13/2007WO2007141990A1 Method for producing wafer
12/13/2007US20070287360 Polishing tape and polishing device using same
12/12/2007EP1222056B1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
12/12/2007CN200988149Y Automatic fastening and measuring working mechanism for cylindrical grinding machine
12/11/2007US7307023 Polishing method of Cu film and method for manufacturing semiconductor device
12/11/2007US7306849 Automatic detection using camera; multilayer using gel and adhesive layers
12/11/2007US7306508 Multi-wire saw
12/06/2007US20070281587 Method of making and apparatus having polishing pad with window
12/06/2007DE102004011996B4 Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken Apparatus for simultaneous double-side grinding of disk-shaped workpieces
12/05/2007EP1861223A1 Method for deep rolling crankshafts
12/05/2007CN101081472A Method for processing mechanical diaphram pump crank bearing bushing
12/05/2007CN100352605C 化学机械抛光垫以及化学机械抛光方法 Chemical mechanical polishing pad and chemical mechanical polishing method
12/04/2007US7303466 Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
11/2007
11/29/2007US20070275637 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
11/28/2007CN200981169Y Oriented processing flat grinder
11/28/2007CN101077567A Grinding device for contact rail
11/27/2007US7300334 Drilling-head-grinding positioning device
11/27/2007US7300333 Control system and method for processing jewelry and the like
11/27/2007US7300332 Polished state monitoring apparatus and polishing apparatus using the same
11/22/2007WO2007131869A1 Numerically controlled grinding machine and process for controlling same
11/22/2007US20070270083 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
11/22/2007US20070270082 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
11/22/2007US20070270081 Automated Chemical Polishing System Adapted for Soft Semiconductor Materials
11/22/2007DE102006022831A1 Verfahren zum Steuern einer Schleifmaschine und numerisch gesteuerte Schleifmaschine Method for controlling a grinding machine and numerically controlled grinding machine
11/21/2007CN101076432A Initial position setting method of whetstone in vertical duplex surface grinding machine
11/20/2007US7297046 Constant spindle power grinding method
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