Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2013
03/20/2013CN102244982B Method for controlling warp of local high-frequency mixedly-pressed circuit board
03/20/2013CN102223768B Multiple-photoelectric thin board spliced yin and yang jig
03/20/2013CN102196677B PCB (Printed Circuit Board) double-sided jack machining process
03/20/2013CN102186309B Laser direct imaging full printing circuit
03/20/2013CN102149253B Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step
03/20/2013CN102131337B Circuit board and manufacturing process thereof
03/20/2013CN102106196B Capacitively coupled connector for flexible printed circuit applications
03/20/2013CN102045936B 线路板结构 Board structure
03/20/2013CN102044332B Transformer and transformer assembly
03/20/2013CN102014574B Carrier for conveying flexible printed substrate, and printing device of flexible printed substrate with the same
03/20/2013CN101987387B Fully automatic novel electronic component soldering machine
03/20/2013CN101978799B Printed wiring board and associated manufacturing methodology
03/20/2013CN101959374B Method for manufacturing multilayer printed circuit board
03/20/2013CN101939677B Manufacturing method of optical wiring printed board and optical wiring printed circuit board
03/20/2013CN101932193B Printed circuit board and method for manufacturing the same
03/20/2013CN101785371B Fpc-based relay connector
03/20/2013CN101765338B Refluxing soft soldering apparatus
03/20/2013CN101677487B Printed wiring board and method for manufacturing the same
03/20/2013CN101647325B Method for removing a part of a planar material layer and multilayer structure
03/20/2013CN101646303B Jig for plugging holes and process for plugging holes by using same
03/20/2013CN101616540B Wired circuit board and method of manufacturing the same
03/20/2013CN101442887B Production method of multilayer printed wiring board and multilayer printed wiring board
03/19/2013US8400774 Packaging techniques and configurations
03/19/2013US8399986 Method for performing parallel stochastic assembly
03/19/2013US8399067 Method for applying a coating to a substrate
03/19/2013US8397380 Controlling warpage in BGA components in a re-flow process
03/19/2013US8397379 Method for fabricating ceramic substrate
03/19/2013US8397378 Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
03/19/2013CA2722029C Planar heating element for underfloor heating
03/19/2013CA2660875C Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
03/14/2013WO2013036948A1 Soldering relief method and semiconductor device employing same
03/14/2013WO2013036865A2 Via structure for transmitting differential signals
03/14/2013WO2013036862A2 Via structure for transmitting differential signals
03/14/2013WO2013036369A1 Barrier layer dielectric for rfid circuits
03/14/2013WO2013035888A1 Wiring board
03/14/2013WO2013035717A1 Module, and manufacturing method for module
03/14/2013WO2013035582A1 Resin composition for forming receiving layers, receiving base obtained using same, printed matter, conductive pattern, and electrical circuit
03/14/2013WO2013035357A1 Continuity inspection apparatus and continuity inspection method
03/14/2013WO2013035021A1 Method for manufacturing a component interconnect board
03/14/2013WO2013035017A1 Method for manufacturing a led matrix and a device comprising a led matrix
03/14/2013WO2013034490A1 A lighting device and an encapsulation method therefor
03/14/2013WO2013034128A2 Conductor track unit for a motor vehicle
03/14/2013WO2013033932A1 Wet etching device and method
03/14/2013WO2012161517A3 Flexible printed circuit board and manufacturing method thereof
03/14/2013US20130066194 Method for producing a miniature electromagnetic coil using flexible printed circuitry
03/14/2013US20130065450 Usb application device and method for assembling usb application device
03/14/2013US20130064991 Manufacturing method of flux gate sensor
03/14/2013US20130063916 Protection for Circuit Boards
03/14/2013US20130063907 Electronics apparatus and production method for an electronics apparatus
03/14/2013US20130063891 Reducing the border area of a device
03/14/2013US20130063798 Light source device, method of assembling light source device, optical scanning device, and image forming apparatus
03/14/2013US20130063314 Mobile wireless communications device including a slot antenna and related methods
03/14/2013US20130063217 Surface-mounted crystal oscillator and manufacturing method thereof
03/14/2013US20130062993 Actuator and method for manufacturing the same
03/14/2013US20130062210 Manufacturing method of substrate and manufacturing method of wiring substrate
03/14/2013US20130062179 Touch panel having a shielding structure and method of manufacturing the same
03/14/2013US20130062119 Laminated glass pane with electrical function and connection element
03/14/2013US20130062108 Wiring board and method of manufacturing the same
03/14/2013US20130062107 Multilayer wiring board and production method of the same
03/14/2013US20130062106 Printed Circuit Board and Method of Manufacturing the Same
03/14/2013US20130062102 Double-sided flexible printed circuit board and method of manufacturing the same
03/14/2013US20130062101 Multilayer wiring substrate, and manufacturing method for multilayer substrate
03/14/2013US20130062099 Multiple layer z-axis interconnect apparatus and method of use
03/14/2013US20130062091 Main housing element of a multi-part housing and method for assembling a housing
03/14/2013US20130061766 Screen printing machine
03/14/2013US20130061469 In situ flexible circuit embossing to form an electrical interconnect
03/14/2013US20130061468 Manufacturing method of package carrier
03/14/2013DE19615481C5 Gewölbtes Metall-Keramik-Substrat Corrugated metal-ceramic substrate
03/14/2013DE102011113259A1 Capacitor winding for use on carrier, has metal spraying front surface contacting on or close to free ends of tongues, and contact region pressed on and/or close to free ends of tongues against front surface in resilient manner
03/14/2013DE102011082537A1 Leiterplatte und elektrische Bauteile zum Einsatz in aggressiver Umgebung und Verfahren zur Herstellung einer solchen Leiterplatte Printed circuit board and electrical components for use in an aggressive environment and method of manufacturing such a printed circuit board
03/14/2013DE102011054961A1 Stapelsubstratmodul Substrate stack module
03/14/2013CA2850418A1 Conductor track unit for a motor vehicle
03/13/2013EP2568783A1 Electronic device, cable connection structure, and process for production of electronic device
03/13/2013EP2568782A1 Tool and method for embedding a module in a data carrier
03/13/2013EP2568780A1 Coiled magnetic ring
03/13/2013EP2568779A1 Device for electronic contacting of an optical display unit
03/13/2013EP2568301A1 Current sensor and printed circuit board for such a sensor
03/13/2013EP2568019A1 Inkjet ink
03/13/2013EP2567603A2 Method of fabricating micro structured surfaces with electrically conductive patterns
03/13/2013EP2567602A2 Method for introducing electrical insulations in printed circuit boards
03/13/2013EP2567601A1 Method for partially stripping a defined area of a conductive layer
03/13/2013EP2567421A1 Composite electrode and method of manufacture thereof
03/13/2013EP2567105A2 Pick and bond method and apparatus for transferring adhesive element to substrate
03/13/2013EP2567104A2 Pick and bond method for attachment of adhesive element to substrate
03/13/2013EP2567103A2 Method and apparatus for placing adhesive element on a matrix
03/13/2013CN202799421U Improved structure of steel mesh and scraper sheet for thickening solder paste of part of PCB pad
03/13/2013CN202799420U Six-head light-emitting diode (LED) chip mounter
03/13/2013CN202799419U Chip mounter suction nozzle
03/13/2013CN202799418U Dedicated glue adding tool for printing type glue adding method
03/13/2013CN202799417U Double-track Surface Mount Technology (SMT) production line feeding device
03/13/2013CN202799416U Automatic chip mounter
03/13/2013CN202799415U Waste material tape processing unit of chip mounter
03/13/2013CN202799414U Chip mounter
03/13/2013CN202799413U Chip mounter
03/13/2013CN202799412U 01005 suction nozzle with spring
03/13/2013CN202799411U Multi-tube suction nozzle
03/13/2013CN202799410U Hot press with silica gel belt drive reel
03/13/2013CN202799409U Pressure head for touch screen pasting machine
03/13/2013CN202799408U Auxiliary device for achieving consistent printed circuit board (PCB) dual-surface exposure
03/13/2013CN202799407U Dustproof support frame for manual alignment exposure of circuit board