| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/13/2013 | CN202799406U Printed circuit board with multiple positioning systems |
| 03/13/2013 | CN202799405U Vertical-type hot air leveling machine in high-density interconnection circuit board technology |
| 03/13/2013 | CN202799404U FPC forming machine |
| 03/13/2013 | CN202799403U Integrated forming mould for silica gel FPC used for mobile phone |
| 03/13/2013 | CN202796904U Encapsulating structure of quantum effect photoelectric detector and read-out circuit |
| 03/13/2013 | CN202796371U Inductor packaging structure |
| 03/13/2013 | CN202794845U Copper-clad plate aligning system for exposure machine |
| 03/13/2013 | CN202794844U Flexible circuit board exposure machine |
| 03/13/2013 | CN202786488U Automatic liquid adding device for PCB plating |
| 03/13/2013 | CN202786479U Electroplating copper hanger |
| 03/13/2013 | CN202786428U Hanging basket for eletcroless plating copper |
| 03/13/2013 | CN202786427U Trace-free hanging basket |
| 03/13/2013 | CN202780301U Printed circuit board (PCB) board welding jig |
| 03/13/2013 | CN202780161U Carrier for wave soldering |
| 03/13/2013 | CN202779063U Automatic dedusting device for dust banding roller of high-density interconnected circuit board |
| 03/13/2013 | CN102972101A Metal core circuit board with conductive pins |
| 03/13/2013 | CN102971845A Substrate for mounting semiconductor element and method for manufacturing the substrate |
| 03/13/2013 | CN102971809A Multilayer ceramic electronic component and method for producing same |
| 03/13/2013 | CN102971752A Antenna circuit structure body for IC card/tag and production method therefor |
| 03/13/2013 | CN102970836A Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness |
| 03/13/2013 | CN102970835A Manufacturing method for blind hole on high density interconnect (HDI) circuit board |
| 03/13/2013 | CN102970834A Method for fabricating circuit board metallized half hole |
| 03/13/2013 | CN102970833A Processing method and insert hole structure of printed circuit board (PCB) insert hole |
| 03/13/2013 | CN102970832A Technological device and method for wave soldering |
| 03/13/2013 | CN102970831A Vacuum adsorption connecting and binding process for integrated circuit (IC) card electronic chip and flexible printed circuit board |
| 03/13/2013 | CN102970830A Replacing method of unit circuit board and product sheet for circuit substrate |
| 03/13/2013 | CN102970829A Substrate and method for manufacturing same |
| 03/13/2013 | CN102970828A Method for manufacturing rigidity-flexibility combined printing circuit board |
| 03/13/2013 | CN102970827A Method for manufacturing hybrid-material printed circuit board |
| 03/13/2013 | CN102970826A Processing method for utilizing dustproof support frame to perform manual alignment exposure on circuit board |
| 03/13/2013 | CN102970825A Mounting structure |
| 03/13/2013 | CN102970824A Circuit board system |
| 03/13/2013 | CN102970823A Circuit board structure and method for determining cutting displacement |
| 03/13/2013 | CN102970818A Laminate printed board and manufacturing method thereof |
| 03/13/2013 | CN102970816A Ball grid array manufactured on printed circuit board |
| 03/13/2013 | CN102965714A Electroplating clamp |
| 03/13/2013 | CN102300414B Addition preparation method of printed circuit |
| 03/13/2013 | CN102186316B Method for manufacturing any-layer printed circuit board |
| 03/13/2013 | CN102154669B Method for plating thick soft gold by utilizing plating thin golden cylinder |
| 03/13/2013 | CN102045948B Method for manufacturing PCB by laminating metal substrate with non-flow prepreg |
| 03/13/2013 | CN101952082B Flux creeping-up preventive composition for solder, electronic member for solder coated with the composition, method for soldering the member, and electrical appliance |
| 03/13/2013 | CN101918219B Positioning device to position one or more plates for electronic circuits in a metal deposition unit, and related method |
| 03/13/2013 | CN101897245B Circuit connecting material and structure for connecting circuit member |
| 03/13/2013 | CN101864151B Flame retardant resin composition for highly peel-strenghthened printed circuit board, printed circuit board using the same and manufacturing method thereof |
| 03/13/2013 | CN101842855B High temperature substrate protective structure |
| 03/13/2013 | CN101796895B Method for the hot embossing of at least one conductor track onto a substrate and substrate comprising at least one conductor track |
| 03/13/2013 | CN101681855B Electric device, connecting method and adhesive film |
| 03/13/2013 | CN101470357B Exposure apparatus |
| 03/12/2013 | USRE44071 Method for patterning a multilayered conductor/substrate structure |
| 03/12/2013 | US8394458 Method for disposing a component |
| 03/12/2013 | US8393076 Electrical connection of components |
| 03/12/2013 | CA2659695C Circuit carrier |
| 03/12/2013 | CA2549314C Method of manufacturing a circuit carrier and the use of the method |
| 03/07/2013 | WO2013033034A2 Method for making high-density electrical interconnections using rivet bonds |
| 03/07/2013 | WO2013032725A2 Glass as a substrate material and a final package for mems and ic devices |
| 03/07/2013 | WO2013031994A1 Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern |
| 03/07/2013 | WO2013031987A1 Insulating reflective substrate and led package |
| 03/07/2013 | WO2013031846A1 Method for producing plated article, and plated article |
| 03/07/2013 | WO2013031822A1 Thin-film wiring substrate and substrate for probe card |
| 03/07/2013 | WO2013031815A1 Multilayered circuit board manufacturing method |
| 03/07/2013 | WO2013031740A1 Conveyor |
| 03/07/2013 | WO2013031739A1 Conveyor |
| 03/07/2013 | WO2013031258A1 Printed circuit board |
| 03/07/2013 | WO2013031113A1 Screen printing machine, and screen printing method |
| 03/07/2013 | WO2013030931A1 Laminated sintered ceramic wiring substrate, and semiconductor package containing wiring substrate |
| 03/07/2013 | WO2013030273A1 Method for producing a printing stencil for technical printing, and printing stencil for technical printing |
| 03/07/2013 | WO2013030007A1 Direct plating method |
| 03/07/2013 | WO2013029074A1 Method for integrating a component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product |
| 03/07/2013 | WO2013029073A1 Method for integrating a component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product |
| 03/07/2013 | WO2012169866A3 Printed circuit board and method for manufacturing the same |
| 03/07/2013 | WO2012168902A3 Method to trace conductive tracks |
| 03/07/2013 | WO2011064107A3 Method for contacting a printed circuit board having electric contacts on both sides and such a printed circuit board |
| 03/07/2013 | US20130058100 Fluid Cooled Lighting Element |
| 03/07/2013 | US20130058062 Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor device |
| 03/07/2013 | US20130058050 Slot and memory module for a slot standing interconnect |
| 03/07/2013 | US20130058046 Printed circuit board assembly and manufacturing method thereof |
| 03/07/2013 | US20130057497 Touch screen, transparent circuit board for touch screen, and method for fabricating touch screen |
| 03/07/2013 | US20130057464 Electro-phoretic display device and fabricating method thereof |
| 03/07/2013 | US20130056440 Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel |
| 03/07/2013 | US20130056439 Method of manufacturing metal-base substrate and method of manufacturing circuit board |
| 03/07/2013 | US20130056438 Composition and method for micro etching of copper and copper alloys |
| 03/07/2013 | US20130056362 Manufacture method of buildup circuit board |
| 03/07/2013 | US20130056251 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate |
| 03/07/2013 | US20130056250 Method for Manufacturing a Double-Sided Printed Circuit Board |
| 03/07/2013 | US20130056248 Flexible circuit board and its method for production |
| 03/07/2013 | US20130056247 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board |
| 03/07/2013 | US20130056245 Printed circuit board and method for manufacturing the same |
| 03/07/2013 | US20130055567 Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection card |
| 03/07/2013 | US20130055566 Method for introducing electrical insulations in printed circuit boards |
| 03/07/2013 | US20130055555 Method of Manufacturing Conductive Structures |
| 03/07/2013 | DE19758864B4 Verfahren zur Herstellung eines Leistungsmoduls A process for producing a power module |
| 03/07/2013 | DE102011112090A1 Verfahren zur Bestückung einer Leiterplatte Method for mounting a circuit board |
| 03/07/2013 | DE102011081967A1 Erdung eines Kraftstoff-Fördermoduls mittels einer aufgespritzten elektrisch leitfähigen Struktur Grounding of a fuel delivery module using a sprayed electrically conductive structure |
| 03/07/2013 | DE102006051762B4 Hochdichte Leiterplatte und Verfahren zu ihrer Herstellung High density printed circuit board and process for its preparation |
| 03/06/2013 | EP2566313A1 Manufacturing-work machine and manufacturing-work system |
| 03/06/2013 | EP2566311A1 Direct plating method |
| 03/06/2013 | EP2566308A1 Method for filling a circuit board |
| 03/06/2013 | EP2566306A2 Multi-layer circuit board and manufacturing method thereof |
| 03/06/2013 | EP2565924A2 Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance |
| 03/06/2013 | EP2563525A1 Method and use of a binder for providing a metallic coat covering a surface |