Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2012
10/10/2012CN102724822A Control technological method for planeness of surface of LTCC substrate
10/10/2012CN102724821A Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera
10/10/2012CN102724820A Manufacturing method of double-side circuit boards
10/10/2012CN102724819A Method for grinding hole plugging resin of circuit board
10/10/2012CN102724818A Solder mask green ink plugging method
10/10/2012CN102724817A Reflow soldering manufacturing process for large-current concentrating photovoltaic photoelectric conversion receivers
10/10/2012CN102724816A Automatic pin machine of PCB board
10/10/2012CN102724815A Manufacturing method for circuit board
10/10/2012CN102724814A Machining structure and machining method of flexible printed circuit board
10/10/2012CN102724813A Cover opening method of rigid and flexible plate
10/10/2012CN102724812A Exposed character manufactured by directly welding LEDs on flexible circuit board and method
10/10/2012CN102724809A Multi-layer PCB (printed circuit board) and manufacturing method thereof
10/10/2012CN102724808A Printed circuit board (PCB) connecting structure and manufacturing method thereof
10/10/2012CN102724806A Method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity
10/10/2012CN102722083A Solder resist composition and printed wiring board
10/10/2012CN102717163A Reflow soldering device
10/10/2012CN102231943B Horizontal-line multi-washing serial washing overflow structure
10/10/2012CN102170759B Method for processing blind buried hole on multilayer circuit board
10/10/2012CN102065645B Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof
10/10/2012CN102054709B Manufacturing method of packed base plate
10/10/2012CN102044446B Manufacturing method for blind hole windowing contraposition target of packaging baseplate
10/10/2012CN101990367B Adjustable hot air cover
10/10/2012CN101947659B Method for transverse shaft-crossing drilling of drilling machine
10/10/2012CN101916001B ACF attaching method and ACF attaching apparatus
10/10/2012CN101835345B Regulation handle
10/10/2012CN101810063B Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
10/10/2012CN101798432B Curable resin composition and printed circuit board and reflection board using same
10/10/2012CN101781789B Method and electrolytic bath for polishing metal layer of base plate
10/10/2012CN101688308B Metal-laminated polyimide substrate, and method for production thereof
10/10/2012CN101675387B Photosensitive resin composition, dry film, and processed product using the dry film
10/10/2012CN101500745B Bonding material, bonded portion and circuit board
10/10/2012CN101276759B Equipment for soldering and planting ball as well as acquisition apparatus
10/10/2012CN101268411B Device and method for producing electronic device such as display device, and electronic device such as display device
10/10/2012CN101207976B Paste printer and method of printing with paste
10/10/2012CN101176394B Multilevel cabling structure and its manufacturing method
10/10/2012CN101061761B Substrate processing device, and conveying method
10/10/2012CN101051557B Method, coil assembly and sensor for preparing coil assembly
10/10/2012CN101049058B Ceramic multilayer substrate and method for manufacturing the same
10/09/2012US8283573 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
10/09/2012US8281485 Method of producing a circuit board layer
10/09/2012US8281468 Method of manufacturing piezoelectric vibrators
10/09/2012DE202012006289U1 Miniaturisierte Spannungsumformungs-Vorrichtung Miniaturized voltage re-form device
10/04/2012WO2012134587A1 An innovative cable termination scheme
10/04/2012WO2012134286A1 Apparatus and method for providing an embedded structure and for providing an electro-optical device including the same
10/04/2012WO2012133990A1 Method for manufacturing high heat-dissipation circuit board appropriate for mounting light emitting diode
10/04/2012WO2012133839A1 Substrate with built-in functional element, electronic device provided with said substrate, method for producing substrate with built-in functional element
10/04/2012WO2012133833A1 Stainless-steel sheet for metal mask
10/04/2012WO2012133781A1 Transmission system and method for constructing backplane system
10/04/2012WO2012133755A1 Transmission system and method for constructing backplane system
10/04/2012WO2012133684A1 Production method for laminate having patterned metal films, and plating layer-forming composition
10/04/2012WO2012133638A1 Multilayer printed wiring board manufacturing method, and multilayer printed wiring board obtained by said manufacturing method
10/04/2012WO2012133637A1 Multilayer printed wiring board manufacturing method, and multilayer printed wiring board obtained by said manufacturing method
10/04/2012WO2012133380A1 Circuit board, and method for manufacturing circuit board
10/04/2012WO2012133313A1 Method for manufacturing resin substrate with built-in component
10/04/2012WO2012133297A1 Laminate having metal film, manufacturing method therefor, laminate having patterned metal film, and manufacturing method therefor
10/04/2012WO2012133099A1 Wiring board and method for manufacturing same
10/04/2012WO2012133093A1 Method for manufacturing laminate having patterned metal films
10/04/2012WO2012133090A1 Printed wiring board and method for manufacturing printed wiring board
10/04/2012WO2012133062A1 Positive-tone photosensitive resin composition, dry film, cured product, and printed wiring board
10/04/2012WO2012133038A1 Wiring board and manufacturing method therefor
10/04/2012WO2012133032A1 Production method for laminate having patterned metal films, and plating layer-forming composition
10/04/2012WO2012132970A1 Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid
10/04/2012WO2012132969A1 Substrate transfer carrier
10/04/2012WO2012132918A1 Method for manufacturing printed circuit board
10/04/2012WO2012132880A1 Multilayer ceramic substrate
10/04/2012WO2012132762A1 Glass ceramic substrate and method for producing same
10/04/2012WO2012132741A1 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed board
10/04/2012WO2012132672A1 Pattern formation method and pattern formation device
10/04/2012WO2012132580A1 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
10/04/2012WO2012132576A1 Rolled copper or copper-alloy foil provided with roughened surface
10/04/2012WO2012132572A1 Copper foil with copper carrier, method for producing said copper foil, copper foil for electronic circuit, method for producing said copper foil, and method for forming electronic circuit
10/04/2012WO2012132524A1 Flexible multilayer substrate
10/04/2012WO2012132491A1 Photosensitive composition, photosensitive laminate, permanent pattern forming method, and printed board
10/04/2012WO2012132423A1 Photocurable/thermosetting inkjet composition, and printed wiring board using same
10/04/2012WO2012132383A1 Laminate sheet manufacturing device and method for manufacturing laminate sheet
10/04/2012WO2012132382A1 Method and apparatus for fabricating laminate sheet
10/04/2012WO2012132325A1 Printed wiring board, method for manufacturing printed wiring board, and semiconductor device
10/04/2012WO2012132210A1 Substrate for element mounting, cell, and cell module
10/04/2012WO2012132175A1 Solder transfer base, method for producing solder transfer base, and method for transferring solder
10/04/2012WO2012130815A1 Circuit carrier with embedded circuit board
10/04/2012WO2012130548A1 Electronic module
10/04/2012WO2012130508A1 Silk-screen stencil for printing onto a photovoltaic cell
10/04/2012WO2012129582A1 Method for producing more particularly processing or populating, a circuit board element and carrier for use in such a method
10/04/2012WO2012087059A3 Printed circuit board and method for manufacturing the same
10/04/2012WO2012087058A3 Printed circuit board and method for manufacturing the same
10/04/2012WO2012052877A3 Method and apparatus for welding printed circuits
10/04/2012US20120251733 Electroless plating apparatus, method of electroless plating, and manufacturing method of printed circuit board
10/04/2012US20120251055 Opto-electric hybrid board and manufacturing method therefor
10/04/2012US20120251038 Opto-electric hybrid board and manufacturing method therefor
10/04/2012US20120251037 Opto-electric hybrid board and manufacturing method therefor
10/04/2012US20120251036 Opto-electric hybrid board and manufacturing method therefor
10/04/2012US20120250281 Printed wiring board and method for manufacturing the same
10/04/2012US20120250275 Electronic device, electronic component, and method of manufacturing circuit board assembly
10/04/2012US20120250265 Circuit module manufacturing method, circuit module, and electronic apparatus including circuit module
10/04/2012US20120249772 Component mounting device, information processing device, position detection method, and substrate manufacturing method
10/04/2012US20120249453 Input device and method of manufacturing the same
10/04/2012US20120248630 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
10/04/2012US20120248091 Electrical heating device with a plate element comprising conductive paths and method for the manufacture of a plate element of this nature
10/04/2012US20120247823 Package-substrate-mounting printed wiring board and method for manufacturing the same
10/04/2012US20120247822 Coreless layer laminated chip carrier having system in package structure
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