Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2012
10/03/2012CN101861763B Component with bonding adhesive
10/03/2012CN101581884B Intaglio printing plate, production method for intaglio printing plate, production method for electronic substrate, and production method for display device
10/03/2012CN101572993B Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way
10/03/2012CN101493547B Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
10/03/2012CN101469420B Electroless gold-plating method and electronic component
10/02/2012US8278564 Circuit board viaholes and method of manufacturing the same
10/02/2012US8278560 Electrical device with teeth joining layers and method for making the same
10/02/2012US8278559 Printed circuit board assembly
10/02/2012US8278558 Printed circuit board and method of producing the same
10/02/2012US8277228 Connector set and jointer for use therein
10/02/2012US8276268 System and method of forming a patterned conformal structure
10/02/2012US8276267 Method for mounting a component on a circuit board
10/02/2012US8276265 Electronic component mounting machine and electronic component loading head
10/02/2012US8276264 System for mounting components on boards
09/2012
09/27/2012WO2012128875A1 Thermal management within an led assembly
09/27/2012WO2012128269A1 Wiring substrate
09/27/2012WO2012128219A1 Thermoplastic resin composition, resin molding, and process for producing resin molding having plating layer attached thereto
09/27/2012WO2012128140A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate
09/27/2012WO2012128139A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate
09/27/2012WO2012127915A1 Transparent conductive film, substrate having transparent conductive film, and organic electroluminescent element using same and manufacturing method for same
09/27/2012WO2012127838A1 Method for manufacturing metal base wiring board, and metal base wiring board
09/27/2012WO2012127672A1 Method and apparatus for cutting substrate
09/27/2012WO2012127536A1 Method and device for detaching soldered component
09/27/2012WO2012127021A1 Method and populating device for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner, contact sensor plate, and use of said contact sensor plate
09/27/2012WO2012126831A1 Process for producing a circuit carrier
09/27/2012WO2012126787A1 Method for producing a film stack, and system for producing a film stack
09/27/2012WO2012126672A1 Process for etching a recessed structure filled with tin or a tin alloy
09/27/2012WO2012087073A3 Printed circuit board and method for manufacturing same 인쇄회로기판 및 그의 제조 방법
09/27/2012US20120244753 Relief plug-in connector and multilayer circuit board
09/27/2012US20120244752 Communication Connector
09/27/2012US20120244728 High performance surface mount electrical interconnect with external biased normal force loading
09/27/2012US20120244273 system and a method for solder mask inspection
09/27/2012US20120243553 40 gigabit attachment unit interface (xlaui) lane electrical interface to replace 10 gigabit xfp (xfi) in 10gb/s channel applications
09/27/2012US20120243212 Portable and bendable utility light
09/27/2012US20120243191 Miniaturized electromagnetic interference shielding structure and manufacturing method thereof
09/27/2012US20120242883 Low profile camera module packaging
09/27/2012US20120242638 Dielectric spacer for display devices
09/27/2012US20120242421 Microwave transition device between a microstrip line and a rectangular waveguide
09/27/2012US20120241408 Method for manufacturing touch panel and method for manufacturing display device provided with touch panel
09/27/2012US20120241209 Wafer-level electromagnetic interference shielding structure and manufacturing method thereof
09/27/2012US20120241206 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device
09/27/2012US20120241205 Wiring board with built-in electronic component and method for manufacturing the same
09/27/2012US20120241200 Circuit board, manufacturing method of circuit board, suspension substrate, suspension, device-mounted suspension, and hard disk drive
09/27/2012US20120241199 Conductive substrate, method of manufacturing the same and touch panel
09/27/2012US20120241196 Circuit board and method of manufacturing same
09/27/2012US20120241082 Fabricating method of flexible circuit board
09/27/2012US20120241070 Method of making a biochemical test strip
09/27/2012US20120240971 Process for forming flexible substrates having patterned contact areas
09/27/2012US20120240396 use of a control module for a transmission control installed in an automatic transmission
09/27/2012DE19954365B4 Verfahren zum bildweisen Bestrahlen eines Resists A method for imagewise exposing a resist
09/27/2012DE102011015106A1 Method for forming metallic conductive pattern on substrate, involves adhering metallic nano-particles in exposed region, and changing molecular structure of light sensitive material in exposed region by laser irradiation
09/27/2012DE102011005933A1 Method for producing molding compound surrounded by circuit substrate, involves performing connection by bonding wire prior to encapsulation of substrate facing end of conductor track foil having tying up region on circuit substrate
09/27/2012DE102011005890A1 Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse Electronic device with circuit boards in a rack-mounted housing
09/27/2012DE10001180B4 Doppelseitenmuster-Verbindungskomponente, gedruckte Schaltungsplatte und Verfahren zum Verbinden von auf beiden Seiten einer gedruckten Schaltungsplatte gebildeten Verbindungsmustern Double-side pattern connection component, printed circuit board and method of joining formed on both sides of a printed circuit board connecting patterns
09/26/2012EP2503862A1 Substrate with contacted electrically conductive structures and method for producing same
09/26/2012EP2503859A1 Through-wired substrate and manufacturing method therefor
09/26/2012EP2503029A1 Process for etching a recessed structure filled with tin or a tin alloy
09/26/2012EP2502471A1 Production of conductor structures on plastic films by means of nano-inks
09/26/2012CN202455734U Multi-head full-automatic bulk LED (Light-Emitting Diode) board insertion machine
09/26/2012CN202455674U Solder drawing plate improved structure of wave-soldering furnace jig
09/26/2012CN202455673U High density interconnected circuit board coating technology reworking lifting device
09/26/2012CN202455672U Auxiliary material feeding tool for surface mounting of digital camera circuit substrate
09/26/2012CN202455671U PCB full-automatic pin inserting machine
09/26/2012CN202455670U Wire rod clamping and releasing module and pin cutting module of printed circuit board (PCB) full-automatic contact pin machine
09/26/2012CN202455669U Direct-drive high-speed and high-efficiency chip mounter
09/26/2012CN202455668U Plate cleaning device
09/26/2012CN202455667U High density interconnected circuit board copper deposition recovery device
09/26/2012CN202447781U Soldering flux addition control device
09/26/2012CN1909226B Package substrate
09/26/2012CN102696167A Electrical component of a motor vehicle
09/26/2012CN102695768A Anisotropic electrically-conductive adhesive agent
09/26/2012CN102695376A Manufacturing method of line structure
09/26/2012CN102695375A Method for processing 2mil micro via
09/26/2012CN102695374A Processing method for enhancing lamination bonding force of rigid and flexible boards
09/26/2012CN102695373A Printed substrate manufacturing equipment and manufacturing method
09/26/2012CN102695372A Tin spraying technology for spraying of liquid metal solder microparticle
09/26/2012CN102695371A Manufacture method for embedded type line structure of circuit board
09/26/2012CN102695370A Preparation method of ceramic circuit board
09/26/2012CN102695369A Manufacture method of flexible circuit base board
09/26/2012CN102695368A Manufacture method of imbedded circuit structure of circuit board
09/26/2012CN102695367A Reinforcing method for anti-corrosion thick dry film of copper circuit board
09/26/2012CN102695366A Wiring board with built-in electronic component and method for manufacturing the same
09/26/2012CN102695363A Conductive element and method for producing the same, wiring element, information input device, and master
09/26/2012CN102693955A Packaging carrier board and manufacturing method thereof
09/26/2012CN102693951A semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
09/26/2012CN102691064A Etching solution and method for forming conductor patterns
09/26/2012CN102689071A Reflow soldering equipment
09/26/2012CN102689069A Automatic soldering machine
09/26/2012CN102689068A Tin spraying technology added with spraying solder tiny particles
09/26/2012CN102689065A Method for welding circuit board components
09/26/2012CN102161823B Composite material, high-frequency circuit substrate therefrom and manufacture method thereof
09/26/2012CN102039466B Heat conducting device and hot melting and soldering method thereof
09/26/2012CN101973146B Process for producing prepreg with carrier, prepreg with carrier, process for producing thin-type double sided board, thin-type double sided board, and process for producing multilayered printed wirin
09/26/2012CN101888748B Manufacturing method of circuit board
09/26/2012CN101686607B Four-layer circuit board capable of inhibiting warpage
09/26/2012CN101652033B PCB composite board for LED light-emitting diode
09/26/2012CN101481801B Etching solution
09/26/2012CN101458994B Staged capacitor construction, production method thereof, and substrate applying the same
09/26/2012CN101430506B Photo-curing resin composition, design of cured composition and printed circuit board
09/26/2012CN101374387B Method for welding electronic element on circuit board
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