| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/03/2013 | CN103025147A Production line and substrate checking method |
| 04/03/2013 | CN103025130A Integrated multifunctional alumina ceramic electronic refrigeration radiator and production method thereof |
| 04/03/2013 | CN103025089A Housing of electronic device and manufacturing method of housing |
| 04/03/2013 | CN103025086A PCB (printed circuit board) plasma treatment method |
| 04/03/2013 | CN103025085A Copper deposition method for double-faced aluminum substrate |
| 04/03/2013 | CN103025084A Solder resist plug hole air guide tool and manufacturing method thereof |
| 04/03/2013 | CN103025083A Manufacturing method of substrate, manufacturing method of wiring substrate, glass substrate and wiring substrate |
| 04/03/2013 | CN103025082A Method for manufacturing printed circuit board and printed circuit board structure |
| 04/03/2013 | CN103025081A Manufacturing method of rigid-flex combined printed circuit board |
| 04/03/2013 | CN103025080A Method for connecting printed circuit boards |
| 04/03/2013 | CN103025079A Permanent fixation method of embedded subscriber identity module (SIM) in global positioning system (GPS) |
| 04/03/2013 | CN103025078A Manufacturing method of printed wiring substrate device |
| 04/03/2013 | CN103025077A Full-automatic PCB (printed circuit board) positioning clamp |
| 04/03/2013 | CN103025076A Flexible circuit board bonding device and method for bonding flexible circuit board |
| 04/03/2013 | CN103025075A High-speed mounted head |
| 04/03/2013 | CN103025074A Method for improving contact reliability of printed circuit board (PCB) testing points |
| 04/03/2013 | CN103025073A Three proofing method of firefighting electronic product printed circuit board (PCB) through matched electronic wax |
| 04/03/2013 | CN103025072A Novel process for manufacturing low-resistance and high-continuity carbon oil silk-screen printing of circuit board |
| 04/03/2013 | CN103025071A System and method for formation of electrical conductors on a substrate |
| 04/03/2013 | CN103025070A Outer line etching method of PCB (Printed Circuit Board) board with PTH (Plated Through Hole) inter-hole clamping line |
| 04/03/2013 | CN103025069A Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
| 04/03/2013 | CN103025068A Method for manuracturing printed circuit board with via and fine pitch circuit and printed circuit board by the same method |
| 04/03/2013 | CN103025067A Method for increasing board utilization rate during manufacture of PCB (printed circuit board) |
| 04/03/2013 | CN103025066A Single-sided double-layer metal-base plate manufacture method |
| 04/03/2013 | CN103025065A Pressing and glue-filling method of circuit board |
| 04/03/2013 | CN103025064A Circuit board contraposition method |
| 04/03/2013 | CN103025063A Circuit board machining process capable of preventing oil overflowing |
| 04/03/2013 | CN103025062A Circuit board wedge angle region forming method |
| 04/03/2013 | CN103025061A Method for preparing printed circuit board and printed circuit board |
| 04/03/2013 | CN103025060A Preparation method of three-dimensional connecting device |
| 04/03/2013 | CN103025057A Wiring substrate and method of manufacturing the same |
| 04/03/2013 | CN103025056A Multichip typesetting substrate and manufacturing method thereof |
| 04/03/2013 | CN103025055A Printed wiring board and a method of production thereof |
| 04/03/2013 | CN103025054A Printed circuit board, mount structure thereof, and methods of producing these |
| 04/03/2013 | CN103025051A High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof |
| 04/03/2013 | CN103025050A Multilayer printed circuit board and manufacturing method thereof |
| 04/03/2013 | CN103009713A Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
| 04/03/2013 | CN103009185A Radiating device and radiating method of aluminum substrate end-mill |
| 04/03/2013 | CN103008820A Flow choking device for wave soldering nozzle |
| 04/03/2013 | CN103008818A Automatic welding device |
| 04/03/2013 | CN102325426B Circuit board fabrication method for laminating asymmetric light guide panel on outer layer of multilayer panel again |
| 04/03/2013 | CN102316682B Method for processing multi-layer PCB (printed circuit board) |
| 04/03/2013 | CN102281726B Multilayer circuit board method with high density interconnection and high reliability combination |
| 04/03/2013 | CN102281717B Manufacture method for base plate of high frequency circuit module |
| 04/03/2013 | CN102202470B Multilayer circuit board and making method |
| 04/03/2013 | CN102186313B SMT (Surface Mounted Technology) circuit board quality monitoring method |
| 04/03/2013 | CN102170747B Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board |
| 04/03/2013 | CN102084731B Printed wiring board and method for manufacturing same |
| 04/03/2013 | CN102006734B Chamfering process for connector in board |
| 04/03/2013 | CN101998755B Multilayer circuit board and manufacturing method thereof |
| 04/03/2013 | CN101986770B Multi-order high-density circuit board registration hole and manufacturing method thereof |
| 04/03/2013 | CN101945533B Circuit substrate |
| 04/03/2013 | CN101917819B Printed wiring board |
| 04/03/2013 | CN101874429B Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component |
| 04/02/2013 | US8410373 Printed circuit substrate and method of manufacturing the same |
| 04/02/2013 | US8409461 Method of manufacturing printed wiring board with component mounting pin |
| 04/02/2013 | US8408356 Storage box for electronic apparatus |
| 04/02/2013 | US8407890 Method of manufacting an electronic device module with integrated antenna structure |
| 04/02/2013 | US8407889 Component mounting condition determination method |
| 04/02/2013 | US8407888 Method of assembling a circuit board assembly |
| 04/02/2013 | US8407871 Method of manufacturing a shapeable short-resistant capacitor |
| 04/02/2013 | CA2729740C Embedded rf vertical interconnect for flexible conformal antenna |
| 04/02/2013 | CA2415810C Method of schematic-level ams topology optimization using direct representations |
| 03/28/2013 | WO2013044002A1 Method to make a multilayer circuit board with intermetallic compound and related circuit boards |
| 03/28/2013 | WO2013043435A1 A composition for preparing a bonding material and uses thereof |
| 03/28/2013 | WO2013043434A2 A method, system for manufacturing a circuit board, and the circuit board thereof |
| 03/28/2013 | WO2013042750A1 Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board |
| 03/28/2013 | WO2013042749A1 Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board |
| 03/28/2013 | WO2013042748A1 Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board |
| 03/28/2013 | WO2013042582A1 Desmear solution and desmear method |
| 03/28/2013 | WO2013041379A1 Electronic printed circuit board and method for producing a printed circuit board |
| 03/28/2013 | WO2013040689A1 Method and apparatus for connecting inlaid chip into printed circuit board |
| 03/28/2013 | WO2013017466A9 Optoelectronic component and method for producing an optoelectronic component |
| 03/28/2013 | WO2012143923A3 System and method for additive manufacturing of an object |
| 03/28/2013 | WO2012075344A3 Improved adhesive film layer for printed circuit board applications |
| 03/28/2013 | US20130078825 Method for connecting printed circuit boards |
| 03/28/2013 | US20130078408 Segmentable wiring board and method for producing the same, and wiring substrate and method for producing the same |
| 03/28/2013 | US20130078367 Adhesion promotion in printed circuit boards |
| 03/28/2013 | US20130077270 Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same |
| 03/28/2013 | US20130077267 Power board, method of manufacturing the same and liquid crystal display apparatus having the same |
| 03/28/2013 | US20130077264 Sealed Overmolded Circuit Board With Sensor Seal and Edge Connector Seal and Production Method Of The Same |
| 03/28/2013 | US20130077262 Module board and manufacturing method thereof |
| 03/28/2013 | US20130076268 Organic light-emitting display apparatus and method of manufacturing the same |
| 03/28/2013 | US20130075946 Method of fabricating micro structured surfaces with electrically conductive patterns |
| 03/28/2013 | US20130075146 Manufacturing method of substrate, manufacturing method of wiring substrate, glass substrate and wiring substrate |
| 03/28/2013 | US20130075145 Wiring substrate and method of manufacturing the same |
| 03/28/2013 | US20130075144 Package substrate with mesh pattern and method for manufacturing the same |
| 03/28/2013 | US20130075143 Electronic component module and its manufacturing method |
| 03/28/2013 | US20130075141 Wiring substrate and method of manufacturing the same |
| 03/28/2013 | US20130075137 Method to make a multilayer circuit board with intermetallic compound and related circuit boards |
| 03/28/2013 | US20130075135 Printed circuit board and manufacturing method thereof |
| 03/28/2013 | US20130074593 Flow sensor, mass flow controller, and method for manufacturing flow sensor |
| 03/28/2013 | US20130074332 Method of manufacturing wiring substrate having built-in component |
| 03/28/2013 | US20130074330 Cell attachment method |
| 03/28/2013 | US20130074329 Mounting apparatus, electronic component mounting method, substrate production method, and program |
| 03/28/2013 | DE102012206403B3 Plant, useful to solder first pair of workpieces and second pair of workpieces, includes heating unit, first positioning unit by which first spacing of first pair of workpieces is adjustable from heating unit, and second positioning unit |
| 03/28/2013 | DE102011115658A1 Electronic device has main soldering surface structure whose section is partially matched with auxiliary soldering surface structure on which electronic component is mounted |
| 03/28/2013 | DE102011083627A1 Method for connecting electronic part e.g. transistor, involves applying electrical conductive layer for electrically connecting electrical contact surface of electronic part with electrical strip conductor, and applying covering layer |
| 03/28/2013 | DE102011083620A1 Printed circuit board for control unit for transmission of vehicle, has seal portion that is attached to cover portion, for sealing the device region which is provided for mounting electronic components on main surface |
| 03/28/2013 | CA2849865A1 Method and apparatus for connecting inlaid chip into printed circuit board |