| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/21/2013 | WO2013038606A1 Laser processing device and laser processing method |
| 03/21/2013 | WO2013038468A1 Method for manufacturing substrate with built-in component and substrate with built-in component using same |
| 03/21/2013 | WO2013038456A1 Device and method for reflow soldering |
| 03/21/2013 | WO2013037698A1 Circuit board and electrical components for use in an aggressive environment and method for producing such a circuit board |
| 03/21/2013 | WO2012150817A3 Printed circuit board and method for manufacturing the same |
| 03/21/2013 | WO2012150777A3 The printed circuit board and the method for manufacturing the same |
| 03/21/2013 | WO2010142274A3 Screen printing frame |
| 03/21/2013 | US20130072067 Printed circuit board and wiring method of printed circuit board |
| 03/21/2013 | US20130071615 Substrates and Method of Preparing the Same |
| 03/21/2013 | US20130071064 Device for converting signal |
| 03/21/2013 | US20130070434 Dye-based circuit mount testing |
| 03/21/2013 | US20130070385 Stacked structure and method of manufacturing the same |
| 03/21/2013 | US20130069683 Test probe card |
| 03/21/2013 | US20130069680 Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use therof |
| 03/21/2013 | US20130069639 Flexible Magnetostrictive Sensor |
| 03/21/2013 | US20130069251 Wiring substrate, method of manufacturing the same, and semiconductor device |
| 03/21/2013 | US20130069087 Multi-layer wiring substrate, active matrix substrate, image display apparatus using the same, and multi-layer wiring substrate manufacturing method |
| 03/21/2013 | US20130068754 Variable watt density layered heater |
| 03/21/2013 | US20130068723 Method of Using a Mask to Provide a Patterned Substrate |
| 03/21/2013 | US20130068603 Touch panel using a metal thin film, and method for manufacturing same |
| 03/21/2013 | US20130068516 High io substrates and interposers without vias |
| 03/21/2013 | US20130068513 Wiring board, production method of the same, and via paste |
| 03/21/2013 | US20130068511 System and method for formation of electrical conductors on a substrate |
| 03/21/2013 | US20130068509 Method and apparatus for connecting inlaid chip into printed circuit board |
| 03/21/2013 | US20130068505 Perforated mother sheet for partial edge chemical strengthening |
| 03/21/2013 | US20130068020 Combined Sensor and Method for Manufacturing the Same |
| 03/21/2013 | US20130067742 Process for producing multilayer printed wiring board |
| 03/21/2013 | US20130067741 Neutron detector and method of making |
| 03/21/2013 | US20130067740 Weld gun part clamp device and method |
| 03/21/2013 | DE102012215593A1 System und Verfahren zum Bilden von elektrischen Leitern auf einem Substrat System and method for forming electrical conductors on a substrate |
| 03/21/2013 | DE102011113929A1 Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing |
| 03/21/2013 | DE102011113656A1 Mehrlagige elektrische Leiterplatte Multi-layer electrical circuit board |
| 03/21/2013 | DE102011113523A1 Electronic component group, useful in cash control unit, comprises memory card with electrical pad, and printed circuit board with electrical contact surface, where electrical conductive connection is formed between pad and contact surface |
| 03/21/2013 | DE102011082971A1 Printed circuit board manufacturing method, involves applying printed circuit board protection coating with base composition and viscosity-increasing additive on current-carrying portion of printed circuit board |
| 03/21/2013 | DE102011082945A1 Elektronische leiterplatte und verfahren zur herstellung einer leiterplatte Electronic circuit board and method for manufacturing a printed circuit board |
| 03/21/2013 | DE102009028865B4 Vakuum-Reflowlötanlage Vacuum reflow soldering |
| 03/20/2013 | EP2571342A1 Method of manufacturing metal-base substrate and method of manufacturing circuit board |
| 03/20/2013 | EP2571341A1 Method for producing reuse paste and reuse paste |
| 03/20/2013 | EP2571340A1 Method for producing circuit board |
| 03/20/2013 | EP2571339A2 Thin electronic device comprising a conductive member |
| 03/20/2013 | EP2570262A1 Stencil for printing solder paste on printed circuit board |
| 03/20/2013 | EP2570261A1 Fixing frame and assembled fixing device for printing solder paste on printed circuit board |
| 03/20/2013 | EP2570007A1 Method of manufacture of flexible printed circuits |
| 03/20/2013 | EP2569577A1 High intensity led replacement of incandescent lamps |
| 03/20/2013 | EP2503029B1 Process for etching a recessed structure filled with tin or a tin alloy |
| 03/20/2013 | CN202818864U An element installation line |
| 03/20/2013 | CN202818863U A component assembling production line |
| 03/20/2013 | CN202818782U Flexible circuit board support fixture |
| 03/20/2013 | CN202818781U Mounting head apparatus for multifunctional heterotype chip mounter |
| 03/20/2013 | CN202818780U Mounting head structure for multifunctional heterotype chip mounter |
| 03/20/2013 | CN202818779U Circuit board conveying apparatus for multifunctional heterotype chip mounter |
| 03/20/2013 | CN202818778U X-Y motion mechanism for multifunctional heterotype chip mounter |
| 03/20/2013 | CN202818777U Top board apparatus for multifunctional heterotype chip mounter |
| 03/20/2013 | CN202818776U System for surface mounting and conveying of electronic device |
| 03/20/2013 | CN202818775U Intelligent mounting system |
| 03/20/2013 | CN202818774U Full-automatic surface mounting system |
| 03/20/2013 | CN202818773U Accurate-control surface mounting system |
| 03/20/2013 | CN202818772U Suspended scaffold of PCB copper deposition |
| 03/20/2013 | CN202818771U Efficient vertical board feeding device used during OSP processing process of FPC soft board |
| 03/20/2013 | CN202818770U PCB lamination board-disassembling rapid stabilization and cooling device |
| 03/20/2013 | CN202818769U Reinforcing machine |
| 03/20/2013 | CN202818768U Material detecting and collecting device |
| 03/20/2013 | CN202816556U Fixed base of filter inductor |
| 03/20/2013 | CN202808980U Electroplating assistant plate, and electroplating equipment using same |
| 03/20/2013 | CN202804424U Tin separating piece capable of preventing tin connection short circuit |
| 03/20/2013 | CN202804423U Temperature-back device of soldering paste |
| 03/20/2013 | CN202804410U Soldering mechanism and automatic solder repairing machine provided with same |
| 03/20/2013 | CN1784807B Coaxial waveguide microstructures and forming method |
| 03/20/2013 | CN102986314A Laminated wiring board and manufacturing method for same |
| 03/20/2013 | CN102986313A Wiring substrate having built-in component |
| 03/20/2013 | CN102986312A Wiring board manufacturing method |
| 03/20/2013 | CN102986311A The printed circuit board and the method for manufacturing the same |
| 03/20/2013 | CN102986310A Flexible wiring board, dry film for coverlay, and production method for flexible wiring board |
| 03/20/2013 | CN102986053A An OLED device and a method of manufacturing the same |
| 03/20/2013 | CN102986024A Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both |
| 03/20/2013 | CN102984892A Hole metallization method of circuit board with high thickness-to-radius ratio, circuit board and electronic product |
| 03/20/2013 | CN102984891A Electronic device convenient to weld and position |
| 03/20/2013 | CN102984890A Positioning structure and positioning method for component placement |
| 03/20/2013 | CN102984889A Method used for assembling printed circuit board |
| 03/20/2013 | CN102984888A Method of partially replacing flexible printed circuit board cover film with flexible printed circuit board grease |
| 03/20/2013 | CN102984887A 三维线路结构及其制造方法 Three dimensional wiring structure and manufacturing method |
| 03/20/2013 | CN102984886A Two-sided flexible printed circuit (FPC) roll-type material-receiving production process |
| 03/20/2013 | CN102984885A Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
| 03/20/2013 | CN102984883A Structure capable of avoiding cold solder joint of elements and method thereof |
| 03/20/2013 | CN102984880A Metal dome packing pad structure, printed circuit board (PCB) and manufacturing method of the PCB |
| 03/20/2013 | CN102983113A Package systems including passive electrical components |
| 03/20/2013 | CN102981366A Solder-resistance composite and application to printed circuit board |
| 03/20/2013 | CN102981357A Photosensitive resin composition, and photosensitive element, and resist pattern formation method |
| 03/20/2013 | CN102978673A Improved structure of water injection holes of electroplating saddle of printed circuit board |
| 03/20/2013 | CN102975429A Electrolytic copper-clad plate by taking polymethyl methacrylate as medium, printed circuit board and manufacturing method thereof |
| 03/20/2013 | CN102974964A Method for fixing printed circuit board (PCB) with mark point location function |
| 03/20/2013 | CN102974912A Welding fixture |
| 03/20/2013 | CN102974584A Substrate cleaning device for electronic product |
| 03/20/2013 | CN102974561A Electronic product substrate washing equipment with inclined protection cover |
| 03/20/2013 | CN102378499B Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| 03/20/2013 | CN102301837B Multi-layer circuit board and manufacturing method thereof |
| 03/20/2013 | CN102300416B Decontamination anti-crease wiping golden finger jig |
| 03/20/2013 | CN102281725B Manufacturing method for circuit board |
| 03/20/2013 | CN102281719B Method for carrying out surface processing on electronic circuit board by developing machine after welding prevention processing |
| 03/20/2013 | CN102271463B Manufacturing method for circuit board |