| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/18/2011 | CN201839505U Multi-layer circuit board with accurate position alignment of inner layer plates |
| 05/18/2011 | CN201834572U Board film gripping device |
| 05/18/2011 | CN1925717B Circuit board and electronic device including same and method for manufacturing same |
| 05/18/2011 | CN1897789B Circuit board and connection structure |
| 05/18/2011 | CN1874654B Soldering method, electronic part, and part-exchanging method |
| 05/18/2011 | CN1717153B Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 05/18/2011 | CN1663329B Production of via hole in flexible circuit printable board |
| 05/18/2011 | CN1610486B Method for manufacturing wiring circuit substrate |
| 05/18/2011 | CN1592547B Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board |
| 05/18/2011 | CN102067742A Automatic soldering equipment |
| 05/18/2011 | CN102067741A Wire harness and production method therefor |
| 05/18/2011 | CN102067298A Packaging structure and method for manufacturing packaging structure |
| 05/18/2011 | CN102067248A Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications |
| 05/18/2011 | CN102066621A Plated member and method of forming plating layer |
| 05/18/2011 | CN102066514A Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device |
| 05/18/2011 | CN102066473A High dielectric constant laser direct structuring materials |
| 05/18/2011 | CN102066044A Soldering material and electronic component assembly |
| 05/18/2011 | CN102066043A Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 05/18/2011 | CN102065651A Production method of high-density laminated printed circuit board of high-frequency material |
| 05/18/2011 | CN102065650A Printed-circuit board and manufacturing method thereof |
| 05/18/2011 | CN102065649A Printed circuit board manufacturing method |
| 05/18/2011 | CN102065648A Double-sided circuit board and interconnection conduction method thereof |
| 05/18/2011 | CN102065647A Method for manufacturing thick-film ceramic composite substrate |
| 05/18/2011 | CN102065646A Surface mount technology of ratio frequency power amplification mainboard |
| 05/18/2011 | CN102065645A Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
| 05/18/2011 | CN102065644A Method for making and packaging printed circuit board (PCB) and crystal oscillator |
| 05/18/2011 | CN102065643A Method for making circuit board |
| 05/18/2011 | CN102065642A Component cutting method and system |
| 05/18/2011 | CN102065641A Production method of circuit board |
| 05/18/2011 | CN102065640A Method for reducing warping in assembly of circuit board |
| 05/18/2011 | CN102065638A Printed circuit board having electro-component and manufacturing method thereof |
| 05/18/2011 | CN102065637A Packaging structure with magnetic element and forming method of the packaging structure |
| 05/18/2011 | CN102061494A Processed copper foil, coarsening treatment method of unprocessed copper foil and laminated plate with copper foil applied |
| 05/18/2011 | CN102059867A Printing method of blind-hole printing solder mask of printed circuit board (PCB) |
| 05/18/2011 | CN101790289B PCB with interconnected blind holes and processing method thereof |
| 05/18/2011 | CN101686604B Flexible printed circuit whole board punching method |
| 05/18/2011 | CN101682999B Insulating resin composition |
| 05/18/2011 | CN101652025B Method for manufacturing and forming circuit board |
| 05/18/2011 | CN101652024B Method for deploying component on circuit board |
| 05/18/2011 | CN101638802B Pre-plating correction liquid and pre-plating treatment method for circuit board |
| 05/18/2011 | CN101513156B Electronic component mounting system and electronic component mounting method |
| 05/18/2011 | CN101467503B Submount for electronic components |
| 05/18/2011 | CN101461294B Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| 05/18/2011 | CN101442877B Novel interconnection structure and method for creating electric through-hole |
| 05/18/2011 | CN101401197B 电子元器件模块 Electronic Component Module |
| 05/18/2011 | CN101365301B Pasting method of non-insulation sheet upon printed circuit board, as well as, printed circuit board and optical disk apparatus |
| 05/18/2011 | CN101296580B Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes |
| 05/18/2011 | CN101222819B Production method of embedded passive element |
| 05/18/2011 | CN101183200B Liquid crystal display device |
| 05/17/2011 | US7945398 Reflow process evaluation device and reflow process evaluation method |
| 05/17/2011 | US7944711 Discrete electronic component and related assembling method |
| 05/17/2011 | US7943859 Circuit board, its manufacturing method, and joint box using circuit board |
| 05/17/2011 | US7941916 Manufacturing method for memory card |
| 05/12/2011 | WO2011057030A1 Polyester film with adhesive properties |
| 05/12/2011 | WO2011056977A2 Multi-layer circuit member and assembly therefor |
| 05/12/2011 | WO2011056967A2 Multi-layer circuit member with reference circuit |
| 05/12/2011 | WO2011055487A1 Mask for screen printing, screen printing device and screen printing method employing same |
| 05/12/2011 | WO2011055314A1 Curved ultrasonic hifu transducer with compliant electrical connections |
| 05/12/2011 | WO2011054538A1 Light exposure apparatus and method for exposing substrates to light |
| 05/12/2011 | WO2011054432A1 Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste |
| 05/12/2011 | WO2007146481A9 Imprint circuit patterning |
| 05/12/2011 | US20110111628 Cable assembly and method of manufacturing the same |
| 05/12/2011 | US20110111606 Fpc connector for electrically connecting an fpc to pcb and fpc-connection method using the same |
| 05/12/2011 | US20110110669 Optical transciever |
| 05/12/2011 | US20110110061 Circuit Board with Offset Via |
| 05/12/2011 | US20110110058 Board on chip package substrate and manufacturing method thereof |
| 05/12/2011 | US20110110057 Circuit module and manufacturing method for the same |
| 05/12/2011 | US20110110054 Compact display flex and driver sub-assemblies |
| 05/12/2011 | US20110110050 Structure with electronic component mounted therein and method for manufacturing such structure |
| 05/12/2011 | US20110109580 Wear-Resistant Touchpads |
| 05/12/2011 | US20110108876 Pad structure and manufacturing method thereof |
| 05/12/2011 | US20110108716 Opto-electronic circuit board and manufacturing method for the same |
| 05/12/2011 | US20110108519 Wet etched insulator and electronic circuit component |
| 05/12/2011 | US20110108320 Hermetic feed-through with hybrid seal structure |
| 05/12/2011 | US20110108312 Shock damping system for a surface mounted vibration sensitive device |
| 05/12/2011 | US20110108311 Multilayer printed wiring board |
| 05/12/2011 | US20110108310 Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board |
| 05/12/2011 | US20110107596 Conductive film structure, fabrication method thereof, and conductive film type probe device for ic |
| 05/12/2011 | US20110107594 Planar electrical power electronic modules for high-temperature applications, and corresponding production methods |
| 05/12/2011 | US20110107570 Duplexer using an embedded pcb and method of fabricating the same |
| 05/12/2011 | DE202005021915U1 Zwischenverbindungsstruktur zum Verbinden von vergrabenen Signalleitungen mit elektrischen Vorrichtungen Interconnection structure for connecting signal lines with the buried electrical devices |
| 05/12/2011 | DE102009053574A1 Method for producing printed circuit board and photovoltaic module, involves continuously extracting accumulated foam and/or accumulated foam-containing process solution, and partially removing foam and/or process solution by filter unit |
| 05/12/2011 | DE102009046486A1 Schutzeinrichtung für eine Leiterplatte Protection means for a printed circuit board |
| 05/12/2011 | DE102009046446A1 Elektronisches Bauelement Electronic component |
| 05/12/2011 | DE102009046081A1 Method for manufacturing semiconductor component e.g. pressure sensor, involves connecting partial region of rear side of semiconductor chip with bond pad on carrier substrate, where region is coated with through-contact filling material |
| 05/11/2011 | EP2320718A1 Circuit module and method for manufacturing same |
| 05/11/2011 | EP2320717A1 Wiring circuit board and method of manufacturing the same |
| 05/11/2011 | EP2320270A1 Liquid crystal display device testing method and liquid crystal display device |
| 05/11/2011 | EP2319960A1 Flexible copper-clad laminate |
| 05/11/2011 | EP2319096A1 Led module |
| 05/11/2011 | EP2002973B1 Mold release film, mold release cushion material, process for manufacturing printed board and process for manufacturing mold release film |
| 05/11/2011 | EP1911584B1 Screen printing machine and solar battery cell |
| 05/11/2011 | EP1732118B1 Heater, reflow apparatus with such heater |
| 05/11/2011 | EP1507900B1 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
| 05/11/2011 | EP1346613B1 Via-in-pad with off-center geometry |
| 05/11/2011 | EP1305829B1 Solder bar for high power flip chips |
| 05/11/2011 | CN201830618U Automatic material withdrawing device on chip mounter |
| 05/11/2011 | CN201830560U Chip mounter for producing large-area light-emitting diode (LED) circuit board |
| 05/11/2011 | CN201830559U Texture cleaning roller in direct contact with printed circuit board |
| 05/11/2011 | CN201830558U Copper bonding pad disconnection or incompleteness repairing structure |