| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/10/2013 | CN103037626A Circuit board surface treatment method by electroplating process |
| 04/10/2013 | CN103037625A Short circuit removing method of printed circuit board with chip window |
| 04/10/2013 | CN103037624A Method of eliminating electroplate lead on ceramic substrate |
| 04/10/2013 | CN103037623A Printed circuit board (PCB) forming method |
| 04/10/2013 | CN103037618A Method for manufacturing multi-piece substrate and multi-piece substrate |
| 04/10/2013 | CN103037616A Combined type circuit board and producing method thereof |
| 04/10/2013 | CN103037615A Printed circuit board and formation method thereof |
| 04/10/2013 | CN103035597A Interposer, circuit board module, and method for manufacturing interposer |
| 04/10/2013 | CN103034266A Temperature control system and method for reflow soldering machine |
| 04/10/2013 | CN103034146A Method for controlling X-Ray punch |
| 04/10/2013 | CN103028802A Temperature control method for reflow welding machine |
| 04/10/2013 | CN102387659B Printed circuit board and production method thereof |
| 04/10/2013 | CN102238809B Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
| 04/10/2013 | CN102231940B Packaging method of circuit board and liquid level sensor device using same |
| 04/10/2013 | CN102186311B Circuit board and processing method thereof |
| 04/10/2013 | CN102186310B Locating method and device |
| 04/10/2013 | CN102088823B Printed wiring board and method for producing the same |
| 04/10/2013 | CN102083281B Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device |
| 04/10/2013 | CN102050337B Plate and diaphragm gripping device and method thereof |
| 04/10/2013 | CN101990368B Printed circuit board manufacturing equipment and manufacturing method of printed circuit board |
| 04/10/2013 | CN101926235B Non-etching non-resist adhesion composition and method of preparing work piece |
| 04/10/2013 | CN101847585B Wiring tracing device and wiring tracing method |
| 04/10/2013 | CN101807001B Photosensitive resin composition and application thereof |
| 04/10/2013 | CN101673887B Improved matched-impedance surface-mount technology footprints |
| 04/10/2013 | CN101662896B Method for manufacturing printed wiring board |
| 04/10/2013 | CN101583243B Wired circuit board and producing method thereof |
| 04/10/2013 | CN101452102B Reduced-component digital image capturing apparatus and assembly method thereof |
| 04/10/2013 | CN101445933B Etchant |
| 04/09/2013 | US8415567 Forming soldering surfaces without requiring a solder mask |
| 04/09/2013 | US8415002 Method of manufacturing a circuit board |
| 04/09/2013 | US8414785 Methods for fabrication of microfluidic systems on printed circuit boards |
| 04/09/2013 | US8413323 Method for high-frequency tuning an electrical device |
| 04/09/2013 | US8413322 Component mounting apparatus, component mounting head, and component mounting method |
| 04/09/2013 | US8413321 Module substrate and production method |
| 04/04/2013 | WO2013049061A1 Systems and methods for void reduction in a solder joint |
| 04/04/2013 | WO2013048834A1 Methods of continuously wet etching a patterned substrate |
| 04/04/2013 | WO2013048473A1 Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process |
| 04/04/2013 | WO2013048419A1 LAMP WITH MULTIPLE FLEXIBLE OLEDs |
| 04/04/2013 | WO2013047848A1 Wiring substrate, component embedded substrate, and package sructure |
| 04/04/2013 | WO2013047847A1 Copper foil for printed circuit board and laminated plate using same |
| 04/04/2013 | WO2013047726A1 Insulating adhesive film, prepreg, laminate, cured product, and composite body |
| 04/04/2013 | WO2013047532A1 Substrate-transporting carrier and method for manufacturing same |
| 04/04/2013 | WO2013047520A1 Component embedded substrate mounting body, method for manufacturing same and component embedded substrate |
| 04/04/2013 | WO2013047508A1 Process for producing layered object with holes, layered object with holes, process for producing multilayered substrate, and composition for forming primer layer |
| 04/04/2013 | WO2013047305A1 Photosensitive resin composition, and dry film resist |
| 04/04/2013 | WO2013047272A1 Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil |
| 04/04/2013 | WO2013047137A1 Electronic device, joining material, and method for producing electronic device |
| 04/04/2013 | WO2013047056A1 Copper foil for lamination |
| 04/04/2013 | WO2013046859A1 Wiring inspecting method, wiring inspecting apparatus, wiring inspecting program, and recording medium |
| 04/04/2013 | WO2013046680A1 Circuit device |
| 04/04/2013 | WO2013046542A1 Electronic component mounting system |
| 04/04/2013 | WO2013046500A1 Method for manufacturing electronic component module |
| 04/04/2013 | WO2013046450A1 Solder piece, chip solder, and method for manufacturing solder piece |
| 04/04/2013 | WO2013046442A1 Substrate and method for manufacturing same |
| 04/04/2013 | WO2013046441A1 Substrate manufacturing method |
| 04/04/2013 | WO2013045222A1 Contact spring arrangement and method for producing same |
| 04/04/2013 | WO2013045207A1 Screen stencil and a method for coating screen stencils |
| 04/04/2013 | WO2012175207A3 Electronic assembly and method for the production thereof |
| 04/04/2013 | US20130084405 Method for forming circuits on housing by spraying and laser engraving |
| 04/04/2013 | US20130083503 Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure |
| 04/04/2013 | US20130083499 Circuit board unit, cartridge, and manufacturing method thereof |
| 04/04/2013 | US20130083492 Power module package and method of manufacturing the same |
| 04/04/2013 | US20130083473 Extended capacity memory system with load relieved memory and method of manufacture thereof |
| 04/04/2013 | US20130083239 Folded tape package for electronic devices |
| 04/04/2013 | US20130082575 Multilayer ceramic electronic component and manufacturing method thereof |
| 04/04/2013 | US20130081870 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 04/04/2013 | US20130081863 Substrate with built-in electronic component and method for manufacturing the same |
| 04/04/2013 | US20130081862 Wiring substrate and method of manufacturing the same |
| 04/04/2013 | US20130081861 Printed circuit board, mount structure thereof, and methods of producing these |
| 04/04/2013 | US20130081860 Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board |
| 04/04/2013 | US20130081859 Multilayer Circuit Board and Manufacturing Method Thereof |
| 04/04/2013 | US20130081857 Method for manufacturing multi-piece substrate and multi-piece substrate |
| 04/04/2013 | US20130081268 Method for manufacturing base film including printed circuit films and apparatus for blanking the printed circuit film |
| 04/04/2013 | US20130081267 Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board |
| 04/04/2013 | US20130081266 Stackable electronic component |
| 04/04/2013 | DE10295940B4 Verfahren zur Herstellung einer Halbleitereinrichtung mit einem plattenförmigen Schaltungsblock A method of manufacturing a semiconductor device with a plate-shaped circuit block |
| 04/04/2013 | DE102011083926A1 Schichtverbund aus einer Trägerfolie und einer Schichtanordnung umfassend eine sinterbare Schicht aus mindestens einem Metallpulver und eine Lotschicht Layer composite of a carrier film and a layer arrangement comprising a sinterable layer of at least one metal powder and a solder layer |
| 04/04/2013 | DE102011083906A1 Fügehilfe für ein Leistungsmodul Joining aid for a power module |
| 04/04/2013 | DE102011083899A1 Schichtverbund zum Verbinden von elektronischen Bauteilen umfassend eine Ausgleichsschicht, Anbindungsschichten und Verbindungsschichten Layer composite including, for connecting electronic components, a leveling layer, link layer and link layer |
| 04/04/2013 | DE102011083776A1 Contact pin for plug connector in contact pin and circuit board assembly of electric drive, has contact extension that differs from first storage area for mechanical support of contact pin on circuit board |
| 04/04/2013 | DE102011083733A1 Siebdruckschablone und Verfahren zum Beschichten von Siebdruckschablonen Screen printing stencil and process for coating printing stencils |
| 04/04/2013 | DE102011054105A1 Connecting conductor plate for electrically and mechanically connecting two printed circuit boards in linear magnetic field sensor, has contacts for connecting with contact surfaces of boards that are arranged surface-parallel to each other |
| 04/04/2013 | CA2850240A1 Screen stencil and a method for coating screen stencils |
| 04/04/2013 | CA2849459A1 Systems and methods for void reduction in a solder joint |
| 04/03/2013 | EP2420593B1 Metalized Plastic Articles and Methods Thereof |
| 04/03/2013 | CN202857225U Electronic part mounting device |
| 04/03/2013 | CN202857154U Silicon steel foil for stitching of printed circuit board |
| 04/03/2013 | CN202857153U OLED flexible printed circuit board vacuum adsorption device |
| 04/03/2013 | CN202857152U Pin-inserting mechanism |
| 04/03/2013 | CN202857151U SMT printed circuit board printing tool |
| 04/03/2013 | CN202857150U Auxiliary structure for aligning precision tests of LED (Light-Emitting Diode) light bar |
| 04/03/2013 | CN202857149U Printed circuit board processing system |
| 04/03/2013 | CN202857141U Blind hole conduction double-face circuit board |
| 04/03/2013 | CN202849571U Novel sheet copper depositing sub-basket |
| 04/03/2013 | CN1947479B Method and apparatus for accurately applying structures to a substrate |
| 04/03/2013 | CN103026806A Substrate structure for vehicle-mounting electronic device |
| 04/03/2013 | CN103026804A Optoelectronic lighting module and motor vehicle headlight |
| 04/03/2013 | CN103026563A Printed circuit board with partial housing encapsulated in a pressure-resistant manner |
| 04/03/2013 | CN103026299A Method and apparatus for performing pattern alignment |
| 04/03/2013 | CN103026242A Inspection jig and contact |